• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.6 s.111
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• pp.627-633
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• 2006

The tire is considered as one of the important noise sources having an influence on vehicle's performance. The Pattern noise of a tire is the transmission sound of airborne noise. On smooth asphalt road, Pattern noise is amplified with the velocity. In recent, the study on the reduction of Pattern noise is energetically processed. Pattern noise is strongly related with pitch sequence. To reduce the pattern noise, tire's designer has to randomize the sequence of pitch. The FFT is a traditional method to evaluate the level of the randomization of the pitch sequence, but gives no information on time-varying, instantaneous frequency. In the study, we found that Time-Frequency transform is a useful method to non-stationary signal such as tire noise.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.2
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• pp.177-186
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• 2012

In this paper, we propose a design method that the crosstalk of probe connector pins satisfy the limitation of -30 dB. The parameters(inductance and capacitance) were extracted in the grid-structured probe connector pin system, and it is shown that the new parameters are easily calculated with increasing ground pin numbers using the previously calculated parameters. In addition, the crosstalk reduction algorithm by employing more grounds around the signal pin has been suggested, and it is confirmed that the suggested method is quite effective especially for the reduction of inductive couplings. Finally, we suggested the correlation between the pitch and the length of the pins to satisfy the crosstalk limitation of -30 dB with the given number of ground pins, which will be quite useful when design a probe connector pin system.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.1
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• pp.46-53
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• 2008

Ultrasonic C-scan technique is one of very popular techniques being used for detection of flaws in polymer matrix composite(PMC). However, the application of this technique is very limited for evaluation of defects in PMC fabricated by the automated fiber placement process. The purpose of this study is to develop a novel ultrasonic hybrid system based on nondestructive and non-contact ultrasonic techniques for evaluation of delamination in carbon/epoxy and carbon/PPS composite laminates. It was shown that the newly developed ultrasonic hybrid system based on dual air-coupled pitch-catch technique with ultrasonic scattering reflection concept could provide excellent image with higher resolution of delamination in PMC compared with the conventional pitch-catch method. It is expected that this ultrasonic hybrid technique can be applied for on-line inspection of flaws in PMC during the fabrication process.

• Journal of Korean Society of Steel Construction
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• v.25 no.5
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• pp.463-474
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• 2013

Many experimental and numerical researches for thin-walled carbon steel and austenitic stainless steel single shear bolted connections have been conducted and the modified design equations of ultimate strength were proposed. In this study, the tests of double shear bolted connections with bolt arrangements ($2{\times}1$, $2{\times}2$) and end distance parallel to the loading direction as main variables were performed. Specimens were planed with a constant dimension of edge distance perpendicular to the loading direction, bolt diameter, pitch and gauge like single shear bolted connections. The test results such as ultimate strength and fracture mode were compared with those of current design standards. Furthermore, modified block shear equations for double shear bolted connections were suggested.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.4
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• pp.179-185
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• 2008

The purpose of this paper is to propose a systematic method on the weld pitch design of a vehicle sub-frame considering the fatigue life of spot welding points. The input data, which perform the fatigue analysis on the spot welding nuggets, are obtained by both the dynamic analysis of the multi-body vehicle model passing through the virtual proving ground of a typical Belgian road and the quasi-static analysis with the finite element model of the vehicle sub-frame. By utilizing the life cycle data obtained from the fatigue analysis, the welding points to perform the pitch change are determined. The sensitivity analysis on the fatigue life of the welding points is carried out by using the three-level orthogonal array design, and through the results of the sensitivity analysis, the best combination on the welding pitch is determined. This study shows that as compared with the baseline design, the sub-frame redesigned by the proposed technique improves the fatigue life about 7 percent while reducing the number of welding points about 19 percent.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• The KSFM Journal of Fluid Machinery
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• v.16 no.6
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• pp.40-47
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• 2013

In this paper, a numerical study was performed to investigate the performance characteristics of a pre-heater. The effects of fin pitch and fin array type(in-line, staggered, leaned array) were reported in terms of Colburn j-factor and Fanning friction factor f, as a function of Re. Three-dimensional numerical simulation has been performed by using flow analysis program, FLUENT 13.0. The results show that Colburn j-factor decreases with the decrease of fin pitch attached in the annular tube. But the fin pitch has little effect on f-factor. The staggered array and leaned array show improved heat transfer performance compared with in-line array, so that Colburn j-factor was increased. It also shows that the f-factor of leaned array is the highest in the studied range of Reynolds number.

• Solar Energy
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• v.17 no.4
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• pp.45-56
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• 1997

The purpose of this research was to study the characteristics of heat transfer of snow removing facilities using heat pipe by experimental method. Heat pipes was constructed a flexible tube connected between evaporator and condenser ends for altitude adjustment of evaporator and it was constituted an internal diameter of 25.4mm, a length of 950mm for heating section and a length of 6000mm for condenser section with copper material for closed system. The results showed that the effect of heat transfer was increased when inclination angle and inlet temperature of heating water increased. Wall temperature response by inclined angle $4.5^{\circ}c-9^{\circ}c$ and working fluid amount 0.96 from to 1.3 times of evaporator volume were better than those of other working fluid and angle.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.11
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• pp.1-5
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• 2010

We developed a novel micro-electro mechanical systems (MEMS) test socket using silicon on insulator (SOI) substrate with the cantilever array structure. We designed the round shaped cantilevers with the maximum length of $350{\mu}m$, the maximum width of $200{\mu}m$ and the thickness of $10{\mu}m$ for $650{\mu}m$ pitch for 8 mm x 8 mm area and 121 balls square ball grid array (BGA) packages. The MEMS test socket was fabricated by MEMS technology using metal lift off process and deep reactive ion etching (DRIE) silicon etcher and so on. The MEMS test socket has a simple structure, low production cost, fine pitch, high pin count and rapid prototyping. We verified the performances of the MEMS test sockets such as deflection as a function of the applied force, path resistance between the cantilever and the metal pad and the contact resistance. Fabricated cantilever has 1.3 gf (gram force) at $90{\mu}m$ deflection. Total path resistance was less than $17{\Omega}$. The contact resistance was approximately from 0.7 to $0.75{\Omega}$ for all cantilevers. Therefore the test socket is suitable for BGA integrated circuit (IC) packages tests.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.4
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• pp.417-424
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• 2011

Natural convection heat transfer experiments from two parallel horizontal cylinders were performed varying the Pitch-to-Diameter ratio (P/D) of 1.02-9 at Sc of 2,014 to 8,334 and $Ra_D$ of $1.5{\times}10^8$ to $4.5{\times}10^{10}$. Mass transfer experiments that are analogous to the heat transfer experiments were performed using copper electroplating system. In all cases, the measured heat transfer rates for the lower cylinder agreed well with the existing heat transfer correlations developed from a single cylinder. For laminar flows, the measured heat transfer rates of the upper cylinder were less than those of the lower cylinder at P/D less than about 1.5. However, as the P/D increased, the heat transfer rates of the upper cylinder increased. For turbulent flows, the heat transfer rates of the upper cylinder were considerably similar to those of the lower cylinder when the P/D is approximately unity. In contrast, as the P/D increased, the heat transfer rates of the upper cylinder were always higher than those of the lower cylinder.