• Title/Summary/Keyword: schottky barrier diode

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Structuyal and physical properties of thin copper films deposited on porous silicon (다공성 실리콘위에 증착된 Cu 박막의 구조적 물리적 특성)

  • 홍광표;권덕렬;박현아;이종무
    • Journal of the Korean Vacuum Society
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    • v.12 no.2
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    • pp.123-129
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    • 2003
  • Thin transparent Cu films in the thickness range of 10 ~ 40 nm are deposited by rf-magnetron sputtering on porous silicon (PS) anodized on p-type silicon in dark. Microstructural features of the Cu films are investigated using SEM, AFM and XRD techniques. The RMS roughness of the Cu films is found to be around 1.47 nm and the grain growth is columnar with a (111) preferred orientation and follows the Volmer-Weber mode. The photoluminescence studies showed that a broad luminiscence peak of PS near the blue-green region gets blue shifted (~0.05 eV) with a small reduction in intensity and therefore, Cu-related PL quenching is absent. The FTIR absorption spectra on the PS/Cu structure revealed no major change of the native PS peaks but only a reduction in the relative intensity. The I-V characteristic curves further establish the Schottky nature of the diode with an ideality factor of 2.77 and a barrier height of 0.678 eV. An electroluminiscence (EL) signal of small intensity could be detected for the above diode.

Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss

  • Jung, Dong Yun;Jang, Hyun Gyu;Kim, Minki;Jun, Chi-Hoon;Park, Junbo;Lee, Hyun-Soo;Park, Jong Moon;Ko, Sang Choon
    • ETRI Journal
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    • v.39 no.6
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    • pp.866-873
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    • 2017
  • We propose a multilayered-substrate-based power semiconductor discrete device package for a low switching loss and high heat dissipation. To verify the proposed package, cost-effective, low-temperature co-fired ceramic, multilayered substrates are used. A bare die is attached to an embedded cavity of the multilayered substrate. Because the height of the pad on the top plane of the die and the signal line on the substrate are the same, the length of the bond wires can be shortened. A large number of thermal vias with a high thermal conductivity are embedded in the multilayered substrate to increase the heat dissipation rate of the package. The packaged silicon carbide Schottky barrier diode satisfies the reliability testing of a high-temperature storage life and temperature humidity bias. At $175^{\circ}C$, the forward current is 7 A at a forward voltage of 1.13 V, and the reverse leakage current is below 100 lA up to a reverse voltage of 980 V. The measured maximum reverse current ($I_{RM}$), reverse recovery time ($T_{rr}$), and reverse recovery charge ($Q_{rr}$) are 2.4 A, 16.6 ns, and 19.92 nC, respectively, at a reverse voltage of 300 V and di/dt equal to $300A/{\mu}s$.

One-dimensional Schottky nanodiode based on telescoping polyprismanes

  • Sergeyev, Daulet
    • Advances in nano research
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    • v.10 no.4
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    • pp.339-347
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    • 2021
  • In the framework of the density functional theory combined with the method of non-equilibrium Green functions (DFT + NEGF), the electric transport properties of a one-dimensional nanodevice consisting of telescoping polyprismanes with various types of electrical conductivity were studied. Its transmission spectra, density of state, current-voltage characteristic, and differential conductivity are determined. It was shown that C[14,17], C[14,11], C[14,16], C[14,10] show a metallic nature, and polyprismanes C[14,5], C[14,4] possess semiconductor properties and has a band gap of 0.4 eV and 0.6 eV, respectively. It was found that, when metal C[14,11], C[14,10] and semiconductor C[14,5], C[14,4] polyprismanes are coaxially connected, a Schottky barrier is formed and a weak diode effect is observed, i.e., manifested valve (rectifying) property of telescoping polyprismanes. The enhancement of this effect occurs in the nanodevices C[14,17] - C[14,11] - C[14,5] and C[14,16] - C[14,10] - C[14,4], which have the properties of nanodiode and back nanodiode, respectively. The simulation results can be useful in creating promising active one-dimensional elements of nanoelectronics.

