Effect of Heat Treatment on Mechanical Reliability of Solder Joints in LED Package |
Ko, Min-Kwan
(School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Ahn, Jee-Hyuk (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Lee, Young-Chul (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Kim, Kwang-Seok (SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University) Yoon, Jeong-Won (Samsung Advanced Institute of Technology (SAIT)) Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University) |
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