General chip SMD parts(chip resistance, chip capacitor, chip varistor etc.) are very wide sed electronics parts for IT units. But, failure modes are indistinct for these chip parts. In factory and field the failure modes are recognized to accidental failure mope caused by potential defect. In this paper used chip varistor ALT(Accelerate Life Test) test for verify general failure modes in chip SMD parts. Also the results are useful for general chip SMD ALT tests.

The failure of geogrids used for soil reinforcement application can be defined as an excessive creep strain which causes the collapse of slopes and embankments. Accordingly, the lifetime is evaluated as a time to reach the excessive creep strain using two accelerated creep testing methods, time-temperature superposition(TTS) and stepped isothermal methods(SIM). TTS is a well-accepted acceleration method to evaluate creep behavior of polymeric materials, while SIM was developed in the last ten years mainly to shorten testing time and minimize the uncertainty associated with inherent variability of multi-specimen tests. The SIM test is usually performed using single rib of geogrids for temperature steps of $14^{\circ}C$ and a dwell time of 10,000 seconds. However, for multi-ribs of geogrids, the applicability of the SIM has not been well established. In this study, the creep behaviors are evaluated using multi-ribs of polyester geogrids using SIM and TTS creep procedures and the newly designed test equipment. Then the lifetime of geogrids are predicted by analyzing the failure times to reach the excessive creep strains through reliability analysis.

In this paper, accelerated life testing(ALT) method and procedures for a are developed and applied to assess the reliability of the product. Relay is a device that can open and close the electric circuit electrically and is used for protecting and controlling the load. In this study, an accelerated life test method for predicting the mechanical life of a relay is developed using the relationship between stresses, failure mechanism and life characteristics of products. Using the ALT method, we performed life tests and analyzed the tests results. The proposed method and procedures may de extended and applied to testing similar kinds of products to reduce test times and costs of the tests remarkably.

Optimality for block designs have received much attention in the literature. Here we review these criteria and present results showing their A,D and E connection. Also we acquainted with the mathematical methods of designing optimal experiments. In this paper, we will to do work about optimality in experimental designs.

This paper introduces models for preventive maintenance policies and considers periodic preventive maintenance policy with minimal repair when the failure of system occurs. It is assumed that minimal repairs do not change the failure rate of the system. The failure rate under prevention maintenance received an effect by a previously prevention maintenance and the slope of failure rate increases the model where it considered. Also the start point of failure rate under prevention maintenance considers the degradation of system and that it increases quotient, it assumed. Per unit time it bought an expectation cost from under this prevention maintenance policy. We obtain the optimal period time and the number for the periodic preventive maintenance by using Nakagawa's Algorithm, which minimizes the expected cost rate per unit time. Finally, it suppose that the failure time of a system has a Weibull distribution as an example and we obtain an expected cost rate per unit time the optimal period time and the number when cost of replacement and cost of minimal repair change.

In this paper, we consider a periodic preventive maintenance(PM) policy in which each PM reduces the hazard rate of amount proportional to the failure intensity, which increases since the last PM and slows down the wear-out speed to that of new one. And the proportion of reduction in hazard rate decreases with the number of PMs. Our model is similar to $ARI_1$ proposed by Doyen and Gaudoin(2004) in the sense of reduction of hazard rate. Our model has totally different wear-out pattern of hazard rate after PM's, however, and the proportion of reduction depends on the number of PM's. Assuming that the system undergoes only minimal repairs at failures between PM's, the expected cost rate per unit time is obtained. The optimal number N of PM and the optimal period x, which minimize the expected cost rate per unit time are discussed. Explicit solutions for the optimal periodic PM are given for the Weibull distribution case.

In this paper, we propose a Bayesian approach to determine the adaptive preventive maintenance(PM) policy for a general sequential imperfect PM model proposed by Lin, Zuo and Yam(2000) that PM not only reduces the effective age of the system but also changes the hazard rate function. Assuming that the failure times follow Weibull distribution, we adopt a Bayesian approach to update unknown parameters and determine the Bayesian optimal sequential PM policies. Finally, numerical examples of the optimal adaptive PM policy are presented for illustrative purposes.

Nowadays, most industries take $B_{6\sigma}$ quality level as a goal of the ultimate quality level of their products. On the other hand, $B_{10}$ to life indicates the time that $10\%$ of products are failed. There is no relation between the $B_{6\sigma}$ quality level and the $B_{10}$ to life. Therefore, some industries perform their quality control activities and reliability engineering activities separately. So I propose one measure which can express quality and reliability level simultaneously for the products to pursue quality and reliability activities together in the industry.

When a failure or fault is detected, the product is adjusted or design change and is returned to its original condition before the failure or fault. Continuous improvement of the FMEA system is to determine an optimum product reliability that minimizes the total cost per unit time associated with inspection, repair, and the nondetection cost.

