Titanium and its alloys were brazed in the range of $850-950^{\circ}C$ within 10 min. of brazing time using expensive infra red or other heating methods. However, brazing time needs to be extended to get temperature-uniformity for mass production by using continuous belt type furnace or high vacuum furnace with low heating rate. This study examined effects of holding temperature for 60 min, on microstructure and mechanical properties of titanium alloys. Mechanical properties of titanium alloys were drastically deteriorated with increasing holding temperature followed by grain growth. Maximum holding temperatures for CP (commercial pure) titanium and Ti-6Al-4V were confirmed as $800^{\circ}C$ and $850^{\circ}C$, respectively. Both titanium alloys were successfully brazed at $800^{\circ}C$ for 60 min. with the level of base metal strengths by using Zr based filler metal, $Zr_{54}Ti_{22}Ni_{16}Cu_8$.

The microstructure of Cu-Mg-P alloy sheet consisted of Cu matrix and very fine MgP precipitate, and it has been observed that the microstructure remains virtually unchanged by Ag additions up to 2%. Ag solutes were dissolved into the matrix and hardly found in the precipitates. The hardness increased with increase of the Ag content, while the conductivity slightly decreased. Strain hardening through cold rolling was found to be effective in improving the hardness, especially in high-Ag alloys. Aging treatment was conducted either before the first cold rolling or between the first and the final cold rolling, and the conductivity was significantly higher at the former case, regardless of the Ag content. Softening of Cu-Mg-P alloy sheet was remarkable above $400^{\circ}C$ and the Ag content did not show any significant effect on it.

The enhancement of adhesion for Cr film on polycarbonate (PC) substrate with electron irradiation treatment was considered. The electron treatment changes the contact angle of the PC substrates. As increase the electron energy from 300 eV to 900 eV, the contact angle decreases from $90^{\circ}$ to $60^{\circ}C$. It is supposed that electron treatment changes the chemical property of PC substrate into hydrophilic one. The micro surface roughness was also affected by electron treatment. The PC substrates irradiated with intense electron beam of 900 eV show the rougher surface than those of other PC substrates. Cr thin films deposited on the PC substrate treated with electron irradiation at 900 eV show the higher adhesion than that of the Cr thin film deposited untreated bare PC substrates.

The cylindrical magnetron sputtering has not been widely used, although this system is useful for only certain types of applications such as fiber coatings. This paper presents electrode configurations which improved the complicacy of the target assembly by using the positive voltage power supply. It is a modified type which has a target constructed with a large cylindrical part, a conical part and a small cylindrical part. When positive voltage was applied to an anode, a stable glow discharge was established and a high deposition rate was obtained. The substrate bias current was monitored to estimate the effect of ion bombardment. As a result, it was found that the substrate current was large. With cylindrical and conical cathode magnetron sputter deposition on the surface of the substrate to prevent re-sputtering, ion impact because it can increase the effectiveness with excellent ductility and adhesion of Ti film deposition can be obtained. We board at the front end of the ground resistance of $5\;k{\Omega}$ attached to the substrate potential can be controlled easily, and Ti film deposition with excellent adhesion can be obtained. Microstructure and morphology of Ti films deposited on pure Cu wires were investigated by scanning electron microscopy in relation to preparation conditions. High level ion bombardment was found to be effective in obtaining a good adhesion for Cu wire coatings.

Titanium nitride (TiN) films were deposited on the polycarbonate substrate by using radio frequency (RF) magnetron sputtering without intentional substrate heating. After deposition, the films were bombarded with intense electron beam for 20 minutes. The intense electron irradiation impacts on the crystalline, hardness and surface roughness of the TiN films. The films irradiated with an electron beam of 300 eV show the small grains on the surface, while as deposited TiN films did not showany grains on the surface. Also the surface harness evaluated with micro indenter was increased up to 18 Gpa at electron energy of 900 eV after electron beam irradiation. In addition, surface root mean square (RMS) roughness of the films irradiated with intense electron beam affected strongly. The films irradiated by electron beam with 900 eV have the lowest roughness of 1.2 nm in this study.