Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Electrical Properties of Electroplated Cu Thin Film by Electrolyte Composite

전해액 조성에 따른 구리박막의 전기적 특성 변화에 대한 연구

  • Song, Yoo-Jin (Division of Industrial Metrology, Korea Research Institute of Standards and Science) ;
  • Seo, Jung-Hye (Department of Information Communication Engineering, Hanbat National University) ;
  • Lee, Youn-Seoung (Department of Information Communication Engineering, Hanbat National University) ;
  • Rha, Sa-Kyun (Department of Materials Engineering, Hanbat National University)
  • 송유진 (한국표준과학연구원) ;
  • 서정혜 (한밭대학교 정보통신공학과) ;
  • 이연승 (한밭대학교 정보통신공학과) ;
  • 나사균 (한밭대학교 재료공학과)
  • Published : 2009.06.27
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Abstract

The electrolyte effects of the electroplating solution in Cu films grown by ElectroPlating Deposition(EPD) were investigated. The electroplated Cu films were deposited on the Cu(20 nm)/Ti (20 nm)/p-type Si(100) substrate. Potentiostatic electrodeposition was carried out using three terminal methods: 1) an Ag/AgCl reference electrode, 2) a platinum plate as a counter electrode, and 3) a seed layer as a working electrode. In this study, we changed the concentration of a plating electrolyte that was composed of $CuSO_4$, $H_2SO_4$ and HCl. The resistivity was measured with a four-point probe and the material properties were investigated by using XRD(X-ray Diffraction), an AFM(Atomic Force Microscope), a FE-SEM(Field Emission Scanning Electron Microscope) and an XPS(X-ray Photoelectron Spectroscopy). From the results, we concluded that the increase of the concentration of electrolytes led to the increase of the film density and the decrease of the electrical resistivity of the electroplated Cu film.

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References

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