• Computers and Concrete
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• v.23 no.3
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• pp.189-201
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• 2019

Recent advances in the concrete technology are aiding in minimizing the use of conventional materials by substituting by-products of various industries and energy sources. A large amount of stone waste i.e., dust and slurry form both are being originated during natural stone processing and causing deadily effects on the environment. The disposal problem of stone waste can be resolved effectively by using waste in construction industries. In present work, Kota stone slurry powder, as a substitution of cement was used along with accelerators namely calcium nitrate and triethanolamine as additives, to study their impact on various properties of the concrete mixtures. Kota stone slurry powder (7.5%), calcium nitrate (1%) and triethanolamine (0.05%) were used separately as well in combination in different concrete mixtures. Mechanical Strength, modulus of elasticity and electrical resistivity of concrete specimens of different mix proportions under water curing were studied experimentally. The durability properties in terms of strength and electrical resistivity against sulphate and chloride solution attack at various curing ages were also studied experimentally. Results showed that accelerators and Kota stone slurry powder separately enhanced the mechanical strength and electrical resistivity; but, their combination decreased strength at all curing ages. The durability of concrete specimens was also affected under the exposure to chemical attack too. Kota stone slurry powder found to be the most effective material among all materials. Material characterization was also done to study the microstructural properties.

• Korean Journal of Metals and Materials
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• v.49 no.12
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• pp.917-923
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• 2011

Dissolution and precipitation behaviors of complex carbonitrides in austenite of a V-Nb microalloyed steel were quantitatively examined through electrical resistivity measurement and transmission electron microscopy. The electrical resistivity increased with solution treatment temperature up to $1240^{\circ}C$ and then was saturated at $225n{\Omega}m$ for a holding time of 10 min. The electrical resistivity method was also used to quantitatively measure the isothermal precipitation kinetics of the complex carbonitrides in austenite. Nb-rich precipitates were observed in austenite at the early stages of precipitation, but Nb was replaced by V up to the equilibrium amount within the precipitates with further holding time. The time-temperature-precipitation diagram showed a C-type curve; nose temperature and its incubation time were $900^{\circ}C$ and 100 s, respectively.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.95-99
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• 2008

Cu has been used for metallic interconnects in ULSI applications because of its lower resistivity according to the scaling down of semiconductor devices. The resistivity of Cu lines will affect the RC delay and will limit signal propagation in integrated circuits. We investigated the electrolyte effects of the electroplating solution in the resistivity value of Cu films grown by electroplating deposition (EPD). The resistivity was measured with a four-point probe and the material properties were investigated with XRD (X-ray Diffraction), AFM (Atomic Force Microscope), FE-SEM (Field Emission Scanning Electron Microscope) and XPS (X-ray Photoelectron Spectroscopy). From these experimental results, we found that the electrolyte condition plays an Important role in formation of Cu film with lower resistivity by EPD.

• Polymer(Korea)
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• v.31 no.5
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• pp.422-427
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• 2007

Semiconducting layers are thin rubber film between electrical cable wire and insulating polymer layers having a volume resistivity of ${\sim}10^2{\Omega}cm$. Commercial semiconducting layers ire composed of polymer composites reinforced with more than 30 wt% of carbon blacks. A new semiconducting material was suggested in this study based on the carbon nanotube(CNT)-reinforced polymer nanocomposites. CNT-reinforced polymer nanocomposites were prepared by solution mixing and precipitation with various polymer type and dual filler system. The mechanical, thermal and electrical properties were investigated as a function of polymer type and dual filler system based on CNT and carbon black. The volume resistivity of composites was strongly related with the crystallinity of polymer matrix. With the decreased crystallinity, the volume resistivity decreased linearly until a critical point, and it remained constant with further decreasing the crystallinity. Dual filler system also affected the volume resistivity. The CNT-reinforced nanocomposite showed the lowest volume resistivity. When a small amount of carbon black(CB) was replaced the CNT, the crystallinity increased considerably leading to a higher volume resistivity.

• Journal of Powder Materials
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• v.24 no.2
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• pp.153-163
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• 2017

Transparent conducting electrodes (TCEs) are attracting considerable attention as an important component for emerging optoelectronic applications such as liquid crystal displays, touch panels, and solar cells owing to their attractive combination of low resistivity (<$10^{-3}{\Omega}cm$) and high transparency (>80%) in the visible region. The solution-based process has unique properties of an easy fabrication procedure, scalability, and low cost compared to the conventional vacuum-based process and may prove to be a useful process for fabricating TCEs for future optoelectronic applications demanding large scale and flexibility. In this paper, we focus on the introduction of a solution-based process for TCEs. In addition, we consider the powder materials used to fabricate solution-based TCEs and strategies to improve their transparent conducting properties.

