Effect of NCF Trap on Electromigration Characteristics of Cu/Ni/Sn-Ag Microbumps |
Ryu, Hyodong
(School of Materials Science and Engineering, Andong National University)
Lee, Byeong-Rok (STATS ChipPAC Korea Ltd.) Kim, Jun-beom (HANA Micron Inc.) Park, Young-Bae (School of Materials Science and Engineering, Andong National University) |
1 | H. Y. Chen, M. F. Ku, and C. Chen, "Effect of under-bumpmetallization structure on electromigration of Sn-Ag solder joints", Adv. Mater. Res-ger., 1, 83 (2012). DOI |
2 | B. G. Kim, S. C. Kim, W. G. Dong, and Y. H. Kim, "The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu Bumps", J. Jpn. I. Met., 52(11), 2106 (2011). |
3 | S. M. Lee B. G. Kim, and Y. H. Kim, "Non-Conductive Adhesive (NCA) Trapping Study in Chip on Glass Joints Fabricated Using Sn Bumps and NCAs", T. Jpn. I. Met., 52(11), 2106 (2011). |
4 | S. C. Kim, and Y. H. Kim, "Low temperature chip on film bonding technology for 20um pitch applications", J Mater Sci: Mater Electron., 27, 3658 (2015). |
5 | Joint Electron Device Engineering Council, "Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress", JEDEC Standard, JEP154, USA (2008). |
6 | K. N. Tu, and R. D. Thompson, "Kinetics of interfacial reaction in bimetallic CuSn thin films", Acta Metall., 30(5), 947 (1982). DOI |
7 | Henkel Corporation, Loctite underfill material technical data sheet form http://www.underfill.net/wp-content/uploads/2016/02/Loctite-underfill-3505-tds.pdf |
8 | W. J. Choi, E. C. C. Yeh, and K. N. Tu, "Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization", J. Appl. Phys., 94, 5665 (2003). DOI |
9 | J. H. Lee, G. T. Lim, and Y. B. Park, "Electromigration Characteristics of Flip Chip Sn-3.5Ag Solder Bumps under Highly Accelerated Conditions", J. Korean Phys. Soc., 54(5), 1784 (2009). DOI |
10 | G. Kim, K. Son, G. T. Park, and Y. B. Park, "Effect of Current Densities on the Electromigration Failure Mechanisms of Flip-Chip Sn-Ag Solder Bump", Korean J. Met. Mater., 55(11), 798 (2017). |
11 | S. H. Kim, G. T. Park, B. R. Lee, J. M. Kim, S. H. Yoo, and Y. B. Park, "Effects of PCB Surface Finishes on in-situ Intermetallics Growth and Electromigration Characteristics of Sn-3.0Ag-0.5Cu Pb-free Solder Joints", J. Microelectron. Packag. Soc., 22(2), 47 (2015). DOI |
12 | J. H. Lee, G. T. Lim, and Y. B. Park, "Size Effect on Electromigration Reliability of Pb-free Flip Chip Solder Bump", Proc. 58th Electronic Components and Technology Conference (ECTC), Lake Buena Vista (2008). |
13 | D. W. Kim, R. Vidhya, B. Henderson, U. Ray, S. Q. Gu, W. Zhao, R. Radojcic, and M. Nowak, "Material innovation opportunities for 3D integrated circuits from a wireless application point of view", Proc. 63rd Electronic Components and Technology Conference, Las Vegas (2013). |
14 | Y. Liu, N. Tamura, D.W. Kim, S. Q. Gu, and K. N. Tu, "A metastable phase of tin in 3D integrated circuit solder microbumps", Proc. 65th Electronic Components and Technology Conference (ECTC), San Diego, CA (2015). |
15 | J. H. Lee, G. T. Lim, S. T. Yang, M. S. Suh, Q. H. Chung, K. Y. Byun, and Y. B. Park, "Electromigration and Thermomigration Characteristics in Flip Chip Sn-3.5Ag Solder Bump", J. Kor. Inst. Met. & Mater., 46(5), 310 (2008). |
16 | V. S. Rao, V. Kripseph, S. W. Yoon, D. Witarsa, and A. A. O. Tay, "Bed of nails-100 microns pitch wafer level interconnections process", Proc. 5th Electronics Packaging Technology Conference(EPTC), Singapore (2004). |
17 | B. J. Kim, S. H. Kim, and Y. B. Park, "Intermetallic Compound Growth Characteristics of Cu/Ni/Au/Sn-Ag/Cu Microbump for 3-D IC Packages", J. Microelectron. Packag. Soc., 20(2), 59 (2013). DOI |
18 | S. Q. Gu, P. Marchal, M. Facchini, F. Wang, M. Suh, D. Lisk, and M. Nowak, "Stackable Memory of 3D Chip Integration for Mobile Applications", Proc. Int. El. Devices Meet, IEEE, San Francisco (2008). |
19 | M. Liebens, J. Slabbekoorn, A. Miller, E. Beyne, M. Stoerring, S. Hiebert, and A. Cross, "Defect earning methodology applied to microbump process at 20 pitch and below", Proc. 29th Annual SEMI Advanced Semiconductor Manufacturing Conference, New York (2018). |
20 | B. J. Kim, G. T. Lim, Kim, J. D. Kim, K. W. Lee, Y. B. Park, H. Y. Lee, and Y. C. Joo, "Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing", J. Electron. Mater., 39(10), 1007 (2010). DOI |
21 | H. Peng, and R. W. Johnson, "Underfilling Fine Pitch BGAs", IEEE, T. Electron. Pa. M., 4, 293 (2001). |
22 | M. J. Yim, and K. W. Paik, "Design and understanding of anisotropic conductive films (ACFs) for LCD packaging", IEEE Trans. Compon. Packag. Manuf. Technol., Norrkoping (1998). |
23 | S. T. Lu, Y. M. Lin, C. C. Chuang, T. H. Chen, and W. H. Chen, "Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects with Ultra-Fine Pitch", IEEE Trans. Compon. Packag. Manuf. Technol., 1, 33 (2011). DOI |
24 | D. T. Hsu, H. D. Dim, F. G. Tong, S. Chungpaiboonpatana, C. Davison, and J. M. Adams, "Curing Dinetics and optical cure schedules for underfill materials", Microelectronics Journal, 31, 271 (2000). DOI |
25 | S. Kawamoto, M. Yoshida, S. Teraki, and H. Iida, "Effect of NCF design for the assembly of flip chip and reliability", Proc. 62nd Electronic Components and Technology Conference (ECTC), San Diego (2012). |
26 | L. K. Teha, E. Antoa, C. C. Wonga, S. G. Mhaisalkara, E. H. Wongb, P. S. Teob, and Z. Chena, "Development and reliability of non-conductive adhesiveflip-chip packages", Thin Solid Films, 462, 446 (2004). |
27 | C. Feger, N. LaBianca, M. Gaynes, S. Steen, Z. Liu, R. Peddi, and M. Francis, "The over-bump applied resin wafer-level underfill process: Process, material and reliability", Proc. 59th Electronic Components and Technology Conference (ECTC), San Diego (2004). |
28 | K. Honda, T. Enomoto, A. Nagai, and N. Takano, "NCF for wafer lamination process in higher density electronic packages", Proc. 60th Electronic Components and Technology Conference (ECTC), Las Vegas (2010). |