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Effect of Ion-beam Pre-treatment on the Interfacial Adhesion of Sputter-deposited Cu film on FR-4 Substrate  

Min, Kyoung-Jin (School of Material Science and Engineering, Andong National University)
Park, Sung-Cheol (School of Material Science and Engineering, Andong National University)
Lee, Ki-Wook (Amkor Technology Korea Inc)
Kim, Jae-Dong (Amkor Technology Korea Inc)
Kim, Do-Geun (Department of Surface Technology, Korea Institute of Materials Science)
Lee, Gun-Hwan (Department of Surface Technology, Korea Institute of Materials Science)
Park, Young-Bae (School of Material Science and Engineering, Andong National University)
Publication Information
Korean Journal of Metals and Materials / v.47, no.1, 2009 , pp. 26-31 More about this Journal
Abstract
The effects of $Ar/O_2$ ion-beam pre-treatment conditions on the interfacial adhesion energy of sputterdeposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from $45.8{\pm}5.7g/mm$ to $61.3{\pm}2.4g/mm$ by $Ar/O_2$ ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to $Ar/O_2$ ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate.
Keywords
adhesion; peel test; ion-beam pre-treatment; FR-4 substrate; sputter-deposited Cu;
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Times Cited By Web Of Science : 2  (Related Records In Web of Science)
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1 C. T. Ko, S. Chen, C. W. Chiang, T. Y. Kuo, Y.C. Shih and Y. H. Chen, Proc. 56th Electronic Components and Technology Conf, p.322, San Diego, USA (2004)
2 Y. X. Liu, E. T. Kang, K. G. Neoh, J. F. Zhang, C. Q. Cui and T. B. Lim, IEEE Trans. Adv. Packag. 22, 214 (1999)   DOI
3 B. I. Noh, C. S. Seok, W. C. Moon and S. B. Jung, Int. J. Adhes. Adhes. 27, 200 (2007)   DOI   ScienceOn
4 S. H. Kim, S. H. Cho, N. E. Lee, H. M. Kim, Y. W. Nam and Y. H. Kim, Surf. Coat. Technol. 193, 101 (2005)   DOI   ScienceOn
5 M. H. Kim and K. W. Lee, Met. Mater. Int. 12, 425 (2006)   DOI   ScienceOn
6 I. S. Park, E. C. Ahn, J. Yu and H. Y. Lee, Mater. Sci. Eng. A282, 137 (2000)   DOI   ScienceOn
7 R. P. Prasad, Surface Mount Technology, Principles and Practice, p.139-131, Van Nostrand Reinhold, New York (1989)
8 Y. H. Chen, J. R. Lin, S. Chen, C. T. Ko, T. Y. Kuo, C. w. Chien and S. P. Yu, Proc. 6th Electronics Packaging Technology Conf, p.595, Singapore (2004)
9 J. W. Choi, T. S. Oh and Y. H. Kim, J. Kor. Inst. Met. & Matter. 34, 1338 (1996)
10 V. Zaporojtchenko, J. Zekonyte, S. Wille, U. Schuermann and F. Faupel, Nucl. Inst. and Meth., in Phys. Res. B 236, 95 (2005)   DOI   ScienceOn
11 J. Shang and Y. I Liu, Circuit World 29, 28, (2003)   DOI   ScienceOn
12 J. Y. Park, Y. S. Jung, J. Cho and W. K. Choi, Appl. Surf. Sci. 252, 5877 (2006)   DOI   ScienceOn