Browse > Article
http://dx.doi.org/10.6117/kmeps.2019.26.4.101

Measurement of EMC/PCB Interfacial Adhesion Energy of Chip Package Considering Warpage  

Kim, Hyeong Jun (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
Ahn, Kwang Ho (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
Oh, Seung Jin (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
Kim, Do Han (R&D Group, SIMMTECH Co.)
Kim, Jae Sung (R&D Group, SIMMTECH Co.)
Kim, Eun Sook (R&D Group, SIMMTECH Co.)
Kim, Taek-Soo (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
Publication Information
Journal of the Microelectronics and Packaging Society / v.26, no.4, 2019 , pp. 101-105 More about this Journal
Abstract
The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.
Keywords
Chip Package; EMC; PCB; Adhesion; Warpage;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 D. R. Moore, A. Pavan, and J. G. Williams, "Fracture Mechanics Testing Methods for Polymers Adhesives and Composites", Elsevier Science, ch. 3, Oxford, U.K (2001).
2 G. Kim, J. Lee, S.-H. Park, S. Kang, T.-S. Kim, and Y.-B. Park, "Comparison of Quantitative Interfacial Adhesion Energy Measurement Method between Copper RDL and WPR Dielectric Interface for FOWLP Applications (in Korean), J. Microelectron. Packag. Soc., 25(2), 41 (2018).   DOI
3 M. F. Kanninen, "An augmented double cantilever beam model for studying crack propagation and arrest", International Journal of fracture, 9(1), 83 (1973).   DOI
4 I. Lee, S. Kim, J. Yun, K. Park, and T.-S. Kim, "Interfacial toughening of solution processedAg nanoparticle thin films by organic residuals", Nanotechnology,23(48), 485704 (2012).   DOI
5 T. Yoon, W. C. Shin, T. Y. Kim, J. H. Mun, T.-S. Kim, and B. J. Cho, "Direct Measurement of Adhesion Energy of Monolayer Graphene As-Grown on Copper and Its Application to Renewable Transfer Process", Nano Letters, 12(3), 1448 (2012).   DOI
6 W. Kim, J. Choi, J.-H. Kim, T. Kim, C. Lee, M. Kim, B. J. Kim, and T.-S. Kim, "Comparative Study of the Mechanical Properties of All-Polymer and Fullerene-Polymer Solar Cells: The Importance of Polymer Acceptors for High Fracture Resistance", Chemistry of Materials, 30(6), 2102 (2018).   DOI
7 C. Kim, T.-I. Lee, M. S. Kim, and T.-S. Kim, "Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing", Microelectronics Reliability, 73, 136 (2017).   DOI
8 M.-Y. Tsai, H.-Y. Chang, and M. Pecht, "Warpage analysis of flip-chip PBGA packages subject to thermal loading", IEEE Transactions on Device and Materials Reliability, 9(3), 419 (2009).   DOI
9 G. Kelly, C. Lyden, W. Lawton, J. Barrett, A.Saboui, H. Pape, and H. J. B. Peters, "Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs", IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 19(2), 296 (1996).   DOI
10 H.-W. Liu, Y.-W. Liu, J. Ji, J. Liao, A. Chen, Y.-H. Chen, N. Kao, and Y.-C. Lai, "Warpage characterization of panel fanout (P-FO) package", Proc. 64th Electronic Components and Technology Conference (ECTC), IEEE (2014).
11 C. Kim, H. Choi, M. Kim, and T.-S. Kim, "Packaging Substrate Bending Prediction due to Residual Stress (in Korean)", J. Microelectron. Packag. Soc., 20(1), 21 (2013).   DOI
12 S. C. Liu, and S. J. Hu, "Variation simulation for deformable sheet metal assemblies using finite element methods", Journal of manufacturing science and engineering, 119(3), 368 (1997).   DOI
13 D.-L. Chen., T.-C. Chiu, T.-C. Chen, M.-H. Chung, P.-F. Yang, and Y.-S. Lai, "Using DMA to simultaneously acquire Young's relaxation modulus and time-dependent Poisson's ratio of a viscoelastic material", Procedia Engineering, 79, 153 (2014).   DOI
14 D. K. Shin, Y. H. Song, and J. Im, "Effect of PCB surface modifications on the EMC-to-PCB adhesion in electronic packages", IEEE Transactions on Components and Packaging Technologies, 33(2), 498 (2010).   DOI