Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package
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Lee, Young-Chul
(School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Kim, Kwang-Seok (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Ahn, Ji-Hyuk (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Yoon, Jeong-Won (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Ko, Min-Kwan (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University) |
1 | P. A. Aswatha Narayana and K. N. Seetharamu, Microelectron. Int. 23, 19 (2006). |
2 | Narendran, N., Y. Gu, J. P. Freyssinier, H. Yu, and L. Deng, J. Crystal Growth 268, 449 (2004). DOI ScienceOn |
3 | N. Narendran, and L. Deng, In IESNA Annu. Conf. Technical Paper, 157, Illuminating Engineering Society of North America, New York (2002). |
4 | J. W. Seo, H. S. Oh, K. M. Kang, S. M. Moon, J. S. Kwak, K. H. Lee, W. H. Lee, Y. H. Park, and H. S. Park, J. Kor. Inst. Met. & Mater. 46, 683 (2008). |
5 | J. W. Kim and S. B. Jung, Mater. Sci. Eng. A 371, 267 (2004). DOI ScienceOn |
6 | D. G. Kim, J. W. Kim, J. G. Lee, H. Mori, D. J. Quesnel, and S. B. Jung, J. Alloys Compd. 395, 80 (2005). DOI ScienceOn |
7 | D. G. Kim, J. W. Kim, and S. B. Jung, Mater. Sci. Eng. B 121, 204 (2005). DOI ScienceOn |
8 | W. H. Zhong, J. Alloys Compd. 414, 123 (2006). DOI ScienceOn |
9 | R. J. K. Wassink, Soldering in Electronics, 2nd ed., pp. 149-158, Electrochemical Publications, British Isles (1989). |
10 | Y. G. Lee, H. Y. Lee, J. T. Moon, J. H. Park, S. S. Han, and J. P. Jung, J. Kor. Inst. Met. & Mater. 47, 580 (2009). |
11 | I. E. Anderson and J. L. Harringa, J. Eletron. Mater. 33, 1485 (2004). DOI ScienceOn |
12 | J. M. Koo, B. Q. Vu, Y. N. Kim, J. B. Lee, J. W. Kim, D. U. Kim, J. H. Moon, and S. B. Jung, J. Electron. Mater. 37, 118 (2008). DOI ScienceOn |
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