Measurement of EMC/PCB Interfacial Adhesion Energy of Chip Package Considering Warpage
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Kim, Hyeong Jun
(Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
Ahn, Kwang Ho (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST)) Oh, Seung Jin (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST)) Kim, Do Han (R&D Group, SIMMTECH Co.) Kim, Jae Sung (R&D Group, SIMMTECH Co.) Kim, Eun Sook (R&D Group, SIMMTECH Co.) Kim, Taek-Soo (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST)) |
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