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http://dx.doi.org/10.17702/jai.2021.22.2.69

Recent Trends of Light Induced Bonding-Debonding Adhesives  

Jeong, Jongkoo (BGF Ecobio)
Cho, Seong-keun (Chemical Materials Solutions Center, Korea Research Institute of Chemical Technology)
Lee, Jae Heung (Chemical Materials Solutions Center, Korea Research Institute of Chemical Technology)
Publication Information
Journal of Adhesion and Interface / v.22, no.2, 2021 , pp. 69-77 More about this Journal
Abstract
A variety of efforts are attempted to make the world sustainable in fabrication industries worldwide. To achieve the goals, a new design concept for products is one of crucial factors to be able to dismantle them after use in easy and simple ways. New debonding technologies have been developed in recent years for the recycle and/or repair of bonded structures, where the bonds are broken without the damage of the components and make recycling easier. Some representative technologies of controlled delamination materials (CDM) are reviewed with an emphasis on light induced debonding of adhesives. We also describe current applications of light induced CDMs as temporary bondable films in semiconductor and display industries.
Keywords
Adhesives; Dismantlable; Bonding; Delamination; Light;
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