Journal of the Korean Society for Heat Treatment (열처리공학회지)

The Korean Society for Heat Treatment (한국열처리공학회)
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Influence of Ag Addition on the Mechanical Properties and Electrical Conductivity of Cu-Mg-P Alloys

Cu-Mg-P 합금의 기계적 성질과 전기전도도에 미치는 Ag첨가의 영향

  • Kim, Jeong-Min (Division of Advanced Materials Engineering, Hanbat National University) ;
  • Park, Joon-Sik (Division of Advanced Materials Engineering, Hanbat National University) ;
  • Kim, Ki-Tae (Incheon R&D Center, Korea Institute of Industrial Technology)
  • 김정민 (한밭대학교 신소재공학부) ;
  • 박준식 (한밭대학교 신소재공학부) ;
  • 김기태 (한구생산기술연구원 인천연구센터)
  • Received : 2009.12.07
  • Accepted : 2009.12.15
  • Published : 2010.01.30
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Abstract

The microstructure of Cu-Mg-P alloy sheet consisted of Cu matrix and very fine MgP precipitate, and it has been observed that the microstructure remains virtually unchanged by Ag additions up to 2%. Ag solutes were dissolved into the matrix and hardly found in the precipitates. The hardness increased with increase of the Ag content, while the conductivity slightly decreased. Strain hardening through cold rolling was found to be effective in improving the hardness, especially in high-Ag alloys. Aging treatment was conducted either before the first cold rolling or between the first and the final cold rolling, and the conductivity was significantly higher at the former case, regardless of the Ag content. Softening of Cu-Mg-P alloy sheet was remarkable above $400^{\circ}C$ and the Ag content did not show any significant effect on it.

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References

  1. D. P. Lu, J. Wang, W. J. Zeng, Y. Liu, L. Lu and B. D. Sun : Mater. Sci. Eng. A, 421 (2006) 254. https://doi.org/10.1016/j.msea.2006.01.068
  2. J. H. Choi and D. N. Lee : Mater. Sci. Eng. A, 458 (2006) 295.
  3. D. A. Hay and P. T. Gregg : Wire Journal, 12(9) (1979) 132.
  4. J. M. Kim, J. S. Park and K. T. Kim : J. Korean Soc. Heat Treatment, 20 (2007) 318.
  5. Edited by E. Ling and P. W. Taubenblat : Proc. of High Conductivity Cu & AI Alloys, AIME Annual Meeting, "Properties and applications of high strength, high conductivity coppers and copper alloys", (1984) 19.
  6. J. B. Liu, L. Meng and Y. W. Zeng : Mater. Sci. Eng. A, 435-436 (2006) 237. https://doi.org/10.1016/j.msea.2006.07.125
  7. J. Crane and S. Shapiro : US Patent, "High conductivity high temperature copper alloy", 4, 202, 688 (1980).
  8. K. T. Kim, W. J. Jung, H. C. Shin and C. S. Choi : J. Korean Soc. Heat Treatment, 14 (2001) 17.
  9. A. Gaganov, J. Freudenberger, E. Botcharova and L. Schultz : Mater. Sci. Eng. A, 437 (2006) 313. https://doi.org/10.1016/j.msea.2006.07.121
  10. F. A. Guo, C. J. Xiang, C. X. Yang, X. M. Cao, S. G. Mu and Y. Q. Tang : Mater. Sci. Eng. B, 147 (2008) 1. https://doi.org/10.1016/j.mseb.2007.10.011