• Title/Summary/Keyword: thermal probe

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Development of Experimental Apparatus For Measuring Thermal Conductivity by Transient Probe Method (과도탐침법에 의한 열전도계수 측정장치 개발)

  • 배신철;김명윤
    • Journal of Biosystems Engineering
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    • v.22 no.1
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    • pp.59-67
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    • 1997
  • An experimental apparatus was developed for the rapid determination of thermal conductivity by transient probe method. The theoretical basis for transient probe method has been investigated. The mathematical model for this method is the Carslaw and Jaeger model which is used perfect line source theory. The small needle probe which is equipped with thermocouple and heating element is constructed. A software that performs data analysis and acquisition is programmed. The influence of the power dissipated per unit length of the probe has been assessed for glycerin. The result showed no significant correlation between thermal conductivity and power input. Determination made with this experimental apparatus were found to agree well with the recommended thermal conductivity data.

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High Performance Thermoelectric Scanning Thermal Microscopy Probe Fabrication (고성능 주사탐침열현미경 열전탐침 제작)

  • Kim, Donglip;Kim, Kyeongtae;Kwon, Ohmyoung;Park, Seungho;Choi, Young Ki;Lee, Joon Sik
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.29 no.11 s.242
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    • pp.1503-1508
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    • 2005
  • Scanning Thermal Microscope (STU) has been known for its superior resolution for local temperature and thermal property measurement. However, commercially available STU probe which is the key component of SThM does not provide resolution enough to explore nanoscale thermal phenomena. Here, we developed a SThM probe fabrication process that can achieve spatial resolution around 50 m. The batch-fabricated probe has a thermocouple junction located at the end of the tip. The size of the thermocouple junction is around 200 m and the distance of the junction from the very end of the tip is 150 m. The probe is currently being used for nanoscale thermal probing of nano-material and nano device.

Measurement of Thermal Conductivity of Foods in Liquid and Solid Phase Using a Thermal Probe

  • Hong, Ji-Hyang;Han, Young-Joe;Chung, Jong-Hoon
    • Food Science and Biotechnology
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    • v.14 no.3
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    • pp.334-339
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    • 2005
  • An instrument using thermal probe method was designed to measure thermal conductivity of liquid and solid foods. Thermal conductivity probe was designed with diameter to length ratio of 100 and diameter of 0.51 mm to minimize axial flow effect on thermal conductivity measurement. Thermal conductivities of distilled/deionized water, glycerin, and beef frankfurter meat were measured at $20-80^{\circ}C$. Mean thermal conductivity values of water showed less than 2.0% difference from several reference values without using time correction factor or probe calibration constant. For glycerin, difference was less than 0.7% from reference values at $20-50^{\circ}C$. Mean values of thermal conductivity for beef frankfurter meat ranged from 0.389 to $0.350\;W/m{\cdot}K$ at $20-80^{\circ}C$.

Numerical Study on the Characteristics of Thermal Plasmas Disturbed by Inserting a Langmuir Probe (랑뮤어 탐침에 의해 변형된 열플라즈마 특성에 관한 해석적 연구)

  • Lee, J.C.;Kim, Y.J.
    • Journal of the Korean Vacuum Society
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    • v.17 no.3
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    • pp.189-194
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    • 2008
  • Measurements with a Langmuir probe, which are the most often used procedures of plasma diagnostics, can disturb plasma flows and change its characteristics quite a little because the probe should be inserted into thermal flowing plasmas. In this study, we calculated the characteristics of thermal plasmas with and without the probe into an atmospheric argon free-burning arc numerically, and investigated aerodynamic and thermal disturbances with temperature and axial velocity distributions. For the modelling of thermal plasmas, we have made two governing equations, which are on the thermal-flow and electromagnetic fields, coupled together with a commercial CFD package and user-coded subroutines. It was found that thermal disturbances happened to both sides of the probe, before and behind, seriously. Due to the aerodynamic disturbance, we could find that there were the stagnation point in front of the probe and the wake behind it. Therefore, aerodynamic and thermal disturbances caused by the probe insertion should be considered to increase the reliability of the probe diagnostics.

The simultaneous measurement for thermal properties of liquids using transient probe method (과도탐침법을 이용한 액체의 열물성 동시측정)

  • Bae, Sin-Cheol;Kim, Myeong-Yun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.21 no.2
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    • pp.303-315
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    • 1997
  • The theoretical model for the transient probe method is the modified Jaeger model which is used perfect line source theory. The transient probe technique has been developed for the simultaneous determination of thermal conductivity, diffusivity and volumetric heat capacity of liquids. The Levenberg-Marquardt iteration method is adapted to obtain thermal property within nonlinear range. Experimental results of liquids were found to agree well with recommended thermal property data.

