• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.43-43
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• 2003

WC/Co계 초경 합금은 각종 공구 및 내마모 부품으로서 널리 사용되고 있다. 초경 합금의 특성은 WC 분말 크기에 크게 좌우되며 일반적으로 입자의 크기가 미세해 질수록 기계적 특성이 향상되는 것으로 알려지고 있다. 이를 위하여 지금까지 많은 연구가 진행되고 있으나, 현재 액상 공정을 이용하여 약 100nm급의 초경 분말이 개발되어지고 있으며, 그보다 미세한 분말의 제조는 아직 이루어지고 있지 않은 실정이다. 그러나 최근 기상 반응을 이용하여 수nm급의 분말 제조가 가능하게 되었으나, 주로 산화물계에 분말 제조에 국한되고 있다. 본 연구에서는 이러한 기상 반응법을 이용하여 초경 합금의 핵심 소재인 WC분말을 합성하고자 하였으며, 이를 위하여 장치의 설계 및 제작, 그리고 공정별 특성에 대하여 연구하였다.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.277-280
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• 2001

국내 반도체 산업계의 메모리 반도체 생산규모는 세계 최대이지만 반도체 생산 장비는 대부분 수입에 의존하고 있다. 특히 lithography는 반도체 공정의 핵심일 뿐 아니라 반도체 기술 분야에서 국가의 총체적인 기술력을 대표한다. 2001년 7월에 과학 기술부가 나노급 lithography 장비 개발을 21세기 프론티어 사업으로 추진하기 위한 준비 작업에 착수하였다. 본 논문에서는 차세대 lithography로 채택된 EUV (Extreme Ultra Violet) lithography 장비 기술의 개요와 국내외 기술 개발 현황에 대하여 설명한다.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.327-330
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• 2004

It is shown that the hot carrier degradation due to enhanced hot holes trapping dominates PMOSFETs lifetime both in thin and thick devices. Moreover, it is found that in 0.13 ${\mu}m$ CMOSFET the PMOS lifetime under CHC (Channel Hot Carrier) stress is lower than the NMOSFET lifetime under DAHC (Drain Avalanche Hot Carrier) stress. Therefore. the interface trap generation due to enhanced hot hole injection will become a dominant degradation factor. In case of thick MOSFET, the degradation by hot carrier is confirmed using charge pumping current method and highly necessary to enhance overall device lifetime or circuit lifetime in upcoming nano-scale CMOS technology.

• Journal of the Korean Ceramic Society
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• v.46 no.1
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• pp.102-107
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• 2009

This study has been focused on an effective surface finishing method combining ELID (ELectrolytic In-process Dressing) and MAP (Magnetic Assisted Polishing) for the nano-precision mirror grinding of glass-lens molding mould. ELID grinding is an excellent technique for mirror grinding of various advanced metallic or nonmetallic materials. A polishing process is also required for elimination of scratches present on ELID grinded surfaces. MAP has been used as polishing method due to its high polishing efficiency and superior surface quality. It also presents some techniques for achieving the nanometer roughness of the hard material such as WC-Co, which are extensively used in precision tooling material.

• Proceedings of the KIEE Conference
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• 2005.07d
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• pp.2537-2539
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• 2005

In many cases the systems are so complex that it is not possible to obtain reasonable models using physical laws. Also a model based on physical laws contains a number of unknown parameters even if the structure is derived from physical laws. These problems can be solved by system identification. In this paper, a nano stage system is selected as an example for system identification. The transfer functions of this system is derived by using state-space model structure based on input/output data through experiment.

• Proceedings of the KIEE Conference
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• 2006.10c
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• pp.348-350
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• 2006

In this paper, we design a new controller for an ultra-precision positioning system. In general, time optimal control enables to reach a target position faster than others. However it shows a weakness to chattering effect. In order to solve the problem, a new control algorithm based on sliding mode control is proposed. The suggested controller is composed of LQR control and sliding mode control. By performing some simulations, we prove that the proposed controller is more robust than time optimal control under the circumstance of parameter uncertainties and external disturbances.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.93-94
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• 2006

나노급 CMOS 기술에서 high-k 물질을 이용하여 게이트 유전막을 형성하고자 하는 연구가 활발히 진행되고 있다. 본 논문에서는 high-k 물질인 $TiO_2$의 특성에 대한 연구를 수행하였다. $TiO_2$를 APCVD법으로 p-type 실리콘 기판에 $50{\AA}{\sim}300{\AA}$ 두께로 증착하였고, evaporator를 이용하여 $TiO_2$ 박막위에 Al을 증착하여 MIS소자를 제작하였다. 두께를 가변 하여 Capacitance-Voltage (C-V) 특성을 측정, 분석하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.1
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• pp.18-22
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• 2008

In this paper, the Ni-Co alloy was used for thermal stability estimation comparison with Ni structure. The proposed Ni/Ni-Co structure exhibited wider range of rapid thermal process windows, lower sheet resistance in spite of high temperature annealing up to $700^{\circ}C$ for 30 min, more uniform interface via FE-SEM analysis, NiSi phase peak. Therefore, The proposed Ni/Ni-Co structure is highly promising for highly thermal immune Ni-silicide for nano-scale MOSFET technology.

• Vacuum Magazine
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• v.2 no.3
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• pp.11-15
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• 2015

Particle characteristics diagnosis system (PCDS) was developed to measure submicron particle characteristics by modulation of particle beam mass spectrometry (PBMS) with scanning electron microscopy (SEM) and energy dispersive x-ray spectroscopy (EDS). It is possible to measure the particle size distribution in real-time, and the shape, composition can be measured in sequence keeping vacuum condition. Apparatus was calibrated by measuring the size classified NaCl particle which generated at atmospheric pressure. After the calibration, particles were sampled from the exhaust line of plasma enhanced chemical vapor deposition (PECVD) process and measured. Result confirms that PCDS is capable for analyzing particles in vacuum condition.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.81-85
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• 2006

In this study, we have been examined nano Injection Molding process which can improve transcription of 100nm-level pattern. We changed the various parameter (temperature of injection mold, clamp force, temperature of nozzle) which can be influence for improving transcription. And we measured and analyzed shapes of 100nm-level pattern by Automic Force Microscope for proving transcription. We made the Blu-ray Disc sample for proving transcription. And we measured HF-Signal and jitter. As a result, when the temperature of mold is more than $120^{\circ}C$ and the clamp force is more than 10 ton, We reached over 95 percent of transcription compared with stamper pattern. And we reached in-spec. value for HF-Signal and Jitter. Then we reached over 95 percent of transcription compared with stamper pattern.