신뢰성성장시험관리는 제품개발프로그램의 초기단계에서 고장모드를 확인하고, 이를 개선 또는 제거하기 위해 설계를 변경하고, 그 결과 진행되는 신뢰성이 향상되는 변화를 추적할 수 있는 실용적인 방법이다. 본 연구의 목적은 AMSAA(Army Materiel Systems Analysis Activity)모델을 이용하여 신뢰성 성장을 계획하고 평가할 수 있는 실용적인 방법을 제시하는데 있다. 시험-개선 과정을 통하여 성장하는 신뢰성 수준의 변화에 대한 추적과 예측 가이드라인을 제시함으로써 현장에서 활용할 수 있는 방법을 보여준다.

신뢰성은 학문의 성격상 복합 학문이다. 왜냐하면 제품 또는 시스템의 신뢰성을 높이기 위해서는 기계, 전자, 통신 등 공학에 대한 지식은 물론 통계학 및 경영학에 대한 지식도 필요하기 때문이다. 따라서 용어의 통일은 필수적이다. 본 연구에서는 본 사업의 추진 배경, 연구방법, 연구범위 및 내용, 추후연구계획 등에 대해 소개한다.

In the calendar and the advertising catalog, the surface Is usually coated by coating polypropylene film. The delamination failure of coating film depends on surface roughness and quality of the substrate paper. In this paper, the mechanisms of delamination failure between the coating film and the paper is investigated by using the root cause analysis as one of techniques of reliability evaluation. The papers used in failure analysis are three kind products made by two domestic and one foreign companies. It found that the main causes of delamination failure between the coating film and the paper were the creation of microvoids caused by shape of filler and their growth caused by contraction of paper.

Software system which is essential in operating the computer has gradually become an indispensable element in many aspects of our daily lives and an important factor in numerous systems. In recent years, software cost sometimes exceeds the cost of maintaining the hardware system. In addition to the cost necessary to develop the new software system and to maintain the system, the penalty costs incurred due to software failures are even more significant. In this paper, a cost model incorporating the warranty cost, debugging costto remove each fault detected in the software system, and delivery delay cost is developed. A software reliability model based on non-homogeneous Poisson process(NHPP) is established and the optimal software release policies to minimize the expected total software cost are discussed. Numerical examples are provided to illustrate the results.

In this paper, we generalize the software reliability growth model by assuming that the testing cost and maintenance cost are random and adopts the Bayesian approach to determine the optimal software release time. Numerical examples are provided to illustrate the Bayesian method for certain parametric models.

Cox's proportional hazards model (PHM) has been widely applied in the analysis of lifetime data, and it can be characterized by the baseline hazard function and covariates influencing systems' lifetime, where the covariates describe operating environments (e.g. temperature, pressure, humidity). In this article, we consider the constant baseline hazard function and a discrete random variable of a covariate. The estimation procedure is developed in a parametric framework when there are not only complete data but also incomplete one. The Expectation-Maximization (EM) algorithm is employed to handle the incomplete data problem. Simulation results are presented to illustrate the accuracy and some properties of the estimation results.

시점이 1개 있고 연결되어야 할 단말이 다수개인 K-terminal 네트웍의 신뢰도 구조에서 신뢰도를 구하는 알고리즘을 제안하였다. 네트웍 구조의 신뢰도 계산은 일반으로 NP-hard 문제인데 여기서 새로운 해법을 제안한다. 두 가지 개념이 중요한 점인데 첫째는 분해법이고 두 번째는 재귀식 계산 방법이 가능한 점이다. 분해법을 할 때 키스톤 부품을 찾아내는 번거로운 절차 대신 시점으로 부터 전진방향(forward)으로 하나씩 구성품을 선택하여 분해한다. 이러한 방법은 어떠한 키스톤 부품을 선택해야 할지 기준을 생각할 필요가 없으므로 간단하며 알고리즘을 간단하게 만든다. 또한 이 방법에서는 분해에 의해서 두 개의 하위 문제가 생성되고 원 문제와 재귀관계를 수립할 수 있다. 이러한 재귀식 알고리즘은 컴퓨터 프로그램을 간단하게 만든다. 또한 하위 문제는 기억장치에 저장해 두고 차례로 계산에 사용한다.

휘도(Luminance)는 냉음극 형광램프(Cold Cathode Fluorescent Lamp : CCFL)의 신뢰성을 평가하는데 있어 중요한 항목으로 사용되고 있다. 본 연구에서는 휘도 측정시 주위 온도 및 습도에 따라 측정감이 어떻게 변화하는가를 일반화 선형모형(Generalize Linear Model)을 이용하여 알아보고, 측정시의 환경조건 및 측정 오차에 대한 지침을 제시할 수 있게 된다.

