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http://dx.doi.org/10.3365/KJMM.2010.48.11.1035

Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package  

Lee, Young-Chul (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Kim, Kwang-Seok (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Ahn, Ji-Hyuk (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Yoon, Jeong-Won (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Ko, Min-Kwan (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Publication Information
Korean Journal of Metals and Materials / v.48, no.11, 2010 , pp. 1035-1040 More about this Journal
Abstract
The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.
Keywords
intermetallics; bonding; mechanical properties; shear test; LED package;
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Times Cited By KSCI : 2  (Citation Analysis)
Times Cited By SCOPUS : 12
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