• Journal of the Korean institute of surface engineering
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• v.41 no.1
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• pp.23-27
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• 2008

The effect of solution agitation on the copper electroless deposition process of ULSI (ultra large scale integration) interconnections was investigated by using physical, electrochemical and electrical techniques. It was found that proper solution agitation was effective to obtain superconformal copper configuration within the trenches of $130{\sim}80nm$ width. The transition of open potential during electroless deposition process showed that solution agitation induced compact structure of copper deposits by suppressing mass transfer of cuprous ions toward substrate. Also, the specific resistivity of copper layers was lowered by increasing agitation speed, which made the deposited copper particles smaller. Considering both copper deposit configuration and electric property, around 500 rpm of solution agitation was the most suitable for the homogeneous electroless copper filling within the ultra-fine patterns.

• The Journal of Engineering Geology
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• v.17 no.1 s.50
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• pp.49-55
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• 2007

Various away methods are required in the electrical resistivity survey in order to find anomalous zone reliably. Array methods are classified as several groups. Among these group, a curved survey along the fixed elevation is designed to increase the mobility of men and survey equipments at the rough terrain. Another method is performed at the survey using inclined, curved, and horizontal boreholes. A survey can also be conducted in an arbitrary location by measurements of potentials for a multi sources. The complex data acquired using various away methods are represented by a correct images reconstructed from the 3D inversion. The element division is applied to the region in which the boreholes are curved and inclined because of a spatial discrepancies between the coordinate of each electrode and the nodal point in a model. The resistivity images are obtained from a good agreement for the anomalous zones in open slope and in survey using an inclined borehole.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.39.2-39.2
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• 2011

With the steady increase in the demand for flexible devices, mainly in display panels, researchers have focused on finding a novel material that have excellent electrical properties even when it is bended or stretched, along with superior mechanical and thermal properties. Graphene, a single-layered two-dimensional carbon lattice, has recently attracted tremendous research interest in this respect. However, the limitations in the growing method of graphene, mainly chemical vapor deposition on transition metal catalysts, has posed severe problems in terms of device integration, due to the laborious transfer process that may damage and contaminate the graphene layer. In addition, to lower the overall cost, a fabrication technique that supports low temperature and low vacuum is required, which is the main reason why solution-based process for graphene layer deposition has become the hot issue. Nonetheless, a direct deposition method of large area, few-layered, and uniform graphene layers has not been reported yet, along with a convenient method of patterning them. Here, we report an evaporation-induced technique for directly depositing few layers of graphene nanosheets with excellent uniformity and thickness controllability on any substrate. The printed graphene nanosheets can be patterned into desired shapes and structures, which can be directly applicable as flexible and transparent electrode. To illustrate such potential, the transport properties and resistivity of the deposited graphene layers have been investigated according to their thickness. The induced internal flow of the graphene solution during tis evaporation allows uniform deposition with which its thickness, and thus resistivity can be tuned by controlling the composition ratio of the solute and solvent.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.3
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• pp.294-305
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• 1994

The influence of deposition parameter on the electrical, optical andsurface morphology of $SnO_2(:F)$ films prepared by ultrasonic spray deposition using DBDA and $SnCl_4.5H_2O$ as a source material was studied. Resistivity was decreased sharply with increasing F/Sn ratio in solution up to 0.6. Depending on the source material, $SnCl_4.5H_2O$ shows lower resistivity than DBDA. When F/Sn ratio in solution was 1, optical transmittance was higher DBDA than $SnCl_4.5H_2O$.

• Journal of the Korean Electrochemical Society
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• v.20 no.1
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• pp.1-6
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• 2017

This study investigated the effect of surface pretreatment, which removes native Cu oxides on Cu seed layer, on subsequent Cu electro-/electroless deposition in Cu interconnection. The native Cu oxides were removed by using citric acid-based solution frequently used in Cu chemical mechanical polishing process and the selective Cu oxide removal was successfully achieved by controlling the solution composition. The characterization of electro-/electrolessly deposited Cu films after the oxide removal was then performed in terms of film resistivity, surface roughness, etc. It was observed that the lowest film resistivity and surface roughness were obtained from the substrate whose native Cu oxides were selectively removed.