• Title/Summary/Keyword: solution resistivity

Search Result 239, Processing Time 0.023 seconds

Pressure sensing of air flow using multi-walled carbon nanotubes (다중벽 탄소 나노튜브를 이용한 유동 압력 검출)

  • Song, Jin-Won;Lee, Jong-Hong;Lee, Eung-Sug;Han, Chang-Soo
    • Journal of Sensor Science and Technology
    • /
    • v.16 no.5
    • /
    • pp.377-383
    • /
    • 2007
  • We describe the fabrication and characterization of a doubly clamped multi-walled carbon nanotube (MWNT). The device was assembled by an application of electric field in solution. The MWNT was clamped on end of metal trench electrodes in solution and deposited with additional platinum (Pt) on edge of electrode for firmly suspending the MWNT by focused ion beam (FIB). The MWNTs range of diameter and length were 100 to 150 nm and 1.5 to $2{\mu}m$, respectively. Electrical characteristics of fabricated devices were measured by I-V curve and impedance analysis. The mechanical deformation was observed by resistivity in high air pressure. Resonant frequency around 6.8 MHz was detected and resistivity was linearly varied according to the magnitude of air pressure. This device could have potential applications in nanoelectronics and various sensors.

Structure Parameter Change Estimation of a Forward Osmosis Membrane Under Pressurized Conditions in Pressure-assisted Forward Osmosis (PAFO) (가압형 정삼투 시 압력에 따른 정삼투막의 Structure Parameter 변화양상 예측)

  • Kook, Seungho;Kim, Sung-Jo;Lee, Jinwoo;Hwang, Moonhyun;Kim, In S.
    • Membrane Journal
    • /
    • v.26 no.3
    • /
    • pp.187-196
    • /
    • 2016
  • Pressure-assisted forward osmosis (PAFO) process has recently been under spotlight for its potential to improve forward osmosis (FO) process performance by applying low hydraulic pressure on the feed side. Structure parameter, one of the governing factors in estimating water flux and solute flux across FO membranes in the solution-diffusion model (S-D model), determines solute resistivity in FO and PAFO processes. This study aims to estimate the trend of structure parameter change with respect to varying additional hydraulic pressure condition in PAFO.

Effect of Corrosion Atmosphere and Strain Rate on the Stress Corrosion Cracking of High Strength 7xxx Aluminum Alloy (고강도 7xxx 알루미늄 합금의 응력부식균열에 미치는 부식환경과 응력속도의 영향)

  • Yun, Yeo-Wan;Kim, Sang-Ha
    • Journal of the Korean institute of surface engineering
    • /
    • v.41 no.3
    • /
    • pp.121-128
    • /
    • 2008
  • High strength 7xxx aluminum alloys have been applied to automotive bump back beam of the some limited model for light weight vehicle. The aluminum bump back beam is manufactured through extrusion, bending and welding. The residual stress given on these processes combines with the corrosive atmosphere on the road spreaded with corrosive chemicals to melt snow to occur the stress corrosion cracking. The composition of commercial 7xxx aluminum has Zn/Mg ratio about 3 and Cu over 2 wt% for better strength and stress corrosion cracking resistivity. But this composition isn't adequate for appling to the automotive bump back beam with high resistance to extrusion and bad weldability. In this study the composition of 7xxx aluminum alloy was modified to high Zn/Mg ratio and low Cu content for better extrusion and weldability. To estimate the resistivity against stress corrosion cracking of this aluminum alloy by slow strain rate test, the corrosion atmosphere and strain rate separate the stress corrosion cracking from conventional corrosion must be investigated. Using 0.6 Mol NaCl solution on slow strain rate test the stress corrosion cracking induced fracture was not observed. By adding 0.3% $H_2O_2$ and 0.6M $Na_2SO_4$ to 1M NaCl solution, the corrosion potential and current density of polarization curve moved to active potential and larger current density, and on the slow strain rate test the fracture energy in solution was lower than that in pre-exposure. These mean the stress corrosion cracking induced fracture can be estimated in this 1M NaCl + 0.3% $H_2O_2$ + 0.6M $Na_2SO_4$ solution. When the strain rate was below $2{\times}10^{-6}$, the stress corrosion cracking induced fracture start to be observed.

