• Journal of Korea Foundry Society
• /
• v.20 no.2
• /
• pp.116-121
• /
• 2000

Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.

• Korean Journal of Materials Research
• /
• v.19 no.6
• /
• pp.337-343
• /
• 2009

In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.41 no.7
• /
• pp.665-671
• /
• 2017

The alkali-Metal Thermal-to-electric Converter (AMTEC) is one of the promising static energy conversion technologies for the direct conversion of thermal energy to electrical energy. The advantages over a conventional energy converter are its high theoretical conversion efficiency of 40% and power density of 500 W/kg. The working principle of an AMTEC battery is the electrochemical reaction of the sodium through an ion conducting electrolyte. Sodium ion pass through the hot side of the beta"-alumina solid electrolyte (BASE) primarily as a result of the pressure difference. This pressure difference across the BASE has a significant effect on the overall performance of the AMTEC system. In order to build the high pressure difference across the BASE, hermeticity is required for each joined components for high temperature range of $900^{\circ}C$. The AMTEC battery was manufactured by utilizing robust joining technology of BASE/insulator/metal flange interfaces of the system for both structural and electrical stability. The electrical potential difference between the anode and cathode sides, where the electrons emitted from sodium ionization and recombined into sodium, was characterized as the open-circuit voltage. The efforts of technological improvement were concentrated on a high-power output and conversion efficiency. This paper discusses about the joining and performance of the AMTEC systems.

• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.2 s.35
• /
• pp.121-128
• /
• 2005

Solder joints in microelectronic devices are frequently operated at an elevated temperature in service. They also experience plastic deformation caused by temperature excursion and difference in thermal expansion coefficients. Deformed solders can go through a recovery and recrystallization process at an elevated temperature, which would alter their microstructure and mechanical properties. In this study, to predict the changes in mechanical properties of Pb-free solder joints at high temperatures, the high temperature microhardness of several Pb-free and composite solders was measured as a function of temperature, deformation, and annealing condition. Solder alleys investigated include pure Sn, Sn-0.7Cu, Sn-3.5Ag, Sn-3.8Ag-0.7Cu, Sn-2.8Ag-7.0Cu (composite), and Sn-2.7Ag-4.9Cu-2.9Ni (composite). Numbers are all in wt.$\%$ unless specified otherwise. Solder pellets were cast at two cooling rates (0.4 and $7^{\circ}C$/s). The pellets were compressively deformed by $30\%$ and $50\%$ and annealed at $150^{\circ}C$ for 2 days. The microhardness was measured as a function of indentation temperature from 25 to $130^{\circ}C$. Their microstructure was also evaluated to correlate with the changes in microhardness.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.2
• /
• pp.49-55
• /
• 2011

The failure of electronic instruments is mostly caused by heat and shock. This shock causes the crack initiation at the solder joint interface of PCB component which is closely related with the formation of intermetallic compound(IMC). The Ag content in Pb-free Sn-xAg-0.5Cu solder alloy used in this study was 1.0, 1.2 and 3.0 wt.%, respectively. After soldering with PCB component, isothermal aging was performed to 1000 hrs. The growth of IMC layer was observed during isothermal aging. The drop impact property of solder joint was evaluated by impact bending test method. The solder joint made with the solder containing lower Ag content showed better impact bending property compared with that with higher Ag content. On the contrary to this result, the solder joint made with solder containing higher Ag content showed better impact bending property after aging. It should be caused by the formation of fine $Ag_3Sn$, which relieved the impact. It showed consequently the different effect of fine $Ag_3Sn$ and coarse $Cu_6Sn_5$ particles formed in the IMC layer on the impact bending property.

• Journal of the Korea Concrete Institute
• /
• v.14 no.3
• /
• pp.430-439
• /
• 2002

The development of reinforcing steel is required in reinforced concrete structures. The standard hooks that have been widely used for the tensile development in the beam-column joints tend to create difficulties of construction such as steel congestion as the member cross sections are becoming smaller due to the use of higher strength concrete and higher grade steel. Using the reinforcing bars with end mechanical anchoring device (headed reinforcement) provides potential economies in construction such as reduction in development lengths, simplified details, and improved responses to cyclic loadings. In this paper, the pullout strengths and behaviors of the headed reinforcement were experimentally studied. In 33 pullout tests performed using D25 deformed reinforcing bars, the test parameters were embedment depth, edge distance, head size, and the use of transverse reinforcement. The pullout strengths determined from tests closely agreed with the pullout strengths predicted using the CCD method. The pullout strengths increased with increasing embedment depths nd edge distances. The strengths tend to increase with the use of larger heads. From the experimental program where the effect of the transverse reinforcement was examined, a modification factor to the CCD was suggested to represent the effect of such reinforcement that is installed across the concrete failure plane on the pullout strengths.

• Journal of the Korean Recycled Construction Resources Institute
• /
• v.6 no.1
• /
• pp.66-71
• /
• 2018

In general, when an existing pier is enlarged and reinforced using a small diameter pile, bonded anchor with deformed reinforcing bars is used to maintain the integrity of the joint. However, in the case of bonded anchors, the performance depends largely on the type of joint material. Nevertheless, unlike mechanical anchors, there is no standard method for designing appropriate design methods and proper performance evaluation. Therefore, in this study, the performance of the anchoring anchor was evaluated by performing a model experiment using the reinforcing bars and anchor reinforcing bars. Experimental results show that the structural performance of the unbonded specimen is the best, and the failure mode is the punching shear failure. The deflection of the end of the member is smaller than that of the unconnected member, The deflection of the connected member is larger than the deflection of the small connected member. As the load increases, the possibility of slippage of the anchor steel or fold connection rebar is high.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.34 no.9
• /
• pp.1227-1233
• /
• 2010

In the hot section of a gas turbine, the turbine blades were protected from high temperature by providing a thermal barrier coating (TBC) as well as by cooling air flowing through internal passages within the blades. The cooling air then passed through discrete holes on the blade surface, creating a film of cooling air that further protects the surface from the hot mainstream flow. The holes are subjected to stresses resulting from the lateral growth of thermally grown oxide, the thermal expansion misfit between the constituent layers, and the centrifugal force due to high-speed revolution; these stresses often result in cracking. In this study, the deformation and cracks occurring near a hole on a heat-resistant alloy subjected to thermo-mechanical cycling were investigated. The experiment showed that cracks formed around the hole depending on the applied stress level and the number of cycles. These results could be explained by our analytic solution.

• Korean Journal of Metals and Materials
• /
• v.48 no.11
• /
• pp.1035-1040
• /
• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

• Korean Journal of Metals and Materials
• /
• v.50 no.1
• /
• pp.71-77
• /
• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.