• Title/Summary/Keyword: schottky effect

Search Result 147, Processing Time 0.024 seconds

Magnetoresistance Characteristics due to the Schottky Contact of Zinc Tin Oixide Thin Films (ZTO 박막의 쇼키접합에 기인하는 자기저항특성)

  • Li, XiangJiang;Oh, Teresa
    • Journal of the Semiconductor & Display Technology
    • /
    • v.18 no.4
    • /
    • pp.120-123
    • /
    • 2019
  • The effect of surface plasmon on ZTO thin films was investigated. The phenomenon of depletion occurring in the interface of the ZTO thin film created a potential barrier and the dielectric layer of the depletion formed a non-mass particle called plasmon. ZTO thin film represents n-type semiconductor features, and surface current by plasma has been able to obtain the effect of improving electrical efficiency as a result of high current at positive voltage and low current at negative voltage. It can be seen that the reduction of electric charge due to recombination of electronic hole pairs by heat treatment of compound semiconductors induces higher surface current in semiconductor devices.

Schottky Barrier Tunnel Field-Effect Transistor using Spacer Technique

  • Kim, Hyun Woo;Kim, Jong Pil;Kim, Sang Wan;Sun, Min-Chul;Kim, Garam;Kim, Jang Hyun;Park, Euyhwan;Kim, Hyungjin;Park, Byung-Gook
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.14 no.5
    • /
    • pp.572-578
    • /
    • 2014
  • In order to overcome small current drivability of a tunneling field-effect transistor (TFET), a TFET using Schottky barrier (SBTFET) is proposed. The proposed device has a metal source region unlike the conventional TFET. In addition, dopant segregation technology between the source and channel region is applied to reduce tunneling resistance. For TFET fabrication, spacer technique is adopted to enable self-aligned process because the SBTFET consists of source and drain with different types. Also the control device which has a doped source region is made to compare the electrical characteristics with those of the SBTFET. From the measured results, the SBTFET shows better on/off switching property than the control device. The observed drive current is larger than those of the previously reported TFET. Also, short-channel effects (SCEs) are investigated through the comparison of electrical characteristics between the long- and short-channel SBTFET.

The Effect of Surface Plasmon on Internal Photoemission Measured on Ag/$TiO_2$ Nanodiodes

  • Lee, Hyosun;Lee, Young Keun;Park, Jeong Young
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.02a
    • /
    • pp.662-662
    • /
    • 2013
  • Over the last several decades, innovative light-harvesting devices have evolved to achieve high efficiency in solar energy transfer. Research on the mechanisms for plasmon resonance is very desirable to overcome the conventional efficiency limits of photovoltaics. The influence of localized surface plasmon resonance on hot electron flow at a metal-semiconductor interface was observed with a Schottky diode composed of a thin silver layer on $TiO_2$. The photocurrent is generated by absorption of photons when electrons have enough energy to travel over the Schottky barrier and into the titanium oxide conduction band. The correlation between the hot electrons and the surface plasmon is confirmed by matching the range of peaks between the incident photons to current conversion efficiency (IPCE, flux of collected electrons per flux of incident photons) and UV-Vis spectra. The photocurrent measured on Ag/$TiO_2$ exhibited surface plasmon peaks; whereas, in contrast to the Au/$TiO_2$, a continuous Au thin film doesn't exhibit surface plasmon peaks. We modified the thickness and morphology of a continuous Ag layer by electron beam evaporation deposition and heating under gas conditions and found that the morphological change and thickness of the Ag film are key factors in controlling the peak position of light absorption.

  • PDF

Effect on 4H-SiC Schottky Rectifiers of Ar Discharges Generated in A Planar Inductively Coupled Plasma Source

  • Jung, P.G.;Lim, W.T.;Cho, G.S.;Jeon, M.H.;Lee, J.W.;Nigam, S.;Ren, F.;Chung, G.Y.;Macmillan, M.F.;Pearton, S.J.
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.3 no.1
    • /
    • pp.21-26
    • /
    • 2003
  • 4H-SiC Schottky rectifiers were exposed to pure Ar discharges in a planar coil Inductively Coupled Plasma system, as a function of source power, of chuck power and process pressure. The reverse breakdown voltage ($V_B$) decreased as a result of plasma exposure due to the creation of surface defects associated with the ion bombardment. The magnitude of the decrease was a function of both ion flux and ion energy. The forward turn-on voltage ($V_F$), on-state resistance ($R_{ON}$) and diode ideality factor (n) all increased after plasma exposure. The changes in all of the rectifier parameters were minimized at low power, high pressure plasma conditions.

Schottky Barrier MOSFETs with High Current Drivability for Nano-regime Applications

  • Jang, Moon-Gyu;Kim, Yark-Yeon;Jun, Myung-Sim;Choi, Chel-Jong;Kim, Tae-Youb;Park, Byoung-Chul;Lee, Seong-Jae
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.6 no.1
    • /
    • pp.10-15
    • /
    • 2006
  • Various sizes of erbium/platinum silicided n/p-type Schottky barrier metal-oxide-semiconductor field effect transistors (SB-MOSFETs) are manufactured from $20{\mu}m$ to 10nm. The manufactured SB-MOSFETs show excellent DIBL and subthreshold swing characteristics due to the existence of Schottky barrier between source and channel. It is found that the minimization of trap density between silicide and silicon interface and the reduction of the underlap resistance are the key factors for the improvement of short channel characteristics. The manufactured 10 nm n-type SBMOSFET showed $550{\mu}A/um$ saturation current at $V_{GS}-V_T$ = $V_{DS}$ = 2V condition ($T_{ox}$ = 5nm) with excellent short channel characteristics, which is the highest current level compared with reported data.

