Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Optimizing Mutiple Quality Characteristics of Through Silicon Via(TSV) Interface and Solder Joint Interface by Numerical Analysis-based Taguchi Method

Taguchi 실험계획법 기반 수치해석을 이용한 TSV계면과 솔더 접합부의 최적화

  • 방한서 (조선대학교 선박해양공학과) ;
  • 방희선 (조선대학교 선박해양공학과) ;
  • 박세민 (조선대학교 선박해양공학과) ;
  • 이창우 (한국생산기술연구원 수석연구원)
  • Published : 2011.06.30
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References

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