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J.-H. Cho and M.-S. Lee, "Implementation of LED BLU Using Metal core PCB with Anodizing Oxide Layer and Reflection Cup Structure", Journal of the Korean Institute of Illuminating and Electrical Installation Engineers, Vol. 23, No. 8, pp. 8-13, 2009.
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D. W. Hong and S. J. Lee, "A Study on High Power LED Lamp Structures", Journal of Optics and Photonics, Vol. 21, No. 3, pp. 118-122, 2010.
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B. Ma, J. Kim, H. Cho, K. Lee, B. Song, "Improvement of Thermal and Reliability characteristics By Metal Package", Proc. of 2010 IEEK Summer Conference, pp. 563-565, 2010.
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Y.-W. Kim et al., "Thermal Analysis of a Package Substrate for COB LED Packaging", Journal of the Korean Physical Society, Vol. 54, No. 5, pp. 1873-1878, 2009.
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S.-I Lee, S.-M. Lee and D.-H. Park, "Analysis of Thermal Properties in LED Package by Via hole of FR4 PCB", Journal of the Korean Institute of Illuminating and Electrical Installation Engineers, Vol. 24, No. 12, pp. 57-63, 2010.
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