• Title/Summary/Keyword: 이중외팔보

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Analyses of Stress Intensity Factors and Evaluation of Fracture Toughness in Adhesively Bonded DCB Joints (DCB 접착이음에 대한 응력세기계수의 해석 및 파괴인성의 평가)

  • Jeong, Nam-Yong;Lee, Myeong-Dae;Gang, Sam-Geun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.6 s.177
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    • pp.1547-1556
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    • 2000
  • In this paper, an evaluation method of fracture toughness to apply interfacial fracture mechanics was investigated in adhesively bonded double-cantilever beam (DCB) joints. Four types of adhesively bonded DCB joints with an interface crack were prepared for analyses of the stress intensity factors using boundary element method(BEM) and the fracture toughness test. From the results of BEM analysis and fracture toughness experiments, it is found that the stress intensity factor, K1 is a parameter driving the fracture of adhesively bonded joints. Also, the evaluation method of fracture toughness by separated stress intensity factors of mixed mode cracks was proposed and the influences of mode components for its fracture toughness are investigated in adhesively bonded DCB joints.

A Study on Crack Propagation Along a Sinusoidal Interface using Cohesive Zone Models (응집 영역 모델을 이용한 굴곡 계면을 따르는 균열 진전 거동에 관한 연구)

  • Lee, Hyeon-Gyeong;Kim, Hyun-Gyu
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.31 no.3
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    • pp.121-125
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    • 2018
  • In this study, finite element analyses of crack propagation along a sinusoidal interface are performed by using cohesive elements. BK law is used for cohesive zone to consider mixed mode traction-separation relation at the crack tip on a sinusoidal interface of a double cantilever beam specimen. The shape of a sinusoidal interface crack and the cohesive strength and the cohesive energies in mixed mode cohesive laws are varied in numerical experiments, and load-displacement curves at the ends of a double cantilever beam specimen are obtained to investigate the crack propagation behavior along a sinusoidal interface.

A Study on the Design of a Double Cantilever Structure Friction Tester for Precision Friction Measurement (정밀 마찰측정을 위한 이중 캔틸레버 구조 마찰시험기의 설계에 관한 연구)

  • Kang, Won-Bin;Kim, Hyun-Joon
    • Tribology and Lubricants
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    • v.34 no.4
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    • pp.125-131
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    • 2018
  • A precision tribometer consisting of a cantilever was designed to measure frictional forces in the micro-Newton range. As frictional forces are measured based on the bending of the cantilever, vibration of the cantilever is the most significant factor affecting the quality of the friction measurement. Therefore, improved design of the tribometer with double cantilevers and a connecting plate that united the two cantilevers mechanically was suggested. For the verification of the modified design of the tribometer, numerical analysis and experiments were conducted. Examination using the finite element method revealed that the tribometer with a double cantilever and a connecting plate exhibited faster damping characteristics than the tribometer with a single cantilever. In the experiment, effectiveness of the double cantilever and connecting plate for vibration reduction was also confirmed. Vibration of the tribometer with double cantilever decreased eight times faster than that of the tribometer with a single cantilever. The faster damping of the double cantilever design is attributed to the mechanical interaction at the contacting surfaces between the cantilever and the connecting plate. Tribotesting using the tribometer with a single cantilever resulted in random fluctuation of frictional forces due to the stick-slip behavior. However, using the tribometer with a double cantilever and connecting plate for the tribotest gave relatively uniform and steady measurement of frictional forces. Increased stiffness owing to using a double cantilever and mechanical damping of the connecting plate were responsible for the stable friction signal.

Convergence Study on Fracture at Joint Using Adhesive at Inhomogeneous Materials Bonded with CFRP (CFRP와 결합된 이종재료들에서의 접착제를 이용한 접합부의 파손에 관한 융합 연구)

  • Kim, Jae-Won;Cho, Jae-Ung
    • Journal of the Korea Convergence Society
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    • v.9 no.5
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    • pp.151-156
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    • 2018
  • In this study, CFRP and metal or nonmetal were bonded with adhesive and the fracture study on this material was carried out. CFRP at the upper side of specimen and metal or nonmetal were assigned at the lower side of specimen by using DCB specimen as the analysis condition. And it was desribed that the structural adhesive were bonded between both upper and lower sides. As this analysis result, the least equivalent stress was shown at the specimen bonded with aluminium. The maximum shear stress was shown to become lowest at the de-bonded CFRP specimen when titanium was used. In conclusion, it was shown that the deformation of specimen became lowest when titanium was used. On the basis of this study result, the esthetic sense can be shown as the fracture data of bonded interface using adhesive are grafted onto the real life.

An Investigation on the Behavior of Fracture Mechanics as the Type of Mode I at Specimen Bonded with Tapered Carbon Fiber Reinforced Plastic (경사진 CFRP로 접합된 시험편에서의 Mode 1 형 파괴역학적 거동에 관한 연구)

  • Lee, Jung-Ho;Cho, Jae-Ung;Cheon, Seong Sik
    • Composites Research
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    • v.29 no.2
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    • pp.85-89
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    • 2016
  • This paper aims at estimating the fracture behavior at the bonded part of composite material. CFRP is manufactured as the type of TDCB. The static analysis of Mode 1 due to the configuartion factor of m is carried out. Four kinds of specimens have the configuartion factor(m) of 2, 2.5, 3 and 3.5. As the study result, the displacements at specimens are shown to be similar each other in these four cases. At m of 3.5, the reaction force becomes highest as 412 N and is shown to be improved as much as 14% by comparing m of 2. The data on defection of the bonded interface and reaction force are thought to be contributed to the structural design of CFRP and the safe design.

