• Korean Journal of Materials Research
• /
• v.17 no.2
• /
• pp.96-99
• /
• 2007

The effects of post-annealing of high-k $HfO_2$ thin films grown by atomic layer deposition method were investigated by the annealing treatments of $400-600^{\circ}C$. $Pt/HfO_2/p-Si\;MOS$ capacitor structures were fabricated, and then the capacitance-voltage and current-voltage characteristics were measured to analyze the electrical characteristics of dielectric layers. The X-ray diffraction analyses revealed that the $500^{\circ}C-annealed\;HfO_2$ film remained to be amorphous, and the $600^{\circ}C-annealed\;HfO_2$ film was crystallized. The annealing treatment at $500^{\circ}C$ resulted in the highest capacitance and the lowest leakage current due to the reduction of defects in the $HfO_2$ films and non-crystallization. Our results suggest that post-annealing treatments are a critical factor in improving the characteristics of gate dielectric layer.

• Journal of the Korean Magnetics Society
• /
• v.19 no.3
• /
• pp.113-119
• /
• 2009

$^{57}Fe_xCu_{1-x}O$(x = 0.0, 0.02) powders were prepared by sol-gel method and their crystallographic and magnetic hyperfine properties have been studied using X-ray diffraction and $M{\ddot{o}}ssbauer$ spectroscopy (MS). The crystal structure of the samples is found to be monoclinic without any secondary phases and their lattice parameters increase with increasing annealing temperature ($T_A$), which is attributed to an increase in oxygen-vacancy content. MS measurements at room temperature indicate that $Fe^{3+}$ ions substitute $Cu^{2+}$ sites and ferromagnetic phase grow with increasing $T_A$. Magnetic hyperfine and quadrupole interactions of $^{57}Fe_{0.02}Cu_{0.98}O$ ($T_A=500^{\circ}C$) in the antiferromagnetic state at 17 K have been studied, yielding the following results: $H_{hf}=426.94\;kOe$, ${\Delta}E_Q=-3.67\;mm/s$, I.S.=0.32 mm/s, ${\theta}=65^{\circ}$, ${\phi}=0^{\circ}$, and ${\eta}=0.6$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.73-73
• /
• 2009

트렌지스터의 채널 길이가 줄어듦에 따라 절연층으로 쓰이는 $SiO_2$의 두께는 얇아져야 한다. 이에 따라 얇아진 절연층에서 터널링이 발생하여 누설전류가 증가하게 되어 소자의 오동작을 유발한다. 절연층에서의 터널링을 줄여주기 위해서는 High-K와 같은 유전율이 높은 물질을 이용하여 절연층의 두께를 높여주어야 한다. 최근에 각광 받고 있는 High-K의 대표적인 물질은 $HfO_2$, $ZrO_2$와 $Al_2O_3$등이 있다. $HfO_2$, $ZrO_2$와 $Al_2O_3$는 $SiO_2$보다 유전상 수는 높지만 밴드갭 에너지, 열역학적 안정성, 재결정 온도와 같은 특성 면에서 $SiO_2$를 완전히 대체하기는 어려운 실정이다. 최근 연구에 따르면 기존의 High-K물질에 금속을 첨가한 금속산화물의 경우 밴드갭 에너지, 열역학적 안정성, 재결정 온도의 특성이 향상되었다는 결과가 있다. 이 금속 산화물 중 $HfAlO_3$가 대표적이다. $HfAlO_3$는 유전상수 18.2, 밴드캡 에너지 6.5 eV, 재결정 온도 $900\;^{\circ}C$이고 열역학적 안전성이 개선되었다. 게이트 절연층으로 사용될 수 있는 $HfAlO_3$는 전극과 기판사이에 적층구조를 이루고 있어, 이방성 식각인 건식 식각에 대한 연구가 필요하다. 본 연구는 $BCl_3$/Ar 유도결합 플라즈마를 이용하여 $HfAlO_3$ 박막의 식각 특성을 알아보았다. RF Power 700 W, DC-bias -150 V, 공정압력 15 mTorr, 기판온도 $40\;^{\circ}C$를 기본 조건으로 하여, $BCl_3$/Ar 가스비율, RF Power, DC-bias 전압, 공정압력에 의한 식각율 조건과 마스크물질과의 선택비를 알아보았다. 플라즈마 분석은 Optical 이용하여 진행하였고, 식각 후 표면의 화학적 구조는 X-ray Photoelectron Spectroscoopy(XPS) 분석을 통하여 알아보았다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.02a
• /
• pp.381-381
• /
• 2010