전자 패키지가 열을 받을 때 회로기판과 칩의 열팽창계수 차이에 의해 발생되는 응력은 솔더 조인트의 파손에 영향을 미친다. 본 연구에서는 이 영향을 정량적으로 규명하기 위하여 열충격시험기를 이용해 얻어진 솔더조인트의 전기저항 변화와 수명과의 상관관계를 규명하였고, BGA 솔더조인트의 수명을 정량적으로 도출하였다. 또한 Sn-3.5Ag-0.5Cu 무연솔더와 63Sn-37Pb 유연솔더를 위의 실험에 동시에 적용시켜 건전성을 FORM(first-order reliability method)과 Weibull Function Model을 이용해 비교하였다.

It is not easy to apply fault-tolerant techniques which are used in conventional computer systems successfully to the field of embedded computing system directly. In this paper, we study on the way of minimizing hardware and/or software backups for vehicle embedded computing systems. First, we group parts that constitute vehicle embedded systems and next feature subset is determined using the grouping information derived. The possibility of implementing graceful degradation capability in vehicle embedded systems is verified.

Recently, various plastics are used for improvement of reliability and thermal stability of electronic goods. But, it is difficult to choose suitable balance of grade resin to each other product property. Selection of high efficiency resin is becoming inescapable circumstance according to change of reflow temperature of product and development of product following to lead free. Using a inexpensive and reasonable resin, that sustain a uniform performance of product quality. It is make a robust product and increase a company's competitive power. Hereupon, I introduce example that use ESPI methods of thermal deformation analysis of product using in our company product. I try to refer to a structural weak point detection of real time measurement of electronic parts instead of mechanical and chemical measurement of specimen type.

Accelerated life test models and procedure are developed to assess the reliability of Door switch. The main function of door switch is to operate bulb lamp and fan motor. The accelerated life test method and test equipments are developed using the relationship between stresses and life characteristics of the products. Using the developed accelerated life test method, the parameters of the ALT model and life time distribution are estimated and the reliability of the Door S/W at use condition if assessed. The proposed accelerated life test method and procedure may be extended and applied to testing similar kinds of products to reduce test time and costs of the tests remarkably.

In evaluation of electronic reliability on the PCB(Printed Circuit Board),electrochemical migration is one of main test objects. The phenomenon of electrochemical migration occurs In the environment of the high humidity and the high temperature under bias through a continuous aqueous electrolyte. In this paper, the generating mechanism of electrochemical migration is investigated by using water drop acceleration test under various waters. The waters used in the water drop test are city water, distilled water and ionic water. It found that the generated velocity o of electrochemical migration depended on the temperature of water and the electrolyte quantity which included in the various waters.

The bolts used for the electronic parts of a car a is the important parts which carry out an electric and physical performance. At the time of storage, transportation and use, Corrosion occurs in bolts under the influence of environmental factor. During the period exported especially overseas the chemical corrosion by the chlorine ion contained in the atmosphere occurs frequency. Then, The failure mechanism over corrosion is investigated and we consider to the design procedure of a environmental examination. We are going to select the proper plating thickness of bolts through a salt spray test, for investigating the corrosion resistance of bolts.

신뢰성 보증을 위한 인증시험(reliability qualification test)이나 수락시험(reliability acceptance test)에 있어서 가장 널리 사용되는 시험방식 중의 하나가 무고장 시험방식(zero-failure test)이다. 무고장 시험방식이 선호되는 이유는 요구수명을 주어진 신뢰수준으로 보장하는 시험방식들 중에서 적용이 비교적 수월하며 상대적으로 시험기간이나 시료수를 줄일 수 있다는 점 때문이다. 그러나 무고장 시험의 경우, 시험을 의뢰하는 입장에서는 고장이 하나라도 발생하면 불합격 된다는 부담감을 가질 수 있으며 생산자 위험이 커진다는 단점도 가지고 있다. 본 연구에서는 이러한 문제를 보완한 2단계 시험방식을 설계, 제안하고 시험시간, OC곡선 등 시험방식의 특성을 무고장 시험방식과 비교, 분석하였다.

The restriction of the use of hazardous substances in electrical and electronic equipment legislation mandates the substitution of lead and other hazardous substances in electronics products by July 2006. Due to this legislative pressure, the electronics industry is moving to adoption of lead free solders. In this paper, we investigated a flux to restrict generating electrochemical migration in lead-free solder. The lead-free solders used in this study were Sn-0.7Cu-0.01P and Sn-3.0Ag-0.5Cu. To measure the resistance of electrochemical migration, the dew-cycle test and water drop test were adopted. As the result, now flux having high durable of electrochemical migration was developed.

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

The required standards for environmental tests for communication and electronic equipment used currently are not standards into which the Korean climate and use environment are taken into consideration. But the most used environmental testing standards of the U.S. army(MIL-STD-810) has been used without taking into consideration the Korean domestic situation and conditions by simply translating the US standards. Adherence to these standards may increase in the manufacturing costs according to excessively strict standards. Therefore, this paper will propose a new environmental test standards for temperature.