• Journal of the Semiconductor & Display Technology
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• v.5 no.3 s.16
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• pp.29-32
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(Printed Circuit Boards), Thermal control of the reflow process is required in order to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD(Computational Fluid Dynamics) tool for predicting flow and temperature distributions. Porous plate was installed to prevent leakage flow which was one of the major problem of temperature uniformity in the reflow process. There is a separation region where the flow is turned. Outside wall made of porous plate is to prevent and minimize separation region for acquiring uniform temperature during operation. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• Proceedings of the KWS Conference
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• 1997.10a
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• pp.68-73
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• 1997

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.179-182
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• 2011

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.5
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• pp.306-313
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• 2015

In this study, the change of optical characteristics was studied according to the micro optical pattern provided by photo lithography followed by thermal reflow process. The shape and luminance variation with micro pattern was evaluated by SEM and spectrometers. Also, we analyzed the luminance characteristics using the 3D-optical simulation (Optis works) program. As a result, we found that the radius of curvature(R) in micro pattern is decreased up to 77%($150^{\circ}C$) compared to the radius of curvature at the condition $100^{\circ}C$, which is caused by efficient reflow of organic material without chemical changes. The highest enhancement of brightness with optimum micro pattern was obtained at the condition of $120^{\circ}C$ reflow process. The brightness gain with optical micro patterns is more than 15% at the condition of R=16.95 um, ${\Theta}=77.14^{\circ}$ compared to original optical source. The results of light simulation with various radius of curvature and side angle of pattern shows the similar result of experiment evaluation of light behavior on optical micro patterns. It is regarded that the more effect on light enhancement was contributed by side angle which is effective factor on light reflection, rather than the curvature of micro-patterns.

• Journal of the Optical Society of Korea
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• v.18 no.1
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• pp.71-77
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• 2014

We present design and fabrication of a multi-focusing microlens array (MLA) using a thermal reflow method. To obtain multi-focusing properties with different numerical apertures at the elemental lens of the MLA, double-cylinder photoresist (PR) structures with different diameters were made within the guiding pattern with both photolithographic and partial developing processes. Due to the base PR layer supporting the thermal reflow process and the guiding structure, the thermally reflowed PR structure had different radii of curvatures with lens shapes that could be precisely modeled by the initial volume of the double-cylinder PR structures. Using the PR template, the hexagonally packed multi-focusing MLA was made via the replica molding method, which showed four different focal lengths of 0.9 mm, 1.1 mm, 1.6 mm, and 2.5 mm, and four different numerical apertures of 0.1799, 0.2783, 0.3973, and 0.4775.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.192-193
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• 2000

We studied the characteristics and fabricated the plano-convex refractive microlenses using the thermal reflow method. The exposed resist was resolved in a standard developing process. The remaining resist of circle pattern was melted in an oven 12$0^{\circ}C$ to 15$0^{\circ}C$. The shape of the melted resist microlenses is ruled by surface tension. Diameter and hight of the fabricated microlenses were 250${\mu}{\textrm}{m}$ to 325${\mu}{\textrm}{m}$ and 15${\mu}{\textrm}{m}$ to 22${\mu}{\textrm}{m}$, respectively. The surface profile was calculated using data curve-fitting method with circle equation. The optical characteristics was analysed using optical simulation program.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.1-7
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• 2008

We studied a growth behavior of Intermetallic compounds(IMCs) during solder bumping with two reflow methods. Ti(50 nm), Cu($1{\mu}m$), Au(50 nm) and Ti(50 nm) thin films were deposited on $SiO_2$/Si wafer using the DC magnetron sputtering system as the under bump metallization(UBM). And the $5{\mu}m$ thick Cu bumps and $20{\mu}m$ thick Sn bumps were fabricated on UBM by electroplating. Sn bumps were reflowed in RTA(Rapid Thermal Annealing) system and convection reflow oven. When RTA system was used, reflow was possible without using flux and IMC thickness formed in the solder interface was thinner than that of a convectional method.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.311-316
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• 2001

This paper presents that the affecting factors to the solderability and initial reliability. It is the factor that the coefficient of thermal expansion between package and PCB(Printed Circuit Board), the quantity of solder paste and reflow condition, and Au thickness of the solder ball pad on polyimide tape. As the reflow soldering condition for 48 ${\mu}BGA$ is changed, it is estimated that the quantity of Au diffusion at eutectic Sn-Pb solder surface and initial bonding strength of eutectic Sn-Pb solder and lead free solder. It is the result that quantitative measurement of Au diffusion quantity is difficult, but the shear strength of eutectic Sn-Pb solder joint is 842 mN at first reflow and increases 879 mN at third reflow. The major failure mode in solder is judged solder fracture. So, Au diffusion quantity is more affected by reflow temperature than by the reflow times.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.6
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• pp.574-581
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• 2020

This paper describes the stacking effect for Ceramic Column Grid Array(CCGA) packages used for satellites. Reflow Soldering Process suitable for CCGA package with back structure was set as the process development goal to meet European Cooperation for Space Standardization(ECSS) standard. After analyzing the stacking effect according to the type of CCGA, it is verified by applying it to the CCGA Reflow Soldering Process. In order to confirm the validity of the staking effect analyzed in terms of vibration and thermal characteristics, it is verified through actual specimen production. It analyzes the cause of crack occurrence in the CCGA package and estimates the crack generation point using previously acquired inspection data.