Optimizing Mutiple Quality Characteristics of Through Silicon Via(TSV) Interface and Solder Joint Interface by Numerical Analysis-based Taguchi Method (Taguchi 실험계획법 기반 수치해석을 이용한 TSV계면과 솔더 접합부의 최적화)
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- Journal of Welding and Joining
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- v.29 no.3
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- pp.35-38
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- 2011