• 제목/요약/키워드: silicon (Si)

검색결과 3,678건 처리시간 0.03초

규소/질화규소 비가 자전연소합성공정을 이용한 다공질 질화규소 세라믹스의 미세구조와 특성에 미치는 영향 (Effect of Si/$Si_3N_4$ Ration on the Micro structure and Properties of Porous Silicon Nitride Prepared by SHS Method)

  • 김동백;박동수;한병동;정연길
    • 연구논문집
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    • 통권34호
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    • pp.131-138
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    • 2004
  • Porous silicon nitride ceramics were prepared by Self-propagating High Temperature Synthesis from silicon powder, silicon nitride powder and the pore-forming precursor. The microstructure, porosity and the flexural strength of the porous silicon nitride ceramics were varied according to the Si/$Si_3N_4$ ratio, size and amount of the pore-forming precursors. Some samples exhibited as high flexural strength as $162\pm24$ MPa. The high strength is considered to result from the fine pore size and the strong bonding among the silicon nitrid particles.

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Preparation and Characterization of Porous Silicon and Carbon Composite as an Anode Material for Lithium Rechargeable Batteries

  • Park, Junsoo;Lee, Jae-Won
    • 한국분말재료학회지
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    • 제22권1호
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    • pp.15-20
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    • 2015
  • The composite of porous silicon (Si) and amorphous carbon (C) is prepared by pyrolysis of a nano-porous Si + pitch mixture. The nano-porous Si is prepared by mechanical milling of magnesium powder with silicon monoxide (SiO) followed by removal of MgO with hydrochloric acid (etching process). The Brunauer-Emmett-Teller (BET) surface area of porous Si ($64.52m^2g^{-1}$) is much higher than that before etching Si/MgO ($4.28m^2g^{-1}$) which indicates pores are formed in Si after the etching process. Cycling stability is examined for the nano-porous Si + C composite and the result is compared with the composite of nonporous Si + C. The capacity retention of the former composite is 59.6% after 50 charge/discharge cycles while the latter shows only 28.0%. The pores of Si formed after the etching process is believed to accommodate large volumetric change of Si during charging and discharging process.

Key Factors for the Development of Silicon Quantum Dot Solar Cell

  • 김경중;박재희;홍승휘;최석호;황혜현;장종식
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.207-207
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    • 2012
  • Si quantum dot (QD) imbedded in a $SiO_2$ matrix is a promising material for the next generation optoelectronic devices, such as solar cells and light emission diodes (LEDs). However, low conductivity of the Si quantum dot layer is a great hindrance for the performance of the Si QD-based optoelectronic devices. The effective doping of the Si QDs by semiconducting elements is one of the most important factors for the improvement of conductivity. High dielectric constant of the matrix material $SiO_2$ is an additional source of the low conductivity. Active doping of B was observed in nanometer silicon layers confined in $SiO_2$ layers by secondary ion mass spectrometry (SIMS) depth profiling analysis and confirmed by Hall effect measurements. The uniformly distributed boron atoms in the B-doped silicon layers of $[SiO_2(8nm)/B-doped\;Si(10nm)]_5$ films turned out to be segregated into the $Si/SiO_2$ interfaces and the Si bulk, forming a distinct bimodal distribution by annealing at high temperature. B atoms in the Si layers were found to preferentially substitute inactive three-fold Si atoms in the grain boundaries and then substitute the four-fold Si atoms to achieve electrically active doping. As a result, active doping of B is initiated at high doping concentrations above $1.1{\times}10^{20}atoms/cm^3$ and high active doping of $3{\times}10^{20}atoms/cm^3$ could be achieved. The active doping in ultra-thin Si layers were implemented to silicon quantum dots (QDs) to realize a Si QD solar cell. A high energy conversion efficiency of 13.4% was realized from a p-type Si QD solar cell with B concentration of $4{\times}1^{20}atoms/cm^3$. We will present the diffusion behaviors of the various dopants in silicon nanostructures and the performance of the Si quantum dot solar cell with the optimized structures.

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Al 박막을 이용한 다결정 Si 박막의 제조에서 기판온도 영향 연구 (Effect of Substrate Temperature on Polycrystalline Silicon Film Deposited on Al Layer)

  • 안경민;강승모;안병태
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.96.2-96.2
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    • 2010
  • The surface morphology and structural properties of polycrystalline silicon (poly-Si) films made in-situ aluminum induced crystallization at various substrate temperature (300~600) was investigated. Silicon films were deposited by hot-wire chemical vapor deposition (HWCVD), as the catalytic or pyrolytic decomposition of precursor gases SiH4 occurs only on the surface of the heated wire. Aluminum films were deposited by DC magnetron sputtering at room temperature. continuous poly-Si films were achieved at low temperature. from cross-section TEM analyses, It was confirmed that poly-Si above $450^{\circ}C$ was successfully grown on and poly-Si films had (111) preferred orientation. As substrate temperature increases, Si(111)/Si(220) ratio was decreased. The electrical properties of poly-Si film were investigated by Hall effect measurement. Poly-Si film was p-type by Al and resistivity and hall effect mobility was affected by substrate temperature.

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Buried Contact Solar Cells using Tri-crystalline Silicon Wafer

  • Lee Soo-Hong
    • Transactions on Electrical and Electronic Materials
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    • 제4권3호
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    • pp.29-33
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    • 2003
  • Tri-crystalline silicon wafers have three different orientations and three-grain boundaries. In this paper, tri-crystalline silicon (tri-Si) wafers have been used for the fabrication of buried contact solar cells. The optical and micro-structural properties of these cells after texturing in KOH solution have been investigated and compared with those of cast mult- crystalline silicon (multi-Si) wafers. We employed a cost effective fabrication process and achieved buried contact solar cell (BCSC) energy conversion efficiencies up to $15\%$ whereas the cast multi-Si wafer has efficiency around $14\%$.