$(ZrO_2)_{0.66}(HfO_2)_{0.34}$ thin films as gate dielectrics have been proposed to overcome the problems of tunneling current and degradation mobility inachieving a thin equivalent oxide thickness. An extremely thin $SiO_2$ layer is used in order to separate the carrier in MOSFET channel from the dielectric field fluctuation caused by phonons in the dielectric which decreases the carrier mobility. The electronic and optical properties influenced the device performance to a great extent. $(ZrO_2)_{0.66}(HfO_2)_{0.34}$ dielectric films on p-Si (100) were grown by atomic layer deposition method, for which the conduction band offsets, valence band offsets and band gapswere obtained by using X-ray photoelectron spectroscopy and reflection electron energy loss spectroscopy. The band gap, valence and conduction band offset values for $(ZrO_2)_{0.66}(HfO_2)_{0.34}$ dielectric thin film, grown on Si substrate were about 5.34, 2.35 and 1.87 eV respectively. This band alignment was similar to that of $ZrO_2$. In addition, The dielectric function (k, $\omega$), index of refraction n and the extinction coefficient k for the $(ZrO_2)_{0.66}(HfO_2)_{0.34}$ thin films were obtained from a quantitative analysis of REELS data by comparison to detailed dielectric response model calculations using the QUEELS-$\varepsilon$(k, $\omega$)-REELS software package. These optical properties are similar with $ZrO_2$ dielectric thin films.

• Korean Journal of Materials Research
• /
• v.11 no.1
• /
• pp.3-7
• /
• 2001

$M\"{o}ssbauer$ spectra of the $Ni_{1+x}Ti_xFe_{2-2x}O_4$ systems ($0{\leqq}x{\leqq}0.7$), which appear as single phase spinel structure, were examined at RT. The $M\"{o}ssbauer$ spectra reveal two sextet for $0{\leqq}x{\leqq}0.3$, two sextet and a doublet for $0.4{\leqq}x{\leqq}0.6$, and a doublet for x=0.7 As x increases, the area ratio of B-site and A-site($A_B/A_A$) of the sextet decreases, and the area ratio of the doublet and the total areas($A_{doublet}/A_{tot.}$) increases. The isomer shift(I.S.) of A-site slightly increases and magnetic hyperfine fields($H_{hf}$) of two sites decrease as the increasing x. From these results, we have obtained the cation distributions of the samples and concluded that the increasing x leads to the decrease of covalency of $Fe^{3+}-O^{2-}$ bond in A-sites and A-B superexchange interactions.eractions.

• Journal of the Korean Chemical Society
• /
• v.26 no.4
• /
• pp.229-234
• /
• 1982

Using solution technique, sulfur in the sulfide ore was indirectly determined by X-ray fluorescence spectrometry. The sample was dissolved with the mixed solution of B$r_2$ and HN$O_3$, and Si$O_2$, a major constituent, was repelled from the solution by HF treatment several times, B$a^{2+}$ solution was added to the solution to precipitate the S$O^4_{2-}$ ion as BaS$O_4$. Measuring the fluorescent X-ray intensity of excess Ba2+ ion in the filtrate, the content of sulfur in the original ore was back-calculated. Comparing the results by this method with the gravimetric method, the mean difference was ${\pm}1.7%$ in the range of 20 to 40% of sulfur content and the method was tolerably reproducible.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.11a
• /
• pp.215-215
• /
• 2003

