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http://dx.doi.org/10.5781/KWJS.2011.29.3.291

Optimizing Mutiple Quality Characteristics of Through Silicon Via(TSV) Interface and Solder Joint Interface by Numerical Analysis-based Taguchi Method  

Bang, Han-Sur (조선대학교 선박해양공학과)
Bang, Hee-Seon (조선대학교 선박해양공학과)
Park, Se-Min (조선대학교 선박해양공학과)
Lee, Chang-Woo (한국생산기술연구원 수석연구원)
Publication Information
Journal of Welding and Joining / v.29, no.3, 2011 , pp. 35-38 More about this Journal
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