• 한국재료학회지
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• 제19권5호
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• Journal of Welding and Joining
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• 제29권1호
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• pp.46-51
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• 2011

TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.

• Nuclear Engineering and Technology
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• 제51권1호
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• pp.45-53
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• 2019

Thermal-hydraulic passive safety systems (PSSs) are incorporated into many advanced reactor designs on the bases of simplicity, economics and inherent safety nature. Several factors among which are the critical parameters (CPs) that influence failure and reliability of thermal-hydraulic (t-h) passive systems are now being explored. For simplicity, it is assumed in most reliability analyses that the CPs are independent whereas in practice this assumption is not always valid. There is need to critically examine the dependency influence of the CPs on reliability of the t-h passive systems at design stage and in operation to guarantee safety/better performance. In this paper, two multivariate analysis methods (covariance and conditional subjective probability density function) were presented and applied to a simple PSS. The methods followed a generalized procedure for evaluating t-h reliability based on dependency consideration. A passively water-cooled steam generator was used to demonstrate the dependency of the identified key CPs using the methods. The results obtained from the methods are in agreement and justified the need to consider the dependency of CPs in t-h reliability. For dependable t-h reliability, it is advisable to adopt all possible CPs and apply suitable multivariate method in dependency consideration of CPs among other factors.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• 전력전자학회논문지
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• 제27권1호
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• pp.56-62
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• 2022

In this paper, the effect of pulse width modulation methods on thermal loadings and power losses of single-phase five-level NPC inverters for photovoltaic systems are analyzed. The pulse width modulation methods affect the power losses of the NPC inverters and thus lead to different thermal loadings of NPC inverters. To identify the reliability-critical power device with respect to thermal stress, the thermal loadings of I- and T-type NPC inverters are analyzed by applying the unipolar pulse modulation method. Then, the effect of the discontinuous pulse width modulation method on power losses and thermal loadings of power devices of I- and T-type NPC inverters are analyzed. Finally, the operation of NPC inverters applying the discontinuous pulse modulation method is confirmed by experiments. The results show that the discontinuous pulse modulation method is able to improve the reliability of NPC inverters by reducing thermal loadings of reliability-critical power devices and it is more effective for T-type NPC inverters than I-type NPC inverters.

• 한국재료학회지
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• 제17권3호
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• 한국정밀공학회지
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• 제28권8호
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• pp.894-903
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• 2011

In this paper, the capability index is introduced in order to improve the reliability of new concept machine tools and the method to improve the machine accuracy from the analysis of cutting process, statistical methodology and influence factors are proposed. In addition, the rib structure of bed and column in machine tools is analyzed by using the thermal impact method in order to analogize the rib pattern which has the small thermal deformation under thermal boundary condition. In the analysis of column rib structure, thermal boundary condition is separated to heat conduction and heat transfer to appropriate real boundary condition. Finally, performance chart of bed and column rib structure is provided for designer to estimate each rib pattern and select rib structure appropriating to thermal condition.

• 한국신뢰성학회지:신뢰성응용연구
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• 제5권4호
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• pp.439-450
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• 2005

Thermal deformation of Digital Television effect friction noise directly. However there was no methods to find and to solve the thermal friction noise which is huge problem in Digital Television In this study, to figure out occurrence cause of friction noise of the product, we measured thermal deformation of the product to organize a triggering device united with Laser Doppler Vibrometer(LDV) which turned occurrence moment of thermal friction noise into a possibility to measure. In conclusion, we could offer an effective information of design, and ensured ESPI(Electronic Speckle Pattern Interferometry) measure technique which is more detailed than the past way.

• 한국전기전자재료학회논문지
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• 제35권1호
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• pp.50-57
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• 2022

Reliability of CMOS has been severed under aggressive device scaling. Conventional technologies such as lightly doped drain (LDD) and forming gas annealing (FGA) have been applied for better device reliability, but further advances are modest. Alternatively, electro-thermal annealing (ETA) which utilizes Joule heat produced by electrodes in a MOSFET, has been newly introduced for gate dielectric curing. However, concerns about mechanical stability during the electro-thermal annealing, have not been discussed, yet. In this context, this paper demonstrates the mechanical stability of nanosheet FET during the electro-thermal annealing. The effect of mechanical stresses during the electro-thermal annealing was investigated with respect to device design parameters.

• 대한기계학회논문집A
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• 제28권6호
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• pp.677-684
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• 2004

Plastic and creep deformations of solder joints during thermal cycling are the main factors of misalignments and power losses in optical telecommunication components. Furthermore, the increased mismatch between solder Joint-bonded areas may cause severe failure in the components. Darveaux's creep model was implemented into a finite element program (ABAQUS) to simulate creep response of solder. Based on the finite element results, thermal fatigue reliability was predicted by using various fatigue life prediction models. Also, the effects of ramp conditions, dwelling time, and solder joint-embedding materials on the reliability were investigated under the thermal cycling conditions of the Telcordia schedule (-40∼75$^{\circ}C$).