• Tribology and Lubricants
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• v.37 no.2
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• pp.54-61
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• 2021

The effect of the sand blasting before TiAlN coating in the manufacture of WC hard metal alloy tips have been studied. For four different tips, according to the status of processing of the sand blasting and the coating, residual stress measurement by X-ray diffraction and several tests for mechanical properties have been conducted. The results suggest that there was no difference in static mechanical properties, such as hardness, surface roughness and elastic modulus, between two coatings. Furthermore, compressive residual stress was generated equally on their surfaces. Additionally, the compressive residual stress in substrate WC was found to increase greatly when subjected to sand blasting treatment. However, the compressive residual stress decrease after coating regardless of sand blasting treatment. Nevertheless, it is confirmed that the compressive residual stress generated in the coating after sand blasting is less than that in the non-sandblasting coating. This was attributed to the plastic deformation occurring in the WC substrate during coating after sand blasting. In contrast to the scratch test results, sand blasting was assumed to have a negative effect on the adhesion between the coating and substrate. This is because there is a high possibility of microcracks due to plastic deformation in the WC substrate under the coating after sand blasting.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4757-4761
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• 2012

LED chip on board(COB) package has been fabricated using aluminum substrate and aluminum anodization process. An alumina layer, used as a dielectric in COB substrate, is produced on aluminum substrate by selective anodization process. Also, selective anodization process makes it possible to construct a thermal via with a fully-filled via hole. Two types of the COB package are fabricated in order to analyze the effects of their substrate types on thermal resistivity and luminous efficiency. The aluminum substrate with the thermal via shows more improved measurement results compared with the alumina substrate. These results demonstrate that selective anodization process and thermal via can increase heat dissipation of COB package in this work. In addition, it is proved experimentally that these parameters also can be enhanced using efficient layout of multiple chip in the COB package.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.57-62
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• 2012

In this paper, numerical analysis by finite element method, parameter design by the Taguchi method and ANOVA method were used to analyze about effect of design deviations and thickness variations on warpage of FCCSP substrate. Based on the computed results, it was known that core material in substrate was the most determining deviation for reducing warpage. Solder resist, prepreg and circuit layer were insignificant effect on warpage relatively. But these results meant not thickness effect was little importance but mechanical properties of core material were very effective. Warpage decreased as Solder resist and circuit layer thickness decreased but effect of prepreg thickness was conversely. Also, these results showed substrate warpage would be increased to maximum 40% as thickness deviation combination. It meant warpage was affected by thickness tolerance under manufacturing process even if it were met quality requirements. Threfore, it was strongly recommended that substrate thickness deviation should be optimized and controlled precisely to reduce warpage in manufacturing process.

• Korean Journal of Materials Research
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• v.26 no.10
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• pp.549-555
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• 2016

We have investigated a glass-forming region of $V_2O_5-P_2O_5-ZnO$ glass and the effects of the addition of modifier oxides ($B_2O_3$) to the glass systems as a sealing material to improve the adhesion between the glass frits and a soda lime substrate. Thermal properties and coefficient of thermal expansion were measured using a differential scanning calorimetry, a dilatometer and a hot stage microscopy. Structural changes and interfacial reactions between the glass substrate and the glass frit after sintering (at $400^{\circ}C$ for 1 h) were measured by Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy and scanning electron microscope. The results showed that the adhesion strength increases as the content of $B_2O_3$ at 5 mol% increases because of changes in the structural properties. It seems that the glass structures change with $B_2O_3$, and the $Si^{4+}$ ions from the substrate are diffused to the sealing glass. From these results, we could understand the mechanism of strengthening of the adhesion of soda lime silica substrate by ion-diffusion from the substrate to the glass.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.7
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• pp.76-81
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• 2011

A new via cutting structure in 2-layer DRAM package substrate has been fabricated to lower its power distribution network(PDN) impedance. In new structure, part of the via is cut off vertically and its remaining part is designed to connect directly with the bonding pad on the package substrate. These via structure and substrate design not only provide high routing density but also improve the PDN impedance by shortening effectively the path from bonding pad to VSSQ plane. An additional process is not necessary to fabricate the via cutting structure because its structure is completed at the same time during a process of window area formation. Also, burr occurrence is minimized by filling the via-hole inside with a solder resist. 3-dimensional electromagnetic field simulation and S-parameter measurement are carried out in order to validate the effects of via cutting structure and VDDQ/VSSQ placement on the PDN impedance. New DRAM package substrate has a superior PDN impedance with a wide frequency range. This result shows that via cutting structure and power/ground placement are effective in reducing the PDN impedance.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.4
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• pp.91-96
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• 2007

