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http://dx.doi.org/10.6117/kmeps.2011.18.2.049

Bending Impact Properties Evaluation of Sn-xAg-Cu Lead Free Solder Composition and aging treatment  

Jang, Im-Nam (Dept. of Materials Sci. & Eng., Pukyong National University)
Park, Jai-Hyun (Research Institute of Industrial Science & Technology, Pohang)
Ahn, Yong-Sik (Dept. of Materials Sci. & Eng., Pukyong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.2, 2011 , pp. 49-55 More about this Journal
Abstract
The failure of electronic instruments is mostly caused by heat and shock. This shock causes the crack initiation at the solder joint interface of PCB component which is closely related with the formation of intermetallic compound(IMC). The Ag content in Pb-free Sn-xAg-0.5Cu solder alloy used in this study was 1.0, 1.2 and 3.0 wt.%, respectively. After soldering with PCB component, isothermal aging was performed to 1000 hrs. The growth of IMC layer was observed during isothermal aging. The drop impact property of solder joint was evaluated by impact bending test method. The solder joint made with the solder containing lower Ag content showed better impact bending property compared with that with higher Ag content. On the contrary to this result, the solder joint made with solder containing higher Ag content showed better impact bending property after aging. It should be caused by the formation of fine $Ag_3Sn$, which relieved the impact. It showed consequently the different effect of fine $Ag_3Sn$ and coarse $Cu_6Sn_5$ particles formed in the IMC layer on the impact bending property.
Keywords
Sn-xAg-0.5Cu solder ball; Aging; bending impact property;
Citations & Related Records
Times Cited By KSCI : 5  (Citation Analysis)
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