References
- H.S. Momose, M. Ono, T. Yoshitomi, T. Ohguro, S.-I. Nakamura, M. Saito and H. Iwai, IEDM Technical Digest, 593 (1994) https://doi.org/10.1109/IEDM.1994.383340
- J.- Y. Zhang., I. W. Boyd, B. J. O'Sullivan, P. K. Hurley, P. V. Kelly and J.-P. Senateur, J. Non-Cryt. Solids, 303, 134 (2002) https://doi.org/10.1016/S0022-3093(02)00973-0
- J. H. Hong, W. J. Choi and J. M. Myoung, Microelectron. Eng., 70(1), 35 (2003) https://doi.org/10.1016/S0167-9317(03)00388-5
- P. Balk, Adv. Mater., 7, 703 (1995) https://doi.org/10.1002/adma.19950070804
- J. H. Hong, T. H. Moon and J. M. Myoung, Microelectron. Eng., 75, 263 (2004) https://doi.org/10.1016/j.mee.2004.05.008
- Y. Oshita, A. Ogura, A. Hoshino, T. Suzuki, S. Hiiro and H. Machida, J. Cryst. Growth, 235, 365 (2002) https://doi.org/10.1016/S0022-0248(01)01833-4
- K. Kukli, M. Ritala, T. Sajavaara, J. Keinonen and M. Leskela, Thin Solid Films, 416, 72 (2002) https://doi.org/10.1016/S0040-6090(02)00612-0
- J. Lee and C. Lee, Kor. J. Mater. Res., 15(11), 741 (2005) https://doi.org/10.3740/MRSK.2005.15.11.741
- K. Kukli, J. Ihanus, M. Ritala and M. Leskela, Appl. Phys. Lett., 68, 3737 (1996) https://doi.org/10.1063/1.115990
- E. P. Gusev, C. Cabral Jr., M. Copel, C. D'Emie and M. Gribelyuk, Mieroeleetron. Eng., 69, 145(2003) https://doi.org/10.1016/S0167-9317(03)00291-0
- B. C. M. Lai, N. H. Kung and J. Y. M. Lee, J. Appl. Phys., 85, 4087 (1999) https://doi.org/10.1063/1.370315
- Y. Taur and T.H. Ning, Fundamentals of Modem VLSI Devices (Cambridge University Press, New York, 1998), p. 82-86
- N. A. Chowdhury, R. Garg and D. Misra, Appl. Phys. Lett., 85, 3289, (2004) https://doi.org/10.1063/1.1805708
- T. H. Moon, M. H. Ham and J. M. Myoung, Appl. Phys. Lett., 86(10), 102903 (2005) https://doi.org/10.1063/1.1873049
- H. J. Song, C. S. Lee and S. W. Kang, Eleetroehem. Solid State Lett., 4, F13, (2001) https://doi.org/10.1149/1.1377835