Journal of Applied Reliability (한국신뢰성학회지:신뢰성응용연구)
- Volume 5 Issue 4
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- Pages.439-450
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- 2005
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- 1738-9895(pISSN)
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- 2733-8320(eISSN)
A Study on the Reliability Evaluation of Thermal Deformation of Electronic Product Package by ESPI
ESPI를 이용한 전자제품 패키지 열변형 신뢰성 평가에 관한 연구
- Cho Ji-Hyun (Samsung Electronics) ;
- Lee Jae-Hyuk (Samsung Electronics) ;
- Park Sang-Young (Department of Industrial Engineering, Ajou University) ;
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Jang Joong-Soon
(Department of Industrial Engineering, Ajou University)
;
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Kim Gwang-Sub
(Department of Industrial Engineering, Ajou University)
- Published : 2005.12.01
Abstract
Thermal deformation of Digital Television effect friction noise directly. However there was no methods to find and to solve the thermal friction noise which is huge problem in Digital Television In this study, to figure out occurrence cause of friction noise of the product, we measured thermal deformation of the product to organize a triggering device united with Laser Doppler Vibrometer(LDV) which turned occurrence moment of thermal friction noise into a possibility to measure. In conclusion, we could offer an effective information of design, and ensured ESPI(Electronic Speckle Pattern Interferometry) measure technique which is more detailed than the past way.