• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2001.11a
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• pp.267-271
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• 2001

다이오드의 소신호 및 대신호 파라미터 추출은 DC 해석, 외부 기생 소자 추출, 마지막으로 5-파라미터에 의한 내부소자 추출로 이루어진다. DC IV-곡선과 S-파라미터의 curve-fitting으로 내부 파라미터를 구하였고 외부 기생소자는 바이어스에 따라 변하지 성질을 이용하였다. 사용된 소자는 Schottky diode는 SIEMENS사의 BAS125를, Varactor diode는 SONY사의 1t362를, PIN diode는 Hitachi사의 HVM14S를 모델로 사용하였다. 실측을 위해 사용된 소자는 각각 HP사의 HSMS-2822, SONY사의 1t362, HP사의 HSMP-3834을 이용하여 측정하였다.

• 전자공학회논문지 IE
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• v.44 no.2
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• pp.1-7
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• 2007

The increasing high frequency capabilities of CMOS have resulted in increased RF and analog design in CMOS. Design of RF and analog circuits depends critically on device S-parameter characteristics, magnitude of real and imaginary components and their behavior as a function of frequency. Utilization of scaled high performance CMOS technologies poses challenges as concerns for reliability degradation mechanisms increase. It is important to understand and quantify the effects of the reliability degradation mechanisms on the S-parameters and in turn on small signal model parameters. Various physical effects influencing small-signal parameters, especially the transconductance and capacitances and their degradation dependence, are discussed in detail. The measured S-parameters of H-gate and T-gate devices in a frequency range from 0.5GHz to 40GHz. All intrinsic and extrinsic parameters are extracted from S-parameters measurements at a single bias point in saturation. In this paper we discuss the analysis of the small signal equivalent circuits of RF SOI MOSFET's verificated for the purpose of exacting the change of parameter of small signal equivalent model followed by device flame.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.11 no.6
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• pp.876-885
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• 2000

A new and simple method is presented for determining the parasitic resistances of MESFET and HEMT from the measured S-parameters under normal active bias without depending on additional DC measurements or iteration or optimization process. The presented method is based on the fact that the difference between source resistance(Rs) and drain resistance(Rd) can be obtained from the measured Z-parameters under zero bias condition. It is possible to define the new internal device including intrinsic device and 3 parasitic resistances by elimination the parasitic inductances and capacitances from the measured S-parameters. Three parasitic resistances are calculated easily from the fact that the real parts of Yint,11 and Yint,12 of intrinsic Y-parameters are zero theoretically and the relations between S-,Z-, Y-matrices. The calculated parasitic resistances using the presented method and successively calculated equivalent circuit parameters give modeled S-parameters which are in good agreement with the measured S-parameters up to 400Hz.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.596-596
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• 2012

모듈 상태에서의 태양전지 효율에 영향을 주는 외부 요인으로는 풍력과 눈 등의 하중으로 인한 물리적 스트레스와 자외선을 포함하는 광범위한 파장 대역의 빛의 영향 등이 있다. 따라서 본 연구에서는 태양전지의 야외 노출 시간에 따른 소자의 특성 및 효율 변화를 분석하고자 효율이 17.14%인 결정질 태양전지를 18시간 야외에서 노출 시켜 6시간 간격으로 전기적 특성을 분석해 태양전지의 여러 파라미터 변화를 분석하고자 한다. 본 실험에서는 태양전지의 외부 노출에 의한 소자 특성 및 파미미터 변화를 확인하고자 일정 시간 간격으로 노출 된 solar cell에 대한 Dark I-V, Light I-V 측정을 하였다. DIV 측정을 통해 노출 시간이 증가할수록 동일전압 대비 current가 증가하는 것을 알 수 있었다. 또한 역방향 전압에서는 누설전류가 증가함을 확인하였다. Turn-on 전압 감소와 누설전류 증가, 직렬저항의 변화로 인한 소자의 파라미터 변화를 확인하기 위한 LIV 측정에서는 노출 시간 증가에 따라 단락전류 $0.177(mA/cm^2)$, 개방전압 2.699 (mV), 곡선인자 0.5%가 감소하였으며, 소자의 효율도 0.27% 감소하였다. 이처럼 태양전지의 외부 노출은 소자의 파라미터를 감소시키고 최종적으로 소자의 효율을 저해하는 원인이 됨을 확인하였다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.5
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• pp.1196-1202
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• 2013