The Characteristic of PU/MWNT Foaming Film (PU/MWNT 발포필름의 발포 특성연구)

  • Park, Jun-Hyeong;Park, Mi-Ra;Choi, La-Hee;Kim, Seung-Jin
    • Textile Coloration and Finishing
    • /
    • v.24 no.1
    • /
    • pp.79-90
    • /
    • 2012
  • This study surveys the characteristics of the PU/MWNT foaming film according to foaming conditions. For this purpose, firstly, 16 kinds of PU/MWNT forming films were prepared with 4 kinds of dispersion solutions (IPA/MWNT, DMF/MWNT, MEK/MWNT, and Toluene/MWNT) and 4 kinds of blowing agents (organic I, organic II, capsule, and inorganic). The electrical resistivity of these PU/MWNT foaming films according to the dispersion solutions and blowing agents were analysed and discussed with surface profile and cell morphology of measured by SEM. And secondly, 24 kinds of PU/MWNT foaming films were also prepared with 2 kinds of IPA dispersion solution contents and 3 kinds of blowing agents with variation of the blowing temperatures and film thickness. The physical properties of the PU/MWNT foaming films such as electrical resistivity (surface and volume) and triboelectricity with cell morphology were measured and discused through the quantities of IPA, blowing agent added and also physical conditions(temperature, thickness so on) for establishing optimum foaming conditions with good electrostatic dissipation.

Electrical Properties of Electroplated Cu Thin Film by Electrolyte Composite (전해액 조성에 따른 구리박막의 전기적 특성 변화에 대한 연구)

  • Song, Yoo-Jin;Seo, Jung-Hye;Lee, Youn-Seoung;Rha, Sa-Kyun
    • Korean Journal of Materials Research
    • /
    • v.19 no.6
    • /
    • pp.344-348
    • /
    • 2009
  • The electrolyte effects of the electroplating solution in Cu films grown by ElectroPlating Deposition(EPD) were investigated. The electroplated Cu films were deposited on the Cu(20 nm)/Ti (20 nm)/p-type Si(100) substrate. Potentiostatic electrodeposition was carried out using three terminal methods: 1) an Ag/AgCl reference electrode, 2) a platinum plate as a counter electrode, and 3) a seed layer as a working electrode. In this study, we changed the concentration of a plating electrolyte that was composed of $CuSO_4$, $H_2SO_4$ and HCl. The resistivity was measured with a four-point probe and the material properties were investigated by using XRD(X-ray Diffraction), an AFM(Atomic Force Microscope), a FE-SEM(Field Emission Scanning Electron Microscope) and an XPS(X-ray Photoelectron Spectroscopy). From the results, we concluded that the increase of the concentration of electrolytes led to the increase of the film density and the decrease of the electrical resistivity of the electroplated Cu film.

Electrothermal Crack Analysis in a Finite Conductive Layer with Temperature-dependent Material Properties (온도 의존성 물성치를 가지는 유한한 전도층에서의 전기/열하중을 받는 균열의 해석)

  • Jang Yong-Hoon;Lee Sang-Young
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.30 no.8 s.251
    • /
    • pp.949-956
    • /
    • 2006
  • The method of Greenwood and Williamson is extended to obtain a solution to the coupled non-linear problem of steady-state electrical and thermal conduction across a crack in a conductive layer, for which the electrical resistivity and thermal conductivity are functions of temperature. The problem can be decomposed into the solution of a pair of non-linear algebraic equations involving boundary values and material properties. The new mixed-boundary value problem given from the thermal and electrical boundary conditions for the crack in the conductive layer is reduced in order to solve a singular integral equation of the first kind, the solution of which can be expressed in terms of the product of a series of the Chebyshev polynomials and their weight function. The non-existence of the solution for an infinite conductor in electrical and thermal conduction is shown. Numerical results are given showing the temperature field around the crack.

