• 제목/요약/키워드: thermal probe

검색결과 336건 처리시간 0.033초

과도탐침법에 의한 열전도계수 측정장치 개발 (Development of Experimental Apparatus For Measuring Thermal Conductivity by Transient Probe Method)

  • 배신철;김명윤
    • Journal of Biosystems Engineering
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    • 제22권1호
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    • pp.59-67
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    • 1997
  • An experimental apparatus was developed for the rapid determination of thermal conductivity by transient probe method. The theoretical basis for transient probe method has been investigated. The mathematical model for this method is the Carslaw and Jaeger model which is used perfect line source theory. The small needle probe which is equipped with thermocouple and heating element is constructed. A software that performs data analysis and acquisition is programmed. The influence of the power dissipated per unit length of the probe has been assessed for glycerin. The result showed no significant correlation between thermal conductivity and power input. Determination made with this experimental apparatus were found to agree well with the recommended thermal conductivity data.

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고성능 주사탐침열현미경 열전탐침 제작 (High Performance Thermoelectric Scanning Thermal Microscopy Probe Fabrication)

  • 김동립;김경태;권오명;박승호;최영기;이준식
    • 대한기계학회논문집A
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    • 제29권11호
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    • pp.1503-1508
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    • 2005
  • Scanning Thermal Microscope (STU) has been known for its superior resolution for local temperature and thermal property measurement. However, commercially available STU probe which is the key component of SThM does not provide resolution enough to explore nanoscale thermal phenomena. Here, we developed a SThM probe fabrication process that can achieve spatial resolution around 50 m. The batch-fabricated probe has a thermocouple junction located at the end of the tip. The size of the thermocouple junction is around 200 m and the distance of the junction from the very end of the tip is 150 m. The probe is currently being used for nanoscale thermal probing of nano-material and nano device.

Measurement of Thermal Conductivity of Foods in Liquid and Solid Phase Using a Thermal Probe

  • Hong, Ji-Hyang;Han, Young-Joe;Chung, Jong-Hoon
    • Food Science and Biotechnology
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    • 제14권3호
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    • pp.334-339
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    • 2005
  • An instrument using thermal probe method was designed to measure thermal conductivity of liquid and solid foods. Thermal conductivity probe was designed with diameter to length ratio of 100 and diameter of 0.51 mm to minimize axial flow effect on thermal conductivity measurement. Thermal conductivities of distilled/deionized water, glycerin, and beef frankfurter meat were measured at $20-80^{\circ}C$. Mean thermal conductivity values of water showed less than 2.0% difference from several reference values without using time correction factor or probe calibration constant. For glycerin, difference was less than 0.7% from reference values at $20-50^{\circ}C$. Mean values of thermal conductivity for beef frankfurter meat ranged from 0.389 to $0.350\;W/m{\cdot}K$ at $20-80^{\circ}C$.

랑뮤어 탐침에 의해 변형된 열플라즈마 특성에 관한 해석적 연구 (Numerical Study on the Characteristics of Thermal Plasmas Disturbed by Inserting a Langmuir Probe)

  • 이종철;김윤제
    • 한국진공학회지
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    • 제17권3호
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    • pp.189-194
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    • 2008
  • 플라즈마 진단법 중 손쉽고 구동이 용이한 장점으로 인해 범용 플라즈마 진단 장치로 사용되는 랑뮤어 (Langmuir) 탐침법은 탐침이 직접 플라즈마 내에 삽입됨으로써 플라즈마를 간섭하기 때문에 플라즈마 고유의 특성을 변형시키는 약점이 있다. 본 연구에서는 대기압 아르곤 자유 연소 아크 (free-burning arc)에 삽입된 랑뮤어 탐침에 의한 교란 영향을 고찰하기 위하여 탐침 유무에 따른 열플라즈마 상태를 수치계산 하였고, 온도장과 속도장이 왜곡된 정도를 비교 분석하였다. 열플라즈마를 모델링하기 위하여 열유동장과 전자기장에 관한 두 종류의 지배방정식을 상용 CFD 프로그램과 자체 제작한 서브루틴을 이용하여 연계 계산하였다. 삽입된 탐침에 의해 열플라즈마 온도장은 탐침의 앞뒤에서 모두 플라즈마 축의 수직 방향으로 큰 변화를 나타내는 열적 교란이 발생되었다. 속도장에서는 탐침 선단의 정체 영역과 후단 후류 영역에서 유동 교란이 발생되었으며, 삽입 된 탐침의 영향이 국부적인 것이 아닌 플라즈마 유동장 대부분 영역에 영향을 미침을 확인할 수 있었다. 따라서 탐침법의 신뢰성을 높이기 위해서는 탐침 삽입에 의한 플라즈마의 열유체역학적 교란을 고려해야 한다.

과도탐침법을 이용한 액체의 열물성 동시측정 (The simultaneous measurement for thermal properties of liquids using transient probe method)

  • 배신철;김명윤
    • 대한기계학회논문집B
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    • 제21권2호
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    • pp.303-315
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    • 1997
  • The theoretical model for the transient probe method is the modified Jaeger model which is used perfect line source theory. The transient probe technique has been developed for the simultaneous determination of thermal conductivity, diffusivity and volumetric heat capacity of liquids. The Levenberg-Marquardt iteration method is adapted to obtain thermal property within nonlinear range. Experimental results of liquids were found to agree well with recommended thermal property data.

