• Title/Summary/Keyword: 폴리머기판

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Polarized Light Emission of Liquid Crystalline Polymer Blends (액정성 고분자 블렌드의 편발광)

  • 김영철;조현남;김동영;홍재민;송남웅
    • Polymer(Korea)
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    • v.24 no.2
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    • pp.211-219
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    • 2000
  • Fluorene-based light emitting polymer blends with liquid crystalline characteristics were studied on effective energy transfer and dichroic characteristics. Incorporating 0.5 wt% of the non-liquid crystalline into the liquid crystalline polymer suppressed the PL emission at 420 nm on photoexcitation at 360 nm, but generated a new PL emission of the non-liquid crystalline polymer at 480 nm. The highest PL intensity at 480 nm, which was 13 times stronger than those of the two polymers before blending, was observed for a blend with 2.0 wt% of the non-liquid crystalline polymer. When the molecules of the blends were aligned on a rubbed polyimide surface by a heating-cooling process, the dichroic ratio and the order parameter were 2.0 and 0.25, respectively. Time-correlated single photon counting (TCSPC) study revealed that the time required for energy transfer between the two chromophores was shortened by 93 ps when the blends were aligned on the rubbed polyimide surface by the heating-cooling process. The thermal treatment also enhanced the energy transfer efficiency by 9%.

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Polymer Substrate Materials with Low Dielectric Loss Using Dicyclopentadienyl Bisphenol Cyanate Ester and Polyphenylene Ether (다이사이클로펜타다이에닐 비스페놀 시아네이트 에스터와 폴리페닐렌에테르를 이용한 저유전손실 고분자 기판 소재)

  • Kim, Dong-Kook;Park, Seong-Dae;Lee, Woo-Sung;Yoo, Myong-Jae;Park, Se-Hoon;Lim, Jin-Kyu;Kyoung, Jin-Bum
    • Polymer(Korea)
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    • v.31 no.6
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    • pp.474-478
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    • 2007
  • Polymer substrate materials with low dielectric loss were obtained by fabricating the composite using dicyclopentadienyl bisphenol cyanate ester oligomer and polyphenylene ether (PPE). From the analysis of the curing reaction of oligomer and catalyst, it was observed that the optimum amount of catalyst was 0.02 phr of Zn content. It was applied to the fabrication of polymer composite. By changing oligomer/PPE weight ratio, the peel strength and the gel content of the fabricated composites were measured, and then, the dielectric constant and the dissipation factor were measured in the GHz frequency range. The amount of PPE affected the peel strength and the dielectric properties of composites. However, the amount of catalyst did not affect them at all. Resulting from all experiments, we obtained polymer composite laminates haying the peel strength of above 1 kN/m and the low dissipation factor of 0.004 at 1 GHz.

Syntheses of Novel Sol-Gel Precursor Containing Anti-corrosive Functional Group and Their Uses in Organic-Inorganic Hybrid Coatings (내부식성이 우수한 졸-젤 전구체의 합성 및 이를 함유하는 유무기 하이브리드 코팅재)

  • Han, Mi-Jeong;Mang, Ji-Young;Seo, Ji-Yeon
    • Polymer(Korea)
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    • v.34 no.5
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    • pp.405-409
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    • 2010
  • New sol-gel precursors having the ability to protect iron against corrosion were synthesized and used to prepare organic-inorganic hybrid coatings based on epoxy. Bisphenol A epoxy was modified with 3-isocyanatopropyltriethoxysilane to improve the compatibility, and water and HCl were used as catalysts for sol-gel process. Various coating formulations were prepared depending on the type of sol-gel precursors and the amount of each ingredient, and cast on iron substrates by dip-coating and thermally cured. Corrosion protection properties of coated iron were studied by a salt spray test and electrochemical impedance spectroscopy under 0.1 M NaCl electrolyte. Hybrid coatings containing anticorrosive functional group exhibited excellent corrosion protection on iron, compared to that of typical hybrid coatings. From electrochemical impedance spectroscopy, the hybrid coatings containing anticorrosive functional group could maintaine the initial impedance after 500 h, while the impedance of hybrid coatings without them started to decrease after 24 h.