Thermal Diffusivity Measurement of Backfilling Materials for Horizontal Ground Heat Exchanger Using Dual-Probe Method (이중탐침법을 이용한 수평형 지중열교환기 뒤채움재의 열확산계수 측정)

  • Sohn, Byong-Hu;Choi, Hang-Seok
    • Journal of the Korean Society for Geothermal and Hydrothermal Energy
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    • v.7 no.2
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    • pp.51-59
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    • 2011
  • Storage and transfer heat in soils are governed by the soil thermal properties and these properties are therefore needed in many engineering applications, including horizontal ground heat exchanger for ground-coupled heat pumps. This paper presents the measured results of the thermal diffusivity of soils(silica, quartzite, limestone, sandstone, and masonry soils) used for the trench backfilling materials of the horizontal ground heat exchanger. To assess this thermal property, we (i) measure the soil thermal conductivities and volumetric heat capacities using dual-probe method and (ii) compare the estimates from the de Vries method of summing the heat capacities of the soil constituents. The results show that the thermal diffusivity tends to increase as dry soil begins to wet, but it approaches a constant value or even decreases as the soil continues to wet. Measurements made by using the dual-probe method agreed well with independent estimates obtained using the single-probe method.

Thermal Design and Batch Fabrication of Full SiO2 SThM Probes for Sensitivity Improvement (주사탐침열현미경의 감도향상을 위한 전체 실리콘 산화막 열전탐침의 열적설계 및 일괄제작)

  • Jaung, Seung-Pil;Kim, Kyeong-Tae;Won, Jong-Bo;Kwon, Oh-Myoung;Park, Seung-Ho;Choi, Young-Ki;Lee, Joon-Sik
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.32 no.10
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    • pp.800-809
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    • 2008
  • Scanning Thermal Microscope (SThM) is the tool that can map out temperature or the thermal property distribution with the highest spatial resolution. Since the local temperature or the thermal property of samples is measured from the extremely small heat transferred through the nanoscale tip-sample contact, improving the sensitivity of SThM probe has always been the key issue. In this study, we develop a new design and fabrication process of SThM probe to improve the sensitivity. The fabrication process is optimized so that cantilevers and tips are made of thermally grown silicon dioxide, which has the lowest thermal conductivity among the materials used in MEMS. The new design allows much higher tip so that heat transfer through the air gap between the sample-probe is reduced further. The position of a reflector is located as far away as possible to minimize the thermal perturbation due to the laser. These full $SiO_2$ SThM probes have much higher sensitivity than that of previous ones.

Ground Thermal Conductivity Test with A Wireless Probe (무선 전자식 장비를 이용한 지중열전도도 측정 기술)

  • Kim, Ji-Young;Lee, Euy-Joon;Chang, Ki-Chang;Kang, Eun-Chul;Ko, Gun-Hyuk
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2381-2384
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    • 2008
  • The heat exchange between the Borehole Heat Exchanger(BHE) and the surrounding ground depends directly on ground thermal conductivity k at the certain site. The k is thus a key parameter in designing BHE and coupled geothermal heat pump systems. Currently, although a thermal hydraulic Response Test(TRT) is mostly used in practice, the thermal hydraulic TRT needs additional power and is generally time-consuming. A new, simple wireless probe for hi-speed k determination was introduced in this paper. This technique using a wireless probe is less time-consuming and requires no external source of energy for measurement and predicts local thermal properties by measuring soil temperatures along the depth. Measured temperature data along the depth was analyzed. As a result, the electronic wireless probe can replace the conventional hydraulic TRT method after carrying out the additional research on a lot of local heat flow, etc.

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Thermal Deformation Characteristics of the Adaptive Machine Tools under Change of Thermal Environment (열적 환경변화에 의한 공작기계의 구조적 특성)

  • 이재종;이찬홍;최대봉;박현구
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.1023-1027
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    • 2000
  • In metal cutting, the machining accuracy is more affected by thermal errors than by geometric errors. This paper models of the thermal errors for error analysis and develops on-the-machine measurement system by which the volumetric error are measured and compensated. The thermal error is modeled by means of angularity errors of a column and thermal drift error of the spindle unit which are measured by the touch probe unit with a star type styluses, a designed spherical ball artifact, and five gap sensors. In order to analyze the thermal characteristics under several operating conditions, experiments performed with the touch probe unit and five gap sensors on the vertical and horizontal machining centers.

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Fabrication and Characterization of Thermal Probe Array on SOI Substrates (SOI 기판을 이용한 Thermal Probe 어레이 제작 및 특성 평가)

  • Cho, Ju-Hyun;Na, Kee-Yeol;Park, Keun-Hyung;Lee, Jae-Bong;Kim, Yeong-Seuk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.11
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    • pp.990-995
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    • 2005
  • This paper reports the fabrication and characterization of $5\;\times\;5$ thermal cantilever array for nano-scaled memory device application. The $5\;\times\;5$ thermal cantilever array with integrated tip heater has been fabricated with MEMS technology on SOI wafer using 7 photo masking steps. All single-level cantilevers have a diode in order to eliminate any electrical cross-talk between adjacent tips. Electrical measurements of fabricated thermal cantilever away show its own thermal heating mechanism. Thermal heating is demonstrated by the reflow of coated photoresist on the cantilever array surface.