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Polymer Substrate Materials with Low Dielectric Loss Using Dicyclopentadienyl Bisphenol Cyanate Ester and Polyphenylene Ether  

Kim, Dong-Kook (Department of Chemistry & Applied Chemistry, Hanyang University)
Park, Seong-Dae (Department of Chemistry & Applied Chemistry, Hanyang University)
Lee, Woo-Sung (Korea Electronics Technology Institute)
Yoo, Myong-Jae (Korea Electronics Technology Institute)
Park, Se-Hoon (Korea Electronics Technology Institute)
Lim, Jin-Kyu (Department of Chemistry & Applied Chemistry, Hanyang University)
Kyoung, Jin-Bum (Department of Chemistry & Applied Chemistry, Hanyang University)
Publication Information
Polymer(Korea) / v.31, no.6, 2007 , pp. 474-478 More about this Journal
Abstract
Polymer substrate materials with low dielectric loss were obtained by fabricating the composite using dicyclopentadienyl bisphenol cyanate ester oligomer and polyphenylene ether (PPE). From the analysis of the curing reaction of oligomer and catalyst, it was observed that the optimum amount of catalyst was 0.02 phr of Zn content. It was applied to the fabrication of polymer composite. By changing oligomer/PPE weight ratio, the peel strength and the gel content of the fabricated composites were measured, and then, the dielectric constant and the dissipation factor were measured in the GHz frequency range. The amount of PPE affected the peel strength and the dielectric properties of composites. However, the amount of catalyst did not affect them at all. Resulting from all experiments, we obtained polymer composite laminates haying the peel strength of above 1 kN/m and the low dissipation factor of 0.004 at 1 GHz.
Keywords
dielectric loss; cyanate ester; polyphenylene ether; dissipation factor; peel strength;
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Times Cited By Web Of Science : 2  (Related Records In Web of Science)
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