A Study for the Ohmic Contact of High Resistivity p-Cd$_{80}Zn_[20}$Te Semiconductor (고 비저항 p-Cd$_{80}Zn_[20}$Te의 저항성 전극형성에 관한 연구)

  • 최명진;왕진식
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1997.04a
    • /
    • pp.338-341
    • /
    • 1997
  • According to reports, it is impossible to make Ohmic Contact with high resistivity p type CdTe or CdZnTe semiconductor theoretically. But it is in need of making Ohmic Contact to fabricate semiconductor radiation detector By electroless deposition method using gold chloride solution, we made Ohmic Contact of Au and p-Cd$_{80}$Zn$_{20}$Te which grown by High Presure Bridgman Method in Aurora Technologies Corporation. We investigated the interface with Rutherford Backscattering Spectrometry and Auger electron spectroscopy. And we evaluated the degree of Ohmic Contact for the Au/CdZnTe interface by the I/V characteristic curve. As a result, we concluded that it showed excellent Ohmic Contact property by tunneling mechanism through the interface.e.

  • PDF

Nondestructive Imaging of Subspace Objects by 2D Electrical Resistance Tomography (2차원 전기비저항토모그래피를 이용한 지하물체의 비파괴 영상화)

  • Kim, Ho-Chan;Boo, Chang-Jin;Kim, Se-Ho;Jwa, Chong-Keun;Oh, Seong-Bo;Ko, Bong-Woon;Kim, Moon-Chan;Kim, Yong-Seok
    • Proceedings of the KIEE Conference
    • /
    • 2005.07d
    • /
    • pp.2619-2621
    • /
    • 2005
  • Electrical resistance tomography(ERT) maps resistivity values of the soil subsurface and characterizes buried objects. The characterization includes location, size, and resistivity of buried objects. In this paper, Gauss-Newton and truncated least squares(TLS) are presented for the solution of the ERT image reconstruction. Computer simulations show that the spatial resolution of the reconstructed images by the TLS approach is improved as compared to that obtained by the Gauss-Newton method.

  • PDF

Electrical Properties of Polyaniline according to Preparation Conditions (제조 조건에 따른 Polyaniline의 전기적 성질)

  • 김언령;김태영;이보현;김종은;서광석;배종현
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.14 no.3
    • /
    • pp.215-222
    • /
    • 2001
  • Polyaniline-Camphorsulfonic Acid Emeraldine Salt(PANI-CSA ES) was prepared by doping Polyaniline Ermeralidine Base(PANI EB) with DL-10-Camphorsulfonic Acid(CSA). PANI-CSA ES was solved in an organic solvent by ultrasonification for different periods of time and its surface resistivity was measured. Several PANI-CSA ES solutions solved in different organic solvents were prepared and their surface resistivities were measured. Thermal stability of film casted with PANI-CAS ES solution in m-cresol was estimated by measuring its surface conductivity and the content of this moisture and organic solvents. PANI-CSA ES was blended with different polymeric binders to improve its physical properties and the surface resistivities of several kinds of PANI-CSA ES blends were measured as a function of the content of PANI-CSA ES. PANI-CSA ES polymerized by 1-step oxidative polymerization was prepared and its surface resistivity was measured.

  • PDF

On the Properties of Nanostructured Cu-Pb Alloys Prepared by Mechanical Alloying (기계적 합금화 방법으로 제조된 Nanostructured Cu-Pb 합금의 물성 연구)

  • 김진천
    • Journal of Powder Materials
    • /
    • v.3 no.1
    • /
    • pp.33-41
    • /
    • 1996
  • Nanostructured Cu-Pb powders were synthesized by mechanical alloying process. The variation of powder characteristics with mechanical alloying time was investigated by x-ray diffraction, differential scanning calorimetry, SEM and TEM. An electrical resistivity of the hot pressed specimens was also measured by using the nanovoltmeter. It was shown that mechanical alloying for 12 hours leads to a homogenization and a grain refinement to the nanometer scale under 20 nm. The mechanically alloyed Cu-Pb alloys represented the enhanced solid solubility of 10wt% Pb in the Cu matrix. The monotectic temperature of nanostructured Cu-Pb alloy decreased from equilibrium state of 955$^{\circ}C$ to 855$^{\circ}C$ due to reduced grain size effect. The analysis of electrical resistivity showed that the hot pressed MA Cu-5wt% Pb compact existed as a solid solution.

  • PDF