Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Effect of Heat Treatment on Mechanical Reliability of Solder Joints in LED Package

LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 열처리의 영향

  • Ko, Min-Kwan (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Ahn, Jee-Hyuk (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Lee, Young-Chul (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Kim, Kwang-Seok (SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University) ;
  • Yoon, Jeong-Won (Samsung Advanced Institute of Technology (SAIT)) ;
  • Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
  • 고민관 (성균관대학교 신소재공학과) ;
  • 안지혁 (성균관대학교 신소재공학과) ;
  • 이영철 (성균관대학교 신소재공학과) ;
  • 김광석 (성균관대학교 나노기술협동학부) ;
  • 윤정원 (삼성전자 삼성종합기술원) ;
  • 정승부 (성균관대학교 신소재공학과)
  • Received : 2011.08.08
  • Published : 2012.01.25
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Abstract

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

Keywords

Acknowledgement

Supported by : 지식경제부

References

  1. Y. C. Lee, K. S. Kim, J. H. Ahn, J. W. Yoon, M. K. Ko, and S. B. Jung, Kor. J. Met. Mater. 48, 1035 (2010).
  2. S. J. Kong, Y. S. Lu, M. L. Lee, W. C. Lai, C. H. Kuo, and C. J. Tun, Appl. Phys. Lett. 90, 263511 (2007).
  3. P. A. Aswatha Narayana, and K. N. Seetharamu, Microelectron. Int. 23, 19 (2006).
  4. C. J. Weng, Int. J. Heat Mass Transfer. 36, 245 (2009).
  5. K. C. Yung, H. Liem, H. S. Choy, and W. K. Lun, Int. J. Heat Mass Transfer. 37, 1266 (2010).
  6. H. W. Shin, H. S. Lee, J. O. Bang, S. H. Yoo, S. B. Jung, and K. D. Kim, J. Microelectron. Packag. Soc. 17, 95 (2010).
  7. D. M. Hong and S. J. Lee, Kor. J. Opt. Phot. 21, 118 (2010).
  8. J. W. Yoon, W. C. Moon, and S. B. Jung, Microelectron Eng. 83, 2329 (2006).
  9. J. W. Yoon, S. W. Kim, and S. B. Jung, J. Alloys Compd. 391, 82 (2005)
  10. M. Berthou, P. Retailleau, H. Fremont, A. Guedon-Gracia, and C. Jephos-Davennel, Microelectron Reliab. 49, 1267 (2009).
  11. D. G. Kim, J. W. Kim, S. S. Ha, B. I. Noh, J. M. Koo, D. W. Park, M. W. Ko, and S. B. Jung, J. Alloys Compd. 458, 253 (2008).
  12. P. Liu, P. Yao and J. Liu, J. Alloys Compd. 470, 188 (2009).
  13. D. H. Lee, B. M. Jung, and J. Y. Huh, Kor. J. Met. Mater. 48, 1041 (2010).
  14. D. G. Kim, J. W. Kim, J. G. Lee, H. Mori, D. J. Quesnel, and S. B. Jung, J. Alloys Compd. 395, 80 (2005).
  15. H. Tsukamoto, T. Nishimura, S. Suenaga, S. D. McDonald, K. W. Sweatman, and K. Nogita, Microelectron Reliab. 51, 657 (2011).
  16. J. H. Ahn, K. S. Kim, Y. C. Lee, Yongil Kim, and S. B. Jung. J. Microelectron. Packag. Soc. 17, 1 (2010).
  17. J. W. Yoon, S. W. Kim, and S. B. Jung, J. Alloys Compd. 392, 247 (2005).
  18. J. W. Sung, S. E. Pyo, J. M. Koo, J. W. Yoon, B. I. Noh, S. H. Won, and S. B. Jung, J. Microelectron. Packag. Soc. 16, 7 (2009).
  19. L. Yin, L. Yang, G. Xu, H. Yan, Y. Chen, W. Yang, S. Li, and J. Zhang, 12th int. conf. on ICEP-HDP, p.1-4, Shanghai, China.
  20. C. C. Tsai, M. H. Chen, Y. C. Huang, Y. C. Hsu, Y. T. Lo, Y. J. Lin, J. H. Kuang, S. B. Huang, H. L. Hu, Y. I. Su, and W. H. Cheng, IEEE J. Sel. Top. Quant. 15, 4 (2009).