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http://dx.doi.org/10.5762/KAIS.2012.13.10.4757

ED COB Package Using Aluminum Anodization  

Kim, Moonjung (Division of Electrical Electronics and Control Engineering, Kongju National University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.13, no.10, 2012 , pp. 4757-4761 More about this Journal
Abstract
LED chip on board(COB) package has been fabricated using aluminum substrate and aluminum anodization process. An alumina layer, used as a dielectric in COB substrate, is produced on aluminum substrate by selective anodization process. Also, selective anodization process makes it possible to construct a thermal via with a fully-filled via hole. Two types of the COB package are fabricated in order to analyze the effects of their substrate types on thermal resistivity and luminous efficiency. The aluminum substrate with the thermal via shows more improved measurement results compared with the alumina substrate. These results demonstrate that selective anodization process and thermal via can increase heat dissipation of COB package in this work. In addition, it is proved experimentally that these parameters also can be enhanced using efficient layout of multiple chip in the COB package.
Keywords
Aluminum Anodization; LED; Package; Thermal Resistance; Luminous Efficiency;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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