SiGe HBT의 Current Gain특성 향상 (Current Gain Enhancement in SiGe HBTs)

  • 송오성;이상돈;김득중
    • 한국산학기술학회논문지
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    • 제5권4호
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    • pp.367-370
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    • 2004
  • 초고속 RF IC의 핵심소자인 SiGe 에피텍시층을 가진 이종양극트란지스터(hetero junction bipolar transistor: HBT)를 0.35㎛급 Si-Ge BiCMOS공정으로 제작하였다. 낮은 VBE영역에서의 current gain의 선형성을 향상시키기 위하여 SiGe에피텍시층의 결함밀도를 감소시킬 수 있는 캐핑실리콘의 두께와 EDR온도의 최적화 공정조건을 알아보았다. 캐핑 실리콘의 두께를 200Å과 300Å으로 나누고 초고속 무선통신에서 요구되는 낮은 노이즈를 위한 EDR(Emitter Drive-in RTA)의 온도와 시간을 900-1000℃, 0-30 sec로 각각 변화시키면서 최적조건을 확인하였다. 실험범위 내에서의 최적공정조건은 300Å의 capping 실리콘과 975℃-30sec의 EDR 조건을 확인하였다.

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플라즈마 화학기상증착법을 이용한 비정질 규소 및 질화규소의 저온성막 연구 (Low-Temperature Processing of Amorphous Silicon and Silicon-Nitride Films Using PECVD Method)

  • 이호년
    • 한국산학기술학회논문지
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    • 제8권5호
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    • pp.1013-1019
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    • 2007
  • [ $150^{\circ}C$ ]의 저온에서 플라즈마 화학기상증착 (PECVD) 방법으로 비정질 규소 및 질화규소 박막을 성막 하였다. 비정질 질화규소 박막은 소스 가스의 수소 분율을 증가시킴에 따라 굴절률이 1.9에 접근하고 질소-수소 결합이 주도적이 되어 고온성막한 박막에 버금가는 특성을 보였다. 비정질 규소 박막은 소스 가스의 수소 분율을 높임에 따라 굴절률과 광학적 금지대역의 크기가 고온 성막된 박막의 값인 4.2와 1.8 eV에 근접한 값을 가지게 되었으며, $[Si-H]/([Si-H]+[Si-H_2])$의 값이 증가하여 양질의 박막특성을 얻을 수 있었다. RF 전력 및 증착 압력에 대해서 낮은 전력과 작은 압력에서 양질의 박막을 얻을 수 있었으며, 박막 특성은 RF 전력 보다는 증착 압력의 변화에 대해서 좀더 큰 의존성을 보였다. 박막트랜지스터 제작에 적용 가능한 양질의 비정질 규소 및 질화규소 박막을 저온에서 얻기 위해서는 소스 가스의 수소 분율을 높게 하는 것이 중요한 공통 인자로 파악되었다.

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SiNx passivation에 따른 Solar Cell의 효율향상에 관한 연구 (A Study of High-efficiency me-silicon solar cells for SiNx passivation)

  • 고재경;임동건;김도영;박성현;박중현;이준신
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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    • pp.964-967
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    • 2002
  • The effectiveness of silicon nitride SiNx surface passivation is investigated and quantified. This study adopted single-layer antireflection (SLAR) coating of SiNx for efficiency improvement of solar cell. The silicon nitride films were deposited by means of plasma enhanced chemical vapor deposition (PECVD) in planar coil reactor. The process gases used were pure ammonia and a mixture of silane and helium. The thickness and the refractive index on the films were measured by ellipsometry and chemical bonds were determined by using an FT-IR equipment. This films obtained were analyzed in term of hydrogen content, refractive index for gas flow ratio $(NH_3/SiH_4)$, and efficiency of solar cell. The polycrystalline silicon solar cells passivated by silicon nitride shows efficiency above 12.8%.

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삼상 실리콘 기판을 사용한 저가 전극 함몰형 태양전지 (Buried contact solar cells using tri-crystalline silicon wafer)

  • 권재홍;이수홍
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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    • pp.176-180
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    • 2003
  • Tri-crystalline silicon (Tri-Si) wafers have three different orientations and three grain boundaries. In this paper, tri-Si wafers have been used for the fabrication of buried contact solar cells. The optical and micro-structural properties of these cells after texturing in KOH solution have been investigated and compared with those of cast multi-crystalline silicon (multi-Si) wafers. We employed a cost effective fabrication process and achieved buried contact solar cell (BCSC) energy conversion efficiencies up to 15% whereas the cast multi-Si wafer has efficiency around 14%.

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실리콘과 카본을 이용한 다공질 탄화규소의 제조와 기계적 특성 (Fabrication and Mechanical Properties of Porous Silicon Carbide Ceramics from Silicon and Carbon Mixture)

  • 김종찬;이은주;김득중
    • 한국세라믹학회지
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    • 제50권6호
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    • pp.429-433
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    • 2013
  • Silicon, carbon, and B4C powders were used as raw materials for the fabrication of porous SiC. ${\beta}$-SiC was synthesized at $1500^{\circ}C$ in an Ar atmosphere from a silicon and carbon mixture. The synthesized powders were pressed into disk shapes and then heated at $2100^{\circ}C$. ${\beta}$-SiC particles transformed to ${\alpha}$-SiC at over $1900^{\circ}C$, and rapid grain growth of ${\alpha}$-SiC subsequently occurred and a porous structure with elongated plate-type grains was formed. The mechanism of this rapid grain growth is thought to be an evaporation-condensation reaction. The mechanical properties of the fabricated porous SiC were investigated and discussed.