A Study on the Effect of Cohesive Laws on Finite Element Analysis of Crack Propagation Using Cohesive Elements (응집 요소를 사용한 균열 진전 유한요소 해석에서 응집 법칙의 영향에 대한 연구)

  • Seo, Hyeong-Seok;Baek, Hyung-Chan;Kim, Hyun-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.4
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    • pp.401-407
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    • 2014
  • In this paper, the effect of cohesive laws on the finite element analysis of crack propagation using cohesive elements is investigated through three-point bending and double cantilever beam problems. The cohesive elements are implemented into ABAQUS/Standard user subroutines(UEL), and the shape of cohesive law is varied by changing parameters in polynomial functions of cohesive traction-separation relations. In particular, crack propagation behaviors are studied by comparing load-displacement curves of the analysis models which have different shapes of cohesive laws with the same values of fracture energy and cohesive strength. Furthermore, the influence of the element size on crack propagation is discussed in this study.

Shear Experiment and Simulation Analysis at Bonded Surface of Specimen Tapered Double Cantilever Beam with Expanded Aluminum (발포 알루미늄으로 된 경사진 이중외팔보 시험편의 접착면에서의 전단 실험 및 시뮬레이션 해석)

  • Sun, Hong-Peng;Cheon, Seong S.;Cho, Jae-Ung
    • Composites Research
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    • v.27 no.6
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    • pp.248-253
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    • 2014
  • In this study, tapered double cantilever beam specimens are designed with the variable of angle to investigate the fracture property at the bonded surface of adjoint structure. These specimens are made with four kinds of models as the length of 200 mm and the slanted angles of bonded surfaces on specimens of $6^{\circ}$, $8^{\circ}$, $10^{\circ}$ and $12^{\circ}$. By investigating experiment and analysis result of these specimens, the maximum loads are happened at 120 N, 137 N, 154 N and 171 N respectively in cases of the specimens with slanted angles of $6^{\circ}$, $8^{\circ}$, $10^{\circ}$ and $12^{\circ}$. As the analysis result approach the experimental value, it is confirmed to have no much difference with the values of experiment and analysis. It is thought that the material property can be investigated effectively on shear behavior of the material composed of aluminum foam bonded with adhesive through simulation instead of experiment by applying this study method.

Fracture Behaviour Analysis of the Crack at the Specimen with the Type of Mode I Composed of the Bonded Carbon Fiber Reinforced Plastic (접합된 CFRP로 구성된 Mode I형 시험편 크랙의 파괴 거동 해석)

  • Lee, Jung-Ho;Cho, Jae-Ung;Cheon, Seong-Sik;Kook, Jeong Han
    • Composites Research
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    • v.28 no.6
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    • pp.356-360
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    • 2015
  • In this paper, the carbon fiber reinforced plastic is processed as the double cantilever beam in order to estimate the fracture behavior of composite and is carried out with the static analysis as the mode I. The specimen sizes are 25 mm, 30 mm, 35 mm and 40 mm. And the material property is used with carbon. As the analysis result of mode I, the adhesive part is detached latest by the small force at the specimen thickness of 25 mm. The largest force is happened at the specimen thickness of 40 mm. The defection of the adhesive interface is shown slowest at the displacement of 9.75 mm at the specimen thickness of 25 mm. And the defection is shown quickest at the displacement of 7.82 mm at the specimen thickness of 40 mm. This defection is due to the fracture of specimen. The result of this study on the defection of the adhesive interface and the reaction force due to this defection is thought to be contributed to the safe structural design of the carbon fiber reinforced plastic.

Convergence Study on Damage of the Bonded Part at TDCB Structure with the Laminate Angle Manufactured with CFRP (CFRP로 제작된 적층각도를 가진 TDCB 구조물에서의 접착부의 파손에 관한 융합 연구)

  • Lee, Dong-Hoon;Cho, Jae-Ung
    • Journal of the Korea Convergence Society
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    • v.9 no.12
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    • pp.175-180
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    • 2018
  • In this study, CFRP was manufactured with the laminate angle of $45^{\circ}$. The specimen of TDCB bonded with the adhesive for structure was designed by CATIA and the analysis was progressed by using the finite element analysis program of ANSYS. This study model was designed on the basis of British industry and ISO standard and the configuration factor(m) was established with variable according to the angle of model configuration. As the study result of this paper, the maximum deformations at the specimens with the tapered angles of $4^{\circ}$ and $8^{\circ}$ become most as 12.628 mm and least as 12.352mm respectively. Also, the maximum equivalent stresses at the specimens with the tapered angles of $6^{\circ}$ and $8^{\circ}$ become most as 9210.3 MPa and least as 4800.5 MPa respectively. The damage data of TDCB structure with the laminate angle which was manufactured with CFRP could be secured through this study result. As the damage data of TDCB structure bonded with CFRP obtained on the basis of this study result are utilized, the esthetic sense can be shown by being grafted onto the machine or structure at real life.

Measurement of EMC/PCB Interfacial Adhesion Energy of Chip Package Considering Warpage (휨을 고려한 칩 패키지의 EMC/PCB 계면 접합 에너지 측정)

  • Kim, Hyeong Jun;Ahn, Kwang Ho;Oh, Seung Jin;Kim, Do Han;Kim, Jae Sung;Kim, Eun Sook;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.101-105
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    • 2019
  • The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.