Journal of Powder Materials (한국분말재료학회지)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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Research Trends in Powder Materials for Solution-based Transparent Conducting Electrode

용액기반 투명전극 분말 재료 연구 동향

  • Koo, Bon-Ryul (Program of Materials Science & Engineering, Convergence Institute of Biomedical Engineering and Biomaterials, Seoul National University of Science and Technology) ;
  • Ahn, Hyo-Jin (Program of Materials Science & Engineering, Convergence Institute of Biomedical Engineering and Biomaterials, Seoul National University of Science and Technology)
  • 구본율 (서울과학기술대학교 의공학 바이오소재 융합 협동과정 신소재공학프로그램) ;
  • 안효진 (서울과학기술대학교 의공학 바이오소재 융합 협동과정 신소재공학프로그램)
  • Received : 2017.03.30
  • Accepted : 2017.04.13
  • Published : 2017.04.28
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Abstract

Transparent conducting electrodes (TCEs) are attracting considerable attention as an important component for emerging optoelectronic applications such as liquid crystal displays, touch panels, and solar cells owing to their attractive combination of low resistivity (<$10^{-3}{\Omega}cm$) and high transparency (>80%) in the visible region. The solution-based process has unique properties of an easy fabrication procedure, scalability, and low cost compared to the conventional vacuum-based process and may prove to be a useful process for fabricating TCEs for future optoelectronic applications demanding large scale and flexibility. In this paper, we focus on the introduction of a solution-based process for TCEs. In addition, we consider the powder materials used to fabricate solution-based TCEs and strategies to improve their transparent conducting properties.