이중탐침법을 이용한 수평형 지중열교환기 뒤채움재의 열확산계수 측정 (Thermal Diffusivity Measurement of Backfilling Materials for Horizontal Ground Heat Exchanger Using Dual-Probe Method)

  • 손병후;최항석
    • 한국지열·수열에너지학회논문집
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    • 제7권2호
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    • pp.51-59
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    • 2011
  • Storage and transfer heat in soils are governed by the soil thermal properties and these properties are therefore needed in many engineering applications, including horizontal ground heat exchanger for ground-coupled heat pumps. This paper presents the measured results of the thermal diffusivity of soils(silica, quartzite, limestone, sandstone, and masonry soils) used for the trench backfilling materials of the horizontal ground heat exchanger. To assess this thermal property, we (i) measure the soil thermal conductivities and volumetric heat capacities using dual-probe method and (ii) compare the estimates from the de Vries method of summing the heat capacities of the soil constituents. The results show that the thermal diffusivity tends to increase as dry soil begins to wet, but it approaches a constant value or even decreases as the soil continues to wet. Measurements made by using the dual-probe method agreed well with independent estimates obtained using the single-probe method.

주사탐침열현미경의 감도향상을 위한 전체 실리콘 산화막 열전탐침의 열적설계 및 일괄제작 (Thermal Design and Batch Fabrication of Full SiO2 SThM Probes for Sensitivity Improvement)

  • 정승필;김경태;원종보;권오명;박승호;최영기;이준식
    • 대한기계학회논문집B
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    • 제32권10호
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    • pp.800-809
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    • 2008
  • Scanning Thermal Microscope (SThM) is the tool that can map out temperature or the thermal property distribution with the highest spatial resolution. Since the local temperature or the thermal property of samples is measured from the extremely small heat transferred through the nanoscale tip-sample contact, improving the sensitivity of SThM probe has always been the key issue. In this study, we develop a new design and fabrication process of SThM probe to improve the sensitivity. The fabrication process is optimized so that cantilevers and tips are made of thermally grown silicon dioxide, which has the lowest thermal conductivity among the materials used in MEMS. The new design allows much higher tip so that heat transfer through the air gap between the sample-probe is reduced further. The position of a reflector is located as far away as possible to minimize the thermal perturbation due to the laser. These full $SiO_2$ SThM probes have much higher sensitivity than that of previous ones.

무선 전자식 장비를 이용한 지중열전도도 측정 기술 (Ground Thermal Conductivity Test with A Wireless Probe)

  • 김지영;이의준;장기창;강은철;고건혁
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2381-2384
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    • 2008
  • The heat exchange between the Borehole Heat Exchanger(BHE) and the surrounding ground depends directly on ground thermal conductivity k at the certain site. The k is thus a key parameter in designing BHE and coupled geothermal heat pump systems. Currently, although a thermal hydraulic Response Test(TRT) is mostly used in practice, the thermal hydraulic TRT needs additional power and is generally time-consuming. A new, simple wireless probe for hi-speed k determination was introduced in this paper. This technique using a wireless probe is less time-consuming and requires no external source of energy for measurement and predicts local thermal properties by measuring soil temperatures along the depth. Measured temperature data along the depth was analyzed. As a result, the electronic wireless probe can replace the conventional hydraulic TRT method after carrying out the additional research on a lot of local heat flow, etc.

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열적 환경변화에 의한 공작기계의 구조적 특성 (Thermal Deformation Characteristics of the Adaptive Machine Tools under Change of Thermal Environment)

  • 이재종;이찬홍;최대봉;박현구
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 추계학술대회 논문집
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    • pp.1023-1027
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    • 2000
  • In metal cutting, the machining accuracy is more affected by thermal errors than by geometric errors. This paper models of the thermal errors for error analysis and develops on-the-machine measurement system by which the volumetric error are measured and compensated. The thermal error is modeled by means of angularity errors of a column and thermal drift error of the spindle unit which are measured by the touch probe unit with a star type styluses, a designed spherical ball artifact, and five gap sensors. In order to analyze the thermal characteristics under several operating conditions, experiments performed with the touch probe unit and five gap sensors on the vertical and horizontal machining centers.

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SOI 기판을 이용한 Thermal Probe 어레이 제작 및 특성 평가 (Fabrication and Characterization of Thermal Probe Array on SOI Substrates)

  • 조주현;나기열;박근형;이재봉;김영석
    • 한국전기전자재료학회논문지
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    • 제18권11호
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    • pp.990-995
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    • 2005
  • This paper reports the fabrication and characterization of $5\;\times\;5$ thermal cantilever array for nano-scaled memory device application. The $5\;\times\;5$ thermal cantilever array with integrated tip heater has been fabricated with MEMS technology on SOI wafer using 7 photo masking steps. All single-level cantilevers have a diode in order to eliminate any electrical cross-talk between adjacent tips. Electrical measurements of fabricated thermal cantilever away show its own thermal heating mechanism. Thermal heating is demonstrated by the reflow of coated photoresist on the cantilever array surface.