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http://dx.doi.org/10.3740/MRSK.2009.19.6.337

Accelerated Thermo-Mechanical Fatigue Life of Pb-Free Solder Joints for PZT Ceramic Resonator  

Hong, Won-Sik (Physics-of-Failure Research Center, Korea Electronics Technology Institute)
Park, No-Chang (Physics-of-Failure Research Center, Korea Electronics Technology Institute)
Oh, Chul-Min (Physics-of-Failure Research Center, Korea Electronics Technology Institute)
Publication Information
Korean Journal of Materials Research / v.19, no.6, 2009 , pp. 337-343 More about this Journal
Abstract
In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.
Keywords
solder joint; Pb-free; thermo-mechanical; resonator; life prediction;
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Times Cited By KSCI : 2  (Citation Analysis)
Times Cited By SCOPUS : 0
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