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http://dx.doi.org/10.3740/MRSK.2007.17.3.152

Thermal Shock Cycles Optimization of Sn-3.0 Ag-0.5 Cu/OSP Solder Joint with Bonding Strength Variation for Electronic Components  

Hong, Won-Sik (Reliability and Failure Analysis Center, Korea Electronics Technology Institute)
Kim, Whee-Sung (Department of Materials Engineering, Hankuk Aviation University)
Song, Byeong-Suk (Reliability and Failure Analysis Center, Korea Electronics Technology Institute)
Kim, Kwang-Bae (Department of Materials Engineering, Hankuk Aviation University)
Publication Information
Korean Journal of Materials Research / v.17, no.3, 2007 , pp. 152-159 More about this Journal
Abstract
When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.
Keywords
Pb-free solder; thermal shock; Sn-3.0 Ag-0.5 Cu; reliability; intermetallic compounds;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
Times Cited By SCOPUS : 3
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1 D. G. Kim., J. W. Kim, J. G. Lee, H. Morib, D. J. Quesnel, and S. B. Jung, J. Alloys and Compounds, 395, 80 (2005)   DOI   ScienceOn
2 J. W. Yoon, S. W. Kim, and S. B. Jung, J. Alloys and Compounds, 391, 82 (2005)   DOI   ScienceOn
3 C. J. Chen and K. L. Lin, J. Elec. Mater., 29, 1007 (2000)   DOI
4 JEITA, Lead Free Soldering Tech., Corona Pub. Co. Ltd., Tokyo (2003)
5 W. S. Hong, and K. B. Kim, Kor. J. Mater. Res., 15(8), 536 (2005)   과학기술학회마을   DOI   ScienceOn
6 J. W. Kim, D. G Kim, W. S. Hong and S. B. Jung, J. Elec. Mater., 34(12), 1550 (2005)   DOI
7 J. W. Yoon, and S. B. Jung, J. Alloys and Compounds, 396, 122 (2005)   DOI   ScienceOn
8 J. W. Yoon, S. W. Kim, and S. B. Jung, J. Alloys and Compounds, 392, 247 (2005)   DOI   ScienceOn
9 J. W. Yoon, D. G. Kim, and S. B. Jung, Microelectron. Reliab., 46, 535 (2006)   DOI   ScienceOn
10 C. Gur and M. Bamberger, Acta Mater., 46(14), 4917 (1998)   DOI   ScienceOn
11 K. Suganuma, Lead free soldering in electronics, p.57, Marcel Dekker Inc., New York (2004)
12 K. N. Tu, C. C. Yeh, C. Y. Liu, and C. Chen, Appl. Phys. Lett., 76, 988 (2000)   DOI   ScienceOn
13 R. Strauss, SMT Soldering Handbook, 2nd ed., p.148, Newnes, Oxford (1998)