현재 이용되고 있는 위상 변위 마스크, 즉 Cr 계열의 마스크나 MoSiON 마스크는 DUV지역에서 낮은 굴절률을 갖는다. 그 겯과 마스크의 두께가 90 nm 이상이 되고, 웨이퍼에서 패턴 형성 시 에러율이 증가하게 된다. 본 연구에서는 DUV 지역에서 굴절률이 높을 것이라고 예상되는 Zr과 Hf의 oxide를 위상 변위 마스크 물질의 선정하고 각 물질의 전자 상태와 천이 상태를 분석하여 위상변위 마스크로써의 이용가능성을 연구하자 한다. 상온에서 Zr, Hf oxide의 안정한 구조는 cubic 구조와 monoclinic 구조이다. 현재 cubic 구조의 Zr, Hf oxide에 대한 전자 상태는 연구가 많이 되어 있는 반면 monoclinic 구조에서의 전자상태 연구는 미흡하다. 본 연구에서는 monoclinic 구조를 이용하여 Zr, Hf oxide의 클러스터 모델을 제작하였다. 제작된 클러스터 모델에 대하여 DV-X$\alpha$ 계산법을 적용, 기저상태의 전자상태를 계산하였다. 그리고 각 모델에서 Zr L-edge, Hf L-edge 그리고 O K-edge의 천이상태를 연구하여, 기저 상태의 전자상태와 천이상태를 연구하여 광학 성질과의 연관성을 연구하고자 하였다.

• Transactions on Electrical and Electronic Materials
• /
• v.9 no.1
• /
• pp.12-15
• /
• 2008

Hafnium oxynitride films have been deposited onto a silicon substrate by means of radio frequency (RF) reactive sputtering using a hafnium dioxide $(HfO_2)$ target with a variety of nitrogen! argon $(N_2/Ar)$ gas flow ratios. Auger electron spectroscopy (AES)results confirm that $N_2$ was successfully incorporated into the HfON films. An increase in the $N_2/Ar$ gas flow ratio resulted in metal oxynitride formation. The films prepared with a $N_2/Ar$ flow ratio of 20/20 sccm show (222), (530), and (611) directions of $HfO_2N_2$, and the (-111), (311) directions of $HfO_2$. From X-ray reflectometry measurements, it can be concluded that with $N_2$ incorporated into the HfON films, the film density increases. The density increases from 9.8 to $10.1g/cm^3$. XRR also reveals that the surface roughness is related to the $N_2/Ar$ flow ratio.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.22 no.5
• /
• pp.448-454
• /
• 2009

Hydrogen was produced from water plasma excited in high frequency (HF) inductively coupled tubular reactor. Mass spectrometry was used to monitor gas phase species at various process conditions, Water dissociation rate depend on the process parameters such as ICP power, $H_{2}O$ flow-rate and process pressure, Water dissociation percent in ICP reactor decrease with increase of chamber pressure, while increase with increase of ICP power and $H_{2}O$ flow rate. The effect of $CH_4$ gas addition to a water plasma on the hydrogen production has been studied in a HF ICP tubular reactor. The main roles of $CH_4$ additive gas in $H_{2}O$ plasma are to react with 0 radical for forming $CO_x$ and CHO and resulting additional $H_2$ production. Furthermore, $CH_4$ additives in $H_{2}O$ plasma is to suppress reverse-reaction by scavenging 0 radical. But, process optimization is needed because $CH_4$ addition has some negative effects such as cost increase and $CO_x$ emission.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.1
• /
• pp.39-45
• /
• 2012

Three-dimensional integrated circuit(3D IC) technology has become increasingly important due to the demand for high system performance and functionality. In this work, BOE and HF wet etching of Cu line surfaces after CMP were conducted for Cu-Cu pattern direct bonding. Step height of Cu and $SiO_2$ as well as Cu dishing after Cu CMP were analyzed by the 3D-Profiler. Step height increased and Cu dishing decreased with increasing BOE and HF wet etching times. XPS analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE and HF wet etching treatment. BOE treatment showed not only the effective $SiO_2$ etching but also reduced dishing and Cu surface oxide rather than HF treatment, which can be used as an meaningful process data for reliable Cu-Cu pattern bonding characteristics.