• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.70-78
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• 2009

This paper addresses the analysis and the design optimization of differential interconnects for high-speed Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, and time-domain transient simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.8 s.338
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• pp.1-6
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• 2005

A dual-level low voltage differential signalling (DLVDS) circuit is proposed aiming at reducing transmission lines for LCD driver IC. In the proposed circuit, we apply a couple of primitive data to DLVDS circuit as inputs. The transmitter converts two inputs to two kinds of fully differential level signals. In this circuit, two transmission lines are sufficient to transfer two primitive inputs while keeping the LVDS feature. The receiver recovers The original input data through a level decoding circuit. We fabricated the proposed circuit using $0.25\mu m$ CMOS technology. The resultant circuit shows 1-Gbps/2-line data rate and 35-mW power consumption at 2.5V supply voltage, respectively.

• The Journal of the Korea Contents Association
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• v.6 no.3
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• pp.38-45
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• 2006

A dual-level low voltage differential signalling (DLVDS) circuit is proposed aiming at reducing transmission lines for a LCD driver IC. We apply two data to the proposed DLVDS circuit as inputs. Then, the transmitter converts two inputs to two kinds of fully differential signals. In this circuit, two transmission lines are sufficient to transfer two inputs while keeping the LVDS feature. However, the circuit has a common mode bias fluctuation due to difference of the input bias and the reference bias. We compensate the common mode bias fluctuation using a feedback circuit of the current source bias. The receiver recovers the original input data through a level decoding circuit. We fabricated the proposed circuit using $0.25{\mu}m$ CMOS technology. The simulation results of proposed circuit shows 1-Gbps/2-line data rate and 35mW power consumption at 2.5V supply voltage, respectively.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.10a
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• pp.761-764
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• 2007

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and πace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.5
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• pp.879-886
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• 2008

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. The 10% change in trace width produced change of approximately 6% and 5.6% in differential impedance for trace thickness of $17.5{\mu}m$ and $35{\mu}m$, respectively. The change in the trace space showed a little change. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.9
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• pp.244-250
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• 2012

This paper describes a 4-Gb/s receiver circuit for a low-swing ground-referenced differential signaling system. The receiver employs a common-gate level-shifter and a continuous linear equalizer which compensates inter-symbol-interference (ISI) and improves voltage and timing margins. A bias circuit maintains the bias current of the level-shifter when the common level of the input signal changes. The receiver is implemented with a low-power 65-nm CMOS technology. When 4-Gb/s 400mVp-p signals are transmitted to the receiver through the channel with the attenuation of -19.7dB, the timing margin based on bit error rate (BER) of $10^{-11}$ is 0.48UI and the power consumption is as low as 0.30mW/Gb/s.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.37 no.1
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• pp.40-48
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• 2000

1A novel bipolar linear transconductor and its application to operational transconductance amplifier(OTA) for low-voltage low-power signal processing is proposed. The transconductor consists of a npn differential-pair with emitter degeneration resistor and a pnp differential-pair connected to the npn differential-pair in cascade. The bias current of the pnp differential-pair is used with the output current of the npn differential-pair for wide linearity and temperature stability. The OTA consists of the linear transconductor and a translinear current cell followed by three current mirrors. The proposed transconductor has superior linearity and low-voltage low-power characteristics when compared with the conventional transconductor. The experimental results show that the transconductor with transconductance of 50 ${\mu}S$ has a linearity error of less than ${\pm}$0.06% over an input voltage range from -2V to +2V at supply voltage ${\pm}$3V. Power dissipation of the transconductor was 2.44 mW. A prototype OTA with a transconductance of 25 ${\mu}S$ has been built with bipolar transistor array. The linearity of the OTA was same as the proposed transconductor. The OTA circuit also exhibits a transconductance that is linearly dependent on a bias current varying over four decades with a sensitivity of 0.5 S/A.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.1
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• pp.59-67
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• 2007

This paper presents a low power dual-level low voltage differential signaling (DLVDS) technique using current source switching for LCD driver ICs in portable products. The transmitter makes dual level signal that has two different level signal 400mVpp and 250mVpp while keeping the advantages of LVDS. The decoding circuit recovers the primary signal from DLVDS. The low power DLVDS is implemented using a $0.25{\mu}m$ CMOS process under 2.5V supply. The proposed circuit shows 800Mbps/2-line data rate and 9mW, 11.5mW power consumptions in transmitter and receiver, respectively. The proposed DLVDS scheme reduce power consumption dramatically compare with conventional one.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.11
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• pp.35-42
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• 2004

A CMOS folding ADC with transistor differential pair folding circuit for low power consumption and high speed operation is presented in this paper. This paper explains the theory of transistor differential pair folding technique and many advantages compared with conventional folding and interpolation circuits. A ADC based on transistor differential pair folding circuit uses 16 fine comparators and 32 interpolation resistors. So it is possible to achieve low power consumption, high speed operation and small chip size. Design technology is based on fully standard 0.25${\mu}{\textrm}{m}$ double poly 2 metal n-well CMOS process. A power consumption is 45mW at 2.5V applied voltage and 250MHz sampling frequency. The INL and DNL are within $\pm$0.15LSB and $\pm$0.15LSB respectively. The SNDR is approximately 50dB at 10MHz input frequency.

• The Journal of the Korea institute of electronic communication sciences
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• v.6 no.1
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• pp.7-12
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• 2011

This paper proposes a differential Colpitts-VCO circuit suitable for low phase noise oscillation at the sub-1V supply voltage. Oscillation with low phase noise at the sub-1V supply voltage is facilitated by employing inductors as the current sources of the proposed circuit. One of the two feedback capacitors of the single-ended Colpitts oscillator in the proposed circuit is replaced with the MOS varactor in order to further reduce the resonator loss. Post-layout simulation results using a $0.18{\mu}m$ RF CMOS technology show that the phase noises at the 1MHz offset frequency of the proposed circuit oscillating at the sub-1V supply voltages of 0.6 to 0.9 V are at least 7 dBc/Hz lower than those of the well-known cross-coupled differential VCO.