1 |
H. Ohmori, and T. Nakagawa, “Analysis of Mirror Surface Generation of Hard and Brittle Materials by ELID (Electrolytic In-Process Dressing) Grinding with Superfine Grain Metallic Bond Wheels,” Annals of the International Academy for Production Engineering, 44 [1] 287-90 (1995).
DOI
ScienceOn
|
2 |
H. Ohmori and T. Nakagawa, “Mirror Surface Grinding of Silicon Wafer with Electrolytic In-process Dressing,” Annals of the International Academy for Production Engineering, 39 [1] 329-32 (1990).
|
3 |
H. Ohmori, K. Katahira, J. Nagata, M. Mizutani, and J. Komotori, “Improvement of Corrosion Resistance in Metallic Biomaterials by a New Electrical Grinding Technique,” Annals of the International Academy for Production Engineering, 51 [1] 491-94 (2002).
DOI
ScienceOn
|
4 |
M. Anzai, T. Sutou, H. Ohtaki, T. Obana, and T. Nakagawa, “Application of Magnetic Abrasive of Cemented Carbide using Diamond Paste,” Journal of the Japan Society of Powder and Powder Metallurgy, 39 [6] 510-14 (1992).
DOI
|
5 |
S.Katuo, “Grinding Mechanics,” YOKEDO, 46-7 (2004).
|
6 |
S. Beck, M. Cho, and W.Cho, “Mechanical Properies and End-milling Characteristic of AlN-hBN Based Machinable Ceramics,” J. Kor. Ceram. Soc., 45 [1] 75-81 (2008).
DOI
ScienceOn
|
7 |
T. Shinmura, Y. Hamano, and H. Yamaguchi, “A New Precision Deburring Process for Inside Tubes by the Application of Magnetic Abrasive,” Transactions of the Japan Society of Mechanical Engineers.C, 64 [620] 1428-34 (1998).
DOI
|