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Fabrication of MEMS Test Socket for BGA IC Packages  

Kim, Sang-Won (Kyungpook National University, School of Electrical Engineering and Computer Science)
Cho, Chan-Seob (Kyungpook National University, School of Electrical Engineering)
Nam, Jae-Woo (CoreMEMS Inc.)
Kim, Bong-Hwan (CoreMEMS Inc.)
Lee, Jong-Hyun (Kyungpook National University, School of Electrical Engineering)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.47, no.11, 2010 , pp. 1-5 More about this Journal
Abstract
We developed a novel micro-electro mechanical systems (MEMS) test socket using silicon on insulator (SOI) substrate with the cantilever array structure. We designed the round shaped cantilevers with the maximum length of $350{\mu}m$, the maximum width of $200{\mu}m$ and the thickness of $10{\mu}m$ for $650{\mu}m$ pitch for 8 mm x 8 mm area and 121 balls square ball grid array (BGA) packages. The MEMS test socket was fabricated by MEMS technology using metal lift off process and deep reactive ion etching (DRIE) silicon etcher and so on. The MEMS test socket has a simple structure, low production cost, fine pitch, high pin count and rapid prototyping. We verified the performances of the MEMS test sockets such as deflection as a function of the applied force, path resistance between the cantilever and the metal pad and the contact resistance. Fabricated cantilever has 1.3 gf (gram force) at $90{\mu}m$ deflection. Total path resistance was less than $17{\Omega}$. The contact resistance was approximately from 0.7 to $0.75{\Omega}$ for all cantilevers. Therefore the test socket is suitable for BGA integrated circuit (IC) packages tests.
Keywords
BGA package; test socket; cantilever;
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  • Reference
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