This paper have analyzed the change of breakdown voltage for channel doping concentration and device parameters of double gate(DG) MOSFET using two dimensional potential model. The low breakdown voltage becomes the obstacle of power device operation, and breakdown voltage decreases seriously by the short channel effects derived from scaled down device in the case of DGMOSFET. The two dimensional analytical potential distribution derived from Poisson's equation have been used to analyze the breakdown voltage for device parameters such as channel length, channel thickness, gate oxide thickness and channel doping concentration. Resultly, we could observe the breakdown voltage has greatly influenced on device dimensional parameters as well as channel doping concentration, especially the shape of Gaussian function used as channel doping concentration.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2001.11a
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• pp.262-266
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• 2001

본 논문에서는 Excelics사의 EFA240D 모델을 이용하여 파라미터를 추출하였고, 파라미터 중 내부소자들은 ADS(Advanced Design System)의 SDD(Symbolically Defined Device)를 이용하여 정의하였다. 또한 내부소자들을 내부전압이 아닌 외부전압으로 정의하는 방법과 채널 전류를 DC와 AC로 나누어 모델링하는 방법을 제시하였다.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.18 no.1
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• pp.105-114
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• 2004

In this paper, we design the circuits for DC parameter test of semiconductor devices. The DC parameter tester is the system which inspects the DC parameters of semiconductor devices. In the designed circuits, voltage(current) forcing current(voltage) sensing methods are used to inspect the parameters. The designed circuits are simulated by OR-CAD. The simulation results have good performance.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.8
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• pp.808-820
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• 2014

In this paper, we fabricated two on-wafer type DUT(Device-Under-Test)s; a 10-dB attenuator and an amplifier using commercially available MMIC and we proposed the measurement method of the noise parameters for the two fabricated DUTs. Since the 10-dB attenuator DUT is a passive device, its noise parameters can be accurately determined when its S-parameters are measured. In the case of the amplifier DUT, its noise parameters are available in the datasheet. Hence, the measured noise parameters using the proposed method can be assessed by comparing with the known noise parameters. The noise parameter measurement method having been presented by the authors requires the S-parameters of the 8-port network used in the measurement and limited to coaxial type DUTs. When on-wafer probes are included in the 8-port network, the 8-port S-parameters requires the measurements with different kinds of connectors. In this paper, we obtained the 8-port S-parameters using the Smart-Cal function in the network analyzer. The measured noise parameters shows about ${\pm}0.2dB$ fluctuations for $NF_{min}$. Other noise parameters with the frequency change show good agreement with the expected results.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.10
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• pp.2403-2408
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• 2013

This paper has analyzed the change of forward and backward current for channel doping concentration to analyze off-current of double gate(DG) MOSFET. The Gaussian function as channel doping distribution has been used to compare with experimental ones, and the two dimensional analytical potential distribution model derived from Poisson's equation has been used to analyze the off-current. The off-current has been analyzed for the change of projected range and standard projected range of Gaussian function with device parameters such as channel length, channel thickness, gate oxide thickness and channel doping concentration. As a result, this research shows the off-current has greatly influenced on forward and backward current for device parameters, especially for the shape of Gaussian function for channel doping concentration.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.10a
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• pp.200-203
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• 2007

Devices of junction barrier schottky(JBS) structure using 4H-SiC substrates with wide energy band gaps was designed and fabricated. As a measurement results, the device of reverse I-V characteristics was shown as more than 1000 V, its design optimum length of p-grid was $3{\mu}m$ space. In this paper, I-V characteristics was modeled by using of device fabricated process conditions parameters and it was extracted that the I-V property parameters, and it was compared and analyzed with between device parameters and model parameters.