• 한국전기전자재료학회논문지
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• 제23권6호
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• pp.487-490
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• 2010

This paper describes the elecrtical and optical characteristics of $N_2$ doped porous 3C-SiC films. Polycrystalline 3C-SiC thin films are anodized by $HF+C_2H_5OH$ solution with UV-LED exposure. The growth of in-situ doped 3C-SiC thin films on p-type Si (100) wafers is carried out by using APCVD (atmospheric pressure chemical vapor deposition) with a single-precursor of HMDS (hexamethyildisilane: $Si_2(CH_3)_6)$. 0 ~ 40 sccm $N_2$ was used for doping. After the growth of doped 3C-SiC, porous 3C-SiC is formed by anodization with $7.1\;mA/cm^2$ current density for anodization time of 60 sec. The average pore diameter is about 30 nm, and etched area is increased with $N_2$ doping rate. These results are attributed to the decrease of crystallinity by $N_2$ doping. Mobility is dramatically decreased in porous 3C-SiC. The band gaps of polycrystalline 3C-SiC films and doped porous 3C-SiC are 2.5 eV and 2.7 eV, respectively.

• 한국전기전자재료학회논문지
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• 제21권12호
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• pp.1051-1056
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• 2008

In this study, the investigations of the TiN etching characteristics were carried out with addition of $Cl_2$ gas in an inductively coupled $BCl_3$-base plasma system. Dry etching of the TiN was studied by varying the etching parameters including $Cl_2$ gas addition ratio, RF power, DC-bias voltage and pressure. The etch rate of TiN thin film was maximum when the $Cl_2$ gas addition flow was 2 sccm with fixed other conditions. As the RF power DC-bias voltage were increased, the etch rate of TiN thin film showed increasing tendency. $BCl_3/Cl_2$/Ar plasmas were characterized by optical emission spectroscopy (OES) analysis. The chemical reaction on the surface of the etched TiN films was investigated with X-ray photoelectron spectroscopy (XPS).

• 한국전기전자재료학회논문지
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• 제26권4호
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• pp.289-293
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• 2013

We have studied structural, optical, and electrical properties of the Ga-doped ZnO (GZO) thin films being usable in transparent conducting oxides. The GZO thin films were deposited on the corning 1737 glass plate by the RF magnetron sputtering system. To find optimal properties of GZO for transparent conducting oxides, the Ar gas in sputtering process was varied as 40, 60, 80 and 100 sccm, respectively. As reaction gas decreased, the crystallinity of GZO thin film was increased, the optical bandgap of GZO thin film increased. The transmittance of the film was over 80% in the visible light range regardless of the changes in reaction gas. The measurement of Hall effect characterizes the whole thin film as n-type, and the electrical property was improved with decreasing reaction gas. The structural, optical, and electrical properties of the GZO thin films were affected by Ga dopant content in GZO thin film.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1246_1247
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• 2009

Effects of hydrogen and oxygen additives on structural, optical, and electrical properties of ZnO films were extensively examined. ZnO films were deposited using RF sputtering by varying the gas mixing ratio of $H_2$ and $O_2$. Optical transmittances at visible region, electrical resistivities, and micro-structures of ZnO films were characterized in terms of the kind and amount of additive gases. It was observed that the material properties of ZnO films required for their use in transparent thin film transistors, such as approximately $10^3{\Omega}cm$ in resistivity and higher than 85% in transmittance, can be achieved by controlling the gas mixing ratio of $O_2/H_2$ (sccm) in the range of 2/2~2/8.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.533-533
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• 2013

본 연구에서는 선형 대향 타겟 스퍼터 시스템을 이용하여 hetero sputtering방법으로 증착한Al-Ga-Zn-O (AGZO) 박막의 기판-타겟간 거리(Target-to-Substrate distance)에 따른 전기적, 광학적, 구조적 특성을 분석하였다. 타겟과 기판 사이의 거리 변화(30~120 mm)에 따른 AGZO 박막의 특성 변화를 관찰하기 위하여 일정한 DC 파워 250 W, 공정압력 0.3 mTorr, Ar 20 sccm에서 서로 다른 AZO 타겟과 GZO 타겟