The light extraction efficiency in GaN-on-sapphire LEDs based on a simple model was analyzed qualitatively. The light extraction efficiency in the LEDs is simulated numerically by using ray tracing method. In the present study, the extraction efficiency was simulated on flat LED and PSS(patterned sapphire substrate) LED. The role of the patterned sapphire substrate in PSS LED are analyzed and discussed. And, the effects of reflectance on flat LED and PSS LED were investigated. This analysis of simulation results provide a numeric figure for the extraction efficiency of LEDs and are helpful in the design of high brightness GaN LEDs.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.4
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• pp.340-344
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• 2011

Thermoelectric bismuth telluride ($Bi_2Te_3$) films were deposited on $4^{\circ}$ off oriented (001) GaAs substrates using a modified metal organic chemical vapor deposition (MOCVD) system. The effects of substrate temperature on surface morphologies, crystallinity, electrical properties and thermoelctric properties were investigated. Two dimensional growth mode (2D) was observed at substrate temperature lower than $400^{\circ}C$. However, three dimensional growth mode (3D) was observed at substrate temperature higher than $400^{\circ}C$. Change of growth mechanism from 2D to 3D was confirmed with environmental scanning electron microscope (E-SEM) and X-ray diffraction analysis. Seebeck coefficients of all samples have negative values. This result indicates that $Bi_2Te_3$ films grown by modified MOCVD are n-type. The maximum value of Seebeck coefficient was -225 ${\mu}V/K$ and the power factor was $1.86{\times}10^{-3}\;W/mK^2$ at the substrate temperature of $400^{\circ}C$. $Bi_2Te_3$ films deposited using modified MOCVD can be used to fabricate high-performance thermoelectric devices.

• Korean Journal of Crystallography
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• v.6 no.1
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• pp.14-26
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• 1995

The growth mechanism of diamond thin films, deposited by Hot Filament CVD, was investigated through observation of changes in their surface morphology as a function of the substance temperature and deposition time. Amorphous carbon or DLC thin films were deposited at low substrate temperature. Diamond films consisting of square-shaped particles, whose surfaces are (100) planes, were deposited at an intermedate temperature. At high substrate temperatures, diamond films consisting of the particles showing both (100) and (111) plane were deposited. The (100) proferred orientation of the diamond films are believed to be due to a relatively high supersaturation during deposition, and the growth condition for the diamond films having (100) preferred orientation can be applied to the single crystal growth since no twins are generated on the (100) plane. The grain size of the diamond films did not change with increasing temperature and its increasing rate with increasing deposition time was the same irrespective of the substrate temperature. However, the nucleation density increased with substrate temperature and its increasing rate with deposition time was much higher for the films deposited at higher substrate temperature.

• Korean Journal of Metals and Materials
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• v.47 no.1
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• pp.26-31
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• 2009

The effects of $Ar/O_2$ ion-beam pre-treatment conditions on the interfacial adhesion energy of sputterdeposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from $45.8{\pm}5.7g/mm$ to $61.3{\pm}2.4g/mm$ by $Ar/O_2$ ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to $Ar/O_2$ ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate.

• Journal of Nutrition and Health
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• v.44 no.6
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• pp.507-517
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• 2011

The purpose of this study was to investigate the effects of gender on the thermic effect of food and substrate oxidation rate during 5 hours after a mixed meal. Twenty healthy college students (10 males and 10 females) aged 20-26 years participated in this study. The energy contents of the experimental diets were 775 kcal and 627 kcal for males and females respectively, which were 30% of individual energy requirements and were composed of 65/15/20% as the proportion of carbohydrate/protein/fat. Resting and postprandial energy expenditure and substrate oxidation rates were measured with indirect calorimetry in the fasting state and every 30 min for 5 hours after meal consumption. Thermic effects of food expressed as ${\Delta}AUC$ and TEF% were not significantly different between males and females. However, TEF% adjusted for body weight and fat-free mass in males (0.095% and 0.120%) were significantly lower than those in females (0.152% and 0.213%)(p < 0.05). The total amount of carbohydrate oxidized was significantly lower in males than that in females (58.6 vs. 86.6 mg/kcal energy intake/5 h, p < 0.05). In contrast, the total amount of fat oxidized was significantly higher in males than that in females after the meal (32.9 vs. 17.2 mg/kcal energy intake/5 h, p < 0.01). These results indicate that gender affects the thermic effects of food and the substrate oxidation rate after a meal. The results show that males use relatively less carbohydrate and more fat as an energy source after a meal than that of females.