Characteristic of Underfill with Various Epoxy Resin (에폭시 수지에 따른 언더필의 특성에 관한 연구)

  • Noh, Bo-In;Lee, Jong-Bum;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.3 s.40
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    • pp.39-45
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    • 2006
  • This study was investigated the thermal properties of underfill with various epoxy resins using thermal analysis methods such as differential scanning calorimetry (DSC), thermo gravimetry analysis (TGA), dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). And, the adhesion strength of the underfills/FR-4 substrate was evaluated. The glass transition temperature (Tg) of underfill which was composed the cycolaliphatic epoxy resin was lower than that of underfill which was not composed the cycolaliphatic epoxy resin. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The coefficient of thermal expansion (CTE) of underfill which was composed the cycolaliphatic epoxy resin was higher than that of underfill which was not composed the cycolaliphatic epoxy resin. The excessive curing temperatures caused a weak boundary layer of epoxy resin, which resulted in a deterioration of mechanical properties in the epoxy resin and thus led to poor adhesion property between the underfill/FR-4 substrate.

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Studies on the Electrical Properties and Pattern Fabrication of Conjugated Self-Assembled Monolayer by Deep UV Light (원자외선에 의한 공액구조 자기조립 단분자막의 패턴 제작 및 전기적 특성)

  • Oh Se Young;Choi Hyung Seok;Kim Hee Jeong;Park Je Kyun
    • Polymer(Korea)
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    • v.29 no.4
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    • pp.331-337
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    • 2005
  • In general, alkanethiolates having carboxylic acid in the tail group have been used as biorecepton. In this study, we have immobilized a cytochrome c protein using conjugated aromaticthiolates in order to improve the electrical property and physical stability of alkanethilolates. The pattern formation of self-assembled aromaticthiolate monolayers was as follow. Aromatic thiolates bound on the gold surface by the adsorption of 4'-mercapto-biphenyl-4-carboxylic acid and 4-mercapto-[1,1';4',1']terphenyl-4'-carboxylic acid were oxidized by the irradiation of deep UV light through a negative mask. The negative type pattern of the self-assembled monolayer (SAM) was obtained by developing with a deionized water. The pattern formation and electrical conductivity of aromaticthiolate SAMs was investigated by the measurements of STM and AFM. In addition, cytochrome c or ferrocene amide was immobilized onto the patterned substrate. We also studied on the effect of conjugated aromatic thiolates on the electrical activity of cytochrome c or ferrocene amide by cyclic voltammetry.

Fabrication of Ceramic Line Pattern by UV-Nanoimprint Lithography of Inorganic Polymers (무기고분자의 나노임프린트법에 의한 세라믹 선형 패턴의 제조)

  • Park Jun-Hong;Pham Tuan-Anh;Lee Jae-Jong;Kim Dong-Pyo
    • Polymer(Korea)
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    • v.30 no.5
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    • pp.407-411
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    • 2006
  • The SiC-based ceramic nanopatterns were prepared by placing polydimethylsiloxane (PDMS) mold from DVD master on the spincoated polyvinylsilaeane (PVS) or allylhydridopolycaybosilane (AHPCS) as ceramic precursors to fabricate line pattern via UV-nanoimprint lithography (UV-NIL), and subsequent pyrolysis at $800^{\circ}C$ in nitrogen atmosphere. As the dimensional change of polymeric and ceramic patterns was comparatively investigated by AFM and SEM, the shrinkage in height was 38.5% for PVS derived pattern and 24.1% for AHPCS derived pattern while the shrinkage in width was 18.8% for PVS and 16.7% for AHPCS. It indicates that higher ceramic yield of the ceramic precursor resulted in less shrinkage, and the strong adhesion between the substrate and the pattern caused anisotropic shrinkage. This preliminary work suggests that NIL is a promissing route for fabricating ceramic MEMS devices, with the development on the shrinkage control.

