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http://dx.doi.org/10.3795/KSME-A.2004.28.6.677

Thermal Fatigue Reliability of Solder Joints in a Thin Film Optical Filter Device  

Lee, Sung-Chul (포항공과대학교 대학원)
Hyun, Chung-Min (포항공과대학교 대학)
Lee, Hyung-Man (광부품연구센터, 전자부품연구)
Kim, Myoung-Jin (광부품연구센터, 전자부품연구)
Kim, Hwe-Kyung (광부품연구센터, 전자부품연구)
Kim, Ki-Tae (포항공과대학교 기계공학과)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.28, no.6, 2004 , pp. 677-684 More about this Journal
Abstract
Plastic and creep deformations of solder joints during thermal cycling are the main factors of misalignments and power losses in optical telecommunication components. Furthermore, the increased mismatch between solder Joint-bonded areas may cause severe failure in the components. Darveaux's creep model was implemented into a finite element program (ABAQUS) to simulate creep response of solder. Based on the finite element results, thermal fatigue reliability was predicted by using various fatigue life prediction models. Also, the effects of ramp conditions, dwelling time, and solder joint-embedding materials on the reliability were investigated under the thermal cycling conditions of the Telcordia schedule (-40∼75$^{\circ}C$).
Keywords
Fatigue Life Analysis; Fatigue Reliability; Finite Element Analysis; Optical Thin Film Filter; Solder Joint;
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