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References

  1. B. R. Koo, J. W. Bae and H. J. Ahn: Ceram. Int., 43 (2017) 6124. https://doi.org/10.1016/j.ceramint.2017.02.006
  2. B. R. Koo and H. J. Ahn: Ceram. Int., 42 (2016) 509. https://doi.org/10.1016/j.ceramint.2015.08.139
  3. B. R. Koo and H. J. Ahn: Ceram. Int., 40 (2014) 4375. https://doi.org/10.1016/j.ceramint.2013.08.108
  4. J. W. Bae, B. R. Koo, H. R. An and H. J. Ahn: Ceram. Int., 41 (2015) 14668. https://doi.org/10.1016/j.ceramint.2015.07.189
  5. H. R. An, S. H. Baek, I. K. Park and H. J. Ahn: Kor. J. Mater. Res., 23 (2013) 469. https://doi.org/10.3740/MRSK.2013.23.8.469
  6. D. S. Hecht, L. Hu and G. Irvin: Adv. Mater., 23 (2011) 1482. https://doi.org/10.1002/adma.201003188
  7. K. Ellmer: Nature Photon., 6 (2012) 809. https://doi.org/10.1038/nphoton.2012.282
  8. R. M. Pasquarelli, D. S. Ginley and R. O'Hayre: Chem. Soc. Rev., 40 (2011) 5406. https://doi.org/10.1039/c1cs15065k
  9. S. M. Bergin, Y. H. Chen, A. R. Rathmell, P. Charbonneau, Z. Y. Li and B. J. Wiley: Nanoscale, 4 (2012) 1996. https://doi.org/10.1039/c2nr30126a
  10. C. C. Wu, C. I. Wu, J. C. Sturm and A. Kahn: Appl. Phys. Lett., 70 (1997) 1348. https://doi.org/10.1063/1.118575
  11. A. Kim. Y. Won, K. Woo, C. H. Kim and J. Moon: ACS nano, 7 (2013) 1081. https://doi.org/10.1021/nn305491x
  12. S. M. Selbach, G. Wang, M. A. Einarsrud and T. Grande: J. Am. Ceram. Soc., 90 (2007) 2649. https://doi.org/10.1111/j.1551-2916.2007.01789.x
  13. M. Okuya, N. Ito and K. Shiozaki: Thin Solid Films, 515 (2007) 8656. https://doi.org/10.1016/j.tsf.2007.03.148
  14. D. Lu, Y. Wu, J. Guo, G. Lu, Y. Wang and J. Shen: Mater. Sci. Eng. B, 97 (2003) 141. https://doi.org/10.1016/S0921-5107(02)00435-X
  15. W. M. Tsang, F. L. Wong, M. K. Fung, J. C. Chang, C. S. Lee and S. T. Lee: Thin Solid Films, 517 (2008) 891. https://doi.org/10.1016/j.tsf.2008.08.157
  16. G. Goncalves, E. Elangovan, P. Barquinha, L. Pereira, R. Martins and E. Fortunato: Thin Solid Films, 515 (2007) 8562. https://doi.org/10.1016/j.tsf.2007.03.126
  17. B. Y. Oh, M. C. Jeong, D. S. Kim, W. Lee and J. M. Myoung: J. Cryst. Growth, 281 (2005) 475. https://doi.org/10.1016/j.jcrysgro.2005.04.045
  18. D. P. Birnie: J. Mater. Res., 16 (2001) 1145. https://doi.org/10.1557/JMR.2001.0158
  19. Z. Chen, W. Li, R. Li, Y. Zhang, G. Xu and H. Cheng: Langmuir, 29 (2013) 13836. https://doi.org/10.1021/la4033282
  20. Z. Chen, X. Qin, T. Zhou, X. Wu, S. Shao, M. Xie and Z. Cui: J. Mater. Chem. C, 3 (2015) 11464. https://doi.org/10.1039/C5TC00180C
  21. H. An and H. J. Ahn: Mater. Lett., 81 (2012) 41. https://doi.org/10.1016/j.matlet.2012.04.143
  22. H. Wu, L. Hu, M. W. Rowell, D. Kong, J. J. Cha, J. R. McDonough, J. Zhu, Y. Yang, M. D. McGehee and Y. Cui: Nano Lett., 10 (2010) 4242. https://doi.org/10.1021/nl102725k
  23. M. Singh, H. M. Haverinen, P. Dhagat, and G. E. Jabbour: Adv. Mater., 22 (2010) 673. https://doi.org/10.1002/adma.200901141
  24. K. Nakashima and Y. Kumahara: Vacuum, 66 (2002) 221. https://doi.org/10.1016/S0042-207X(02)00145-8
  25. D. M. Lee, J. K. Kim, J. Hao, H. K. Kim, J. S. Yoon, and J. M. Lee: J. Alloy. Compd., 583 (2014) 535. https://doi.org/10.1016/j.jallcom.2013.09.008
  26. H. I. Shin, K. H. Kim, T. W. Kim and H. K. Kim: Ceram. Int., 42 (2016) 13983. https://doi.org/10.1016/j.ceramint.2016.06.001
  27. Y. Yang, J. L. Wang, L. Liu, Z. H. Wang, J. W. Liu, and S. H. Yu: Nanoscale, 9 (2017) 52. https://doi.org/10.1039/C6NR06984C
  28. B. R. Koo and H. J. Ahn: Appl. Phys. Express, 7 (2014) 075002. https://doi.org/10.7567/APEX.7.075002
  29. J. Wang, J. Jiu, T. Sugahara, S. Nagao, M. Nogi, H. Koga, P. He, K. Suganuma and H. Uchida: ACS Appl. Mater. Interfaces, 7 (2015) 23297. https://doi.org/10.1021/acsami.5b07619
  30. J. A. Jeong, H. K. Kim and J. Kim: Sol. Energy Mater. Sol. Cells, 125 (2014) 113. https://doi.org/10.1016/j.solmat.2014.03.003
  31. J. A. Jeong and H. K. Kim: Appl. Phys. Lett., 104 (2014) 071906. https://doi.org/10.1063/1.4866007
  32. K. S. Kim, Y. Zhao, H. Jang, S. Y. Lee, J. M. Kim, K. S. Kim, J. H. Ahn, P. Kim, J. Y. Choi and B. H. Hong: Nature, 457 (2009) 706. https://doi.org/10.1038/nature07719
  33. D. S. Hecht, A. M. Heintz, R. Lee, L. Hu, B. Moore, C. Cucksey and S. Risser: Nanotechnology, 22 (2011) 169501. https://doi.org/10.1088/0957-4484/22/16/169501
  34. D. S. Hecht, L. Hu and G. Irvin: Adv. Mater., 23 (2011) 1482. https://doi.org/10.1002/adma.201003188
  35. V. C. Tung, L. M. Chen, M. J. Allen, J. K. Wassei, K. Nelson, R. B. Kaner and Y. Yang: Nano Lett., 9 (2009) 1949. https://doi.org/10.1021/nl9001525
  36. Y. Ahn, Y. Jeong and Y. Lee: ACS Appl. Mater. Interfaces, 4 (2012) 6410. https://doi.org/10.1021/am301913w