A Study on the Curing Behaviors of Glass/Epoxy Prepreg by Dielectrometer and the Thermal Properties of Cured Glass/Epoxy Composites (Dielectrometer를 이용한 Glass/Epoxy 프리프레그의 경화거동 및 경화물의 열적 특성연구)

  • 제갈영순;이원철;전영재;윤남균
    • Polymer(Korea)
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    • v.24 no.3
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    • pp.350-357
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    • 2000
  • Curing behaviors of glass/epoxy prepreg for printed circuit boards (PCB) were studied by using dielectrometer and differential scanning calorimeter. This prepreg was showed the lowest ionic viscosity at about 115$^{\circ}C$, and then the ionic viscosity was gradully increased up to 15$0^{\circ}C$. This indicated that the curing reaction of this prepreg started at 115$^{\circ}C$ and the molecular weight was increased by the accelerated thermal cross-linking reaction. The loss factor and tan $\delta$ values were also measured and discussed. The dielectric behaviors of this prepreg system were also measured according to the cure cycle for PCB. This material was found to be thermally stable up to about 30$0^{\circ}C$ and then was showed an abrupt decomposition beyond this temperature.

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Electro-Optic Characteristics of Polymer Dispersed Liquid Crystal Cell with Transparent State Initially (초기에 투명한 상태인 고분자 분산형 액정셀의 전기 광학 특성)

  • 김미숙;원해경;송성훈;이명훈;이승희
    • Polymer(Korea)
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    • v.28 no.4
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    • pp.298-304
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    • 2004
  • We fabricated a polymer dispersed liquid crystal (PDLC) cell using LC with negative dielectric anisotropy and UV curable monomer exhibiting transparent state initially (called normally transparent (NT)) and studied the electro-optic characteristics. The NT PDLC cell made with the ratio of LC : monomer = 70/30 wt%, curing temperature of 20 $^{\circ}C$ and strong UV intensity of 198 ㎽/$\textrm{cm}^2$ had high contrast ratio and showed good electro-optic characteristics. In this condition, LC is aligned vertically on the substrate due to the vertical alignment layer and the polymer made with the UV exposure does not influence the alignment of the LC much. Therefore, the transmittance at the zero voltage is very high and the scattering state of the cell is good after applying the voltage because LC with negative dielectric anisotropy tries to align perpendicular to the field. And also, the NT PDLC cell showed better viewing angle characteristics than that in the normally scattering (NS) PDLC.

Flip Chip Process on the Local Stiffness-variant Stretchable Substrate for Stretchable Electronic Packages (신축성 전자패키지용 강성도 국부변환 신축기판에서의 플립칩 공정)

  • Park, Donghyeun;Oh, Tae Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.155-161
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    • 2018
  • A Si chip with the Cu/Au bumps of $100-{\mu}m$ diameter was flip-chip bonded using different anisotropic conductive adhesives (ACAs) onto the local stiffness-variant stretchable substrate consisting of polydimethylsiloxane (PDMS) and flexible printed circuit board (FPCB). The average contact resistances of the flip-chip joints processed with ACAs containing different conductive particles were evaluated and compared. The specimen, which was flip-chip bonded using the ACA with Au-coated polymer balls as conductive particles, exhibited a contact resistance of $43.2m{\Omega}$. The contact resistance of the Si chip, which was flip-chip processed with the ACA containing SnBi solder particles, was measured as $36.2m{\Omega}$, On the contrary, an electric open occurred for the sample bonded using the ACA with Ni particles, which was attributed to the formation of flip-chip joints without any entrapped Ni particles because of the least amount of Ni particles in the ACA.

Surface Characteristics of Silicon Substrates Coated with Self-assembled Mono-layers (자체조립 단일막으로 코팅된 실리콘 기판의 표면특성)

  • 최성훈;강호종
    • Polymer(Korea)
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    • v.28 no.1
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    • pp.3-9
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    • 2004
  • Silane modified perfluoropolyethers (SPFPE) was synthesized as a self-assembled mono-layers (SAMs) thin film for micro-electro mechanical system (MEMS). SPFPE was compared to the Perfluoropolyethers (PFPE) as well as octadecyltrichlorosilane (OTS) and perfluorooctyltrichlorosilane (FOTS) with respect to the development of hydrophobicity in the SAMs surface. SPFPE shows less hydrophobicity than those of OTS and FOTS. Thermal annealing of SPFPE SAMs resulted in the enhancement of hydrophobicity as much as those of OTS and FOTS. The SAMs formed from SPFPE were found to be similar as OTS and FOTS SAMs with smooth R$\sub$a/ values of 0.3 nm. However, the flexible chain mobility of SPFPE resulted in 50% reduction as much as the fiction force in OTS.