The Effect of thin Stepped Oside Structure Along Contact Edge on the Breakdown Voltage of Al-nSi Schottky Diode (Al-nSi 쇼트키 다이오드의 접합면 주위의 얇은 계단형 산화막 구조가 항복 전압에 미치는 영향)

  • 장지근;김봉렬
    • Journal of the Korean Institute of Telematics and Electronics
    • /
    • v.20 no.3
    • /
    • pp.33-39
    • /
    • 1983
  • New Schottky devices with thin stepped oxide layer (about 1000 ${\AA}$) along the edge of metal-semiconductor junction have been designed and fabricated. The breakdown voltages of these diodes have been compared with those of conventional metal overlap and P guard ring Schottky diode structures. Thin stepped oxide layer has been grown by the process of T.C.E. oxidation. In order to compare and demonstrate the improved down phenomena of these devices, conventional metal overlap diode and P guard ring which have the same dimension with new devices have also been integrated in a same New Schottty devices structured with thin stepped oxide layer have shown significant improvement in breakdown phenomena compared with conventional diodes.

  • PDF

Hydrogen Gas Sensing Characteristics of Pd-SiC Schottky Diode (Pd-SiC 쇼트키 다이오드의 수소 가스 감응 특성)

  • Kim, Chang-Kyo;Lee, Joo-Hun;Lee, Young-Hwan;Choi, Suk-Min;Cho, Nam-Ihn
    • Journal of Sensor Science and Technology
    • /
    • v.8 no.6
    • /
    • pp.448-453
    • /
    • 1999
  • A Pd-SiC Schottky diode for detection of hydrogen gas operating at high temperature was explored. Hydrogen-sensing behaviors of Pd-SiC Schottky diode were analyzed as a function of hydrogen concentration and temperature by I-V and ${\Delta}I$-t methods under steady-state and transient conditions. The effect of hydrogen adsorption on the barrier height was investigated. Analysis of the steady-state kinetics using I-V method confirmed that the atomistic hydrogen adsorption process is responsible for the barrier height change in the diode.

  • PDF

The characteristics of source/drain structure for MOS typed device using Schottky barrier junction (Schottky 장벽 접합을 이용한 MOS형 소자의 소오스/드레인 구조의 특성)

  • 유장열
    • Journal of the Korean Institute of Telematics and Electronics T
    • /
    • v.35T no.1
    • /
    • pp.7-13
    • /
    • 1998
  • The VLSI devices of submicron level trend to have a lowering of reliability because of hot carriers by two dimensional influences which are caused by short channel effects and which are not generated in a long channel devices. In order to minimize the two dimensional influences, much research has been made into various types of source/drain structures. MOS typed tunnel transistor with Schottky barrier junctions at source/drain, which has the advantages in fabrication process, downsizing and response speed, has been proposed. The experimental device was fabricated with p type silicon, and manifested the transistor action, showing the unsaturated output characteristics and the high transconductance comparing with that in field effect mode. The results of trial indicate for better performance as follows; high doped channel layer to lower the driving voltage, high resistivity substrate to reduce the leakage current from the substrate to drain.

  • PDF

Power Generating Characteristics of Zinc Oxide Nanorods Grown on a Flexible Substrate by a Hydrothermal Method

  • Choi, Jae-Hoon;You, Xueqiu;Kim, Chul;Park, Jung-Il;Pak, James Jung-Ho
    • Journal of Electrical Engineering and Technology
    • /
    • v.5 no.4
    • /
    • pp.640-645
    • /
    • 2010
  • This paper describes the power generating property of hydrothermally grown ZnO nanorods on a flexible polyethersulfone (PES) substrate. The piezoelectric currents generated by the ZnO nanorods were measured when bending the ZnO nanorod by using I-AFM, and the measured piezoelectric currents ranged from 60 to 100 pA. When the PtIr coated tip bends a ZnO nanorod, piezoelectrical asymmetric potential is created on the nanorod surface. The Schottky barrier at the ZnO-metal interface accumulates elecntrons and then release very quickly generating the currents when the tip moves from tensile to compressed part of ZnO nanorod. These ZnO nanorods were grown almost vertically with the length of 300-500 nm and the diameter of 30-60 nm on the Ag/Ti/PES substrate at $90^{\circ}C$ for 6 hours by hydrothermal method. The metal-semiconductor interface property was evaluated by using a HP 4145B Semiconductor Parameter Analyzer and the piezoelectric effect of the ZnO nanorods were evaluated by using an I-AFM. From the measured I-V characteristics, it was observed that ZnO-Ag and ZnO-Au metal-semiconductor interfaces showed an ohmic and a Schottky contact characteristics, respectively. ANSYS finite element simulation was performed in order to understand the power generation mechanism of the ZnO nanorods under applied external stress theoretically.

Study on DC Characteristics of 4H-SiC Recessed-Gate MESFETs (Recessed-gate 4H-SiC MESFET의 DC특성에 관한 연구)

  • Park, Seung-Wook;Hwang, Ung-Jun;Shin, Moo-Whan
    • Korean Journal of Materials Research
    • /
    • v.13 no.1
    • /
    • pp.11-17
    • /
    • 2003
  • DC characteristics of recessed gate 4H-SiC MESFET were investigated using the device/circuit simulation tool, PISCES. Results of theoretical calculation were compared with the experimental data for the extraction of modeling parameters which were implemented for the prediction of DC and gate leakage characteristics at high temperatures. The current-voltage analysis using a fixed mobility model revealed that the short channel effect is influenced by the defects in SiC. The incomplete ionization models are found out significant physical models for an accurate prediction of SiC device performance. Gate leakage is shown to increase with the device operation temperatures and to decrease with the Schottky barrier height of gate metal.