One-dimensional Schottky nanodiode based on telescoping polyprismanes

  • Sergeyev, Daulet
    • Advances in nano research
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    • v.10 no.5
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    • pp.471-479
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    • 2021
  • In the framework of the density functional theory combined with the method of non-equilibrium Green functions (DFT + NEGF), the electric transport properties of a one-dimensional nanodevice consisting of telescoping polyprismanes with various types of electrical conductivity were studied. Its transmission spectra, density of state, current-voltage characteristic, and differential conductivity are determined. It was shown that C[14,17], C[14,11], C[14,16], C[14,10] show a metallic nature, and polyprismanes C[14,5], C[14,4] possess semiconductor properties and has a band gap of 0.4 eV and 0.6 eV, respectively. It was found that, when metal C[14,11], C[14,10] and semiconductor C[14,5], C[14,4] polyprismanes are coaxially connected, a Schottky barrier is formed and a weak diode effect is observed, i.e., manifested valve (rectifying) property of telescoping polyprismanes. The enhancement of this effect occurs in the nanodevices C[14,17] - C[14,11] - C[14,5] and C[14,16] - C[14,10] - C[14,4], which have the properties of nanodiode and back nanodiode, respectively. The simulation results can be useful in creating promising active one-dimensional elements of nanoelectronics.

6.6 kW On-Vehicle Charger with a Hybrid Si IGBTs and SiC SBDs Based Booster Power Module

  • Han, Timothy Junghee;Preston, Jared;Ouwerkerk, David
    • Journal of Power Electronics
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    • v.13 no.4
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    • pp.584-591
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    • 2013
  • In this paper, a hybrid booster power module with Si IGBT and Silicon Carbide (SiC) Schottky Barrier Diode (SBDs) is presented. The switching characteristics of the hybrid booster module are compared with commercial Silicon IGBT/Si PIN diode based modules. We applied the booster power module into a non-isolated on board vehicle charger with a simple buck-booster topology. The performances of the on-vehicle charger are analyzed and measured with different power modules. The test data is measured in the same system, at the same points of operation, using the conventional Si and hybrid Si/SiC power modules. The measured power conversion efficiency of the proposed on-vehicle charger is 96.4 % with the SiC SBD based hybrid booster module. The conversion efficiency gain of 1.4 % is realizable by replacing the Si-based booster module with the Si IGBT/SiC SBD hybrid boost module in the 6.6 kW on-vehicle chargers.

A Study on the Nonlinear and Linear Analysis of Microwave Diode Mixer (마이크로波 다이오드 混合器의 非線形 및 線形解析에 關한 硏究)

  • Park, Eui-Joon;Park, Cheong-Kee
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.26 no.4
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    • pp.7-15
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    • 1989
  • A technique is suggested which enables the large signal current and voltage waveforms to be determined for a GaAs Schottky-Barrier diode mixer by extracting the algorithm for the nonlinear circuit analysis from the Gauss-Jacobi relaxation and the application of the Harmonic Balance Technique. Both the nonlinear and linear steps of the analysis are included. This analysis permitts accurate determination of the conversion loss for microwave mixer and the computer simulation provides an method applicable to MMIC design. The validity of the nonlinear and linear analysis is confirmed by comparing the simulation results with experimental data of the conversion loss.

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Design of a Single-Balanced Diode Mixer of FMCW Radar for Vehicle Detection (차량 감지용 FMCW 레이더의 단일 평형 다이오드 주파수 혼합기 설계 및 제작)

  • 한석균
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.14 no.12
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    • pp.1335-1340
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    • 2003
  • In this paper, a single balanced diode Mixer for the homodyne FMCW radar to detect distance and velocity of a vehicle target is designed and implemented using a microstrip line and two schottky barrier beam lead diodes. This mixer is optimally designed to have less a conversion loss within the 100 MHz bandwidth with a little LO injection power and a higher LO isolation as soon as possible through the embedded electrical length of microsrtrip line placed between the coupler and diode matching, considering together LO matching condition. The measured results show 6 dB of conversion loss, 23 dB LO/RF isolation and 3 dBm of input 1l dB, respectively.

Fabrication and performance evaluation of ultraviolet photodetector based on organic /inorganic heterojunction

  • Abdel-Khalek, H.;El-Samahi, M.I.;Salam, Mohamed Abd-El;El-Mahalawy, Ahmed M.
    • Current Applied Physics
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    • v.18 no.12
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    • pp.1496-1506
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    • 2018
  • Organic/inorganic ultraviolet photodetector was fabricated using thermal evaporation technique. Organic/inorganic heterojunction based on thermally evaporated copper (II) acetylacetonate thin film of thickness 200 nm deposited on an n-type silicon substrate is introduced. I-V characteristics of the fabricated heterojunction were investigated under UV illumination of intensity $65mW/cm^2$. The diode parameters such as ideality factor, n, barrier height, ${\Phi}_B$, and reverse saturation current, $I_s$, were determined using thermionic emission theory. The series resistance of the fabricated diode was determined using modified Nord's method. The estimated values of series resistance and barrier height of the diode were about $0.33K{\Omega}$ and 0.72 eV, respectively. The fabricated photodetector exhibited a responsivity and specific detectivity about 9 mA/W and $4.6{\times}10^9$ Jones, respectively. The response behavior of the fabricated photodetector was analyzed through ON-OFF switching behavior. The estimated values of rise and fall time of the present architecture under UV illumination were about 199 ms and 154 ms, respectively. Finally, enhancing the photoresponsivity of the fabricated photodetector, post-deposition plasma treatment process was employed. A remarkable modification of the device performance was noticed as a result of plasma treatment. These modifications are representative in a decrease of series resistance and an increase of photoresponsivity and specific detectivity. The process of plasma treatment achieved an increment of external quantum efficiency from 5.53% to 8.34% at -3.5 V under UV illumination.

Electrical Properties of Metal - Insulator- Metal Diode for AM-LCD Driving

  • Kim, Jang-Kwon;Lee, Myung-Jae;Kim, Dong-Sik;Chung, Kwan-Soo
    • Proceedings of the IEEK Conference
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    • 2002.07b
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    • pp.1125-1128
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    • 2002
  • Tantalum pentoxide (Ta$_2$O$\sub$5/) is a candidate for use in metal-insulator-metal diode in switching devices for active-matrix liquid-crystal displays. The MIM diode with very low threshold voltage and perfect symmetry was fabricated. High quality Ta$_2$O$\sub$5/ thin films were obtained by using an anodizing method. Rutherford backscattering spectroscopy, transmission electron microscope observations, auger electron spectroscopy, ellipsometry measurements, and electrical measurements, such as current - voltage(I-V) measurements were performed to investigate Ta$_2$O$\sub$5/ films and their reliability and indicated that the obtained TaOx thin films were reliable Ta$_2$O$\sub$5/ films for the applications. Furthermore, in this paper, we discuss the effects of top-electrode metals and annealing conditions. The conduction mechanism of the leakage current and the symmetry characteristics related to the Schottky emission and Poole-Frankel effect are also discussed using the results of electrical measurements and conduction barrier theory.

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Contact Resistance and Leakage Current of GaN Devices with Annealed Ti/Al/Mo/Au Ohmic Contacts

  • Ha, Min-Woo;Choi, Kangmin;Jo, Yoo Jin;Jin, Hyun Soo;Park, Tae Joo
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.2
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    • pp.179-184
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    • 2016
  • In recent years, the on-resistance, power loss and cell density of Si power devices have not exhibited significant improvements, and performance is approaching the material limits. GaN is considered an attractive material for future high-power applications because of the wide band-gap, large breakdown field, high electron mobility, high switching speed and low on-resistance. Here we report on the Ohmic contact resistance and reverse-bias characteristics of AlGaN/GaN Schottky barrier diodes with and without annealing. Annealing in oxygen at $500^{\circ}C$ resulted in an increase in the breakdown voltage from 641 to 1,172 V for devices with an anode-cathode separation of $20{\mu}m$. However, these annealing conditions also resulted in an increase in the contact resistance of $0.183{\Omega}-mm$, which is attributed to oxidation of the metal contacts. Auger electron spectroscopy revealed diffusion of oxygen and Au into the AlGaN and GaN layers following annealing. The improved reverse-bias characteristics following annealing in oxygen are attributed to passivation of dangling bonds and plasma damage due to interactions between oxygen and GaN/AlGaN. Thermal annealing is therefore useful during the fabrication of high-voltage GaN devices, but the effects on the Ohmic contact resistance should be considered.