Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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A Study on the Initial Bonding Strength of Solder Ball and Au Diffusion at Micro Ball Grid Array Package

${\mu}BGA$ 패키지에서 솔더 볼의 초기 접합강도와 금 확산에 관한 연구

  • Kim, Kyung-Seob (Dept. of Electronics, Yeo-Joo Institute of Technology) ;
  • Lee, Suk (Dept. of Mechanical Engineering, Chung-Ang University) ;
  • Kim, Heon-Hee (Dept. of Mechanical Engineering, Chung-Ang University) ;
  • Yoon, Jun-Ho (Dept. of Electronics, Yeo-Joo Institute of Technology)
  • 김경섭 (여주대학 전자과) ;
  • 이석 (중앙대학교 공과대학 기계공학부) ;
  • 김헌희 (중앙대학교 공과대학 기계공학부) ;
  • 윤준호 (여주대학 전자과)
  • Published : 2001.06.01
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Abstract

This paper presents that the affecting factors to the solderability and initial reliability. It is the factor that the coefficient of thermal expansion between package and PCB(Printed Circuit Board), the quantity of solder paste and reflow condition, and Au thickness of the solder ball pad on polyimide tape. As the reflow soldering condition for 48 ${\mu}BGA$ is changed, it is estimated that the quantity of Au diffusion at eutectic Sn-Pb solder surface and initial bonding strength of eutectic Sn-Pb solder and lead free solder. It is the result that quantitative measurement of Au diffusion quantity is difficult, but the shear strength of eutectic Sn-Pb solder joint is 842 mN at first reflow and increases 879 mN at third reflow. The major failure mode in solder is judged solder fracture. So, Au diffusion quantity is more affected by reflow temperature than by the reflow times.

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References

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