Browse > Article
http://dx.doi.org/10.9766/KIMST.2020.23.6.574

Study on Vibration and Thermal Characteristics Applying Staking to CCGA Package for Space Applications  

Jeong, Myung Deuk (The 3rd Research and Development Institute, Agency for Defense Development)
Jung, Sunghoon (The 3rd Research and Development Institute, Agency for Defense Development)
Hong, Young Min (PBA & Mechanical Production, LIGNex1 Co., Ltd)
Publication Information
Journal of the Korea Institute of Military Science and Technology / v.23, no.6, 2020 , pp. 574-581 More about this Journal
Abstract
This paper describes the stacking effect for Ceramic Column Grid Array(CCGA) packages used for satellites. Reflow Soldering Process suitable for CCGA package with back structure was set as the process development goal to meet European Cooperation for Space Standardization(ECSS) standard. After analyzing the stacking effect according to the type of CCGA, it is verified by applying it to the CCGA Reflow Soldering Process. In order to confirm the validity of the staking effect analyzed in terms of vibration and thermal characteristics, it is verified through actual specimen production. It analyzes the cause of crack occurrence in the CCGA package and estimates the crack generation point using previously acquired inspection data.
Keywords
Corner Staking; CCGA Package; Reflow Soldering Process; Crack; Vibration;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Xiaorui Lv, et al., "Reliability Study of the Solder Joints in CCGA Package during Thermal Test," 15th International Conference on Electronic Packaging Technology, pp. 854-857, May 2014.
2 Teng Sue Y., "Brillhart Mark. Reliability Assessment of a High CTE CBGA for High Availability Systems," In Proceeding of the Components and Technology Conference, Vol. 52, No. 2002, pp. 611-616, 2002.
3 Martin Hart, "CCGA Solder Column - Reliable Solution for Absorbing Large CTE Mismatch," European Microelectronics and Package Conference, Vol. 2015, No. 9, pp. 1-5, 2015.
4 Dr. Mark Fan, "FEA Stress Analysis for the Comparison of BGA and CGA," NASA Electronic Parts and Packaging(NEPP), pp. 1-3, August 1999.
5 ESA, "High Reliability Soldering for Surface Mount and Mixed Technology," ECSS-Q-ST-70-38C, European Cooperation for Space Standardization, Jul. 2008.
6 ESA, "Manual Soldering of High-Reliability Electrical Connections," ECSS-Q-ST-70-08C, European Cooperation for Space Standardization, Mar. 2009.
7 Rajeshuni Ramesham, "Thermal Cycling Testing to Failure of a Ceramic Column Grid Array Package for Space Applications," Pan Pacific Microelectronics Symposium, Vol. 2017, No. 2, pp. 1-10, 2017.
8 Tao Lu, et al., "Vibration and Thermal Fatigue Reliability of CCGA Components," 20th International Conference on Electronic Packaging Technology, Vol. 2019, No. 8, pp. 1-4, 2019.
9 Zezheng Li, et al., "Effect of Random Vibration Load on Flat Cover and T-shaped Cover in CCGA Package," 20th International Conference on Electronic Packaging Technology, Vol. 2019, No. 8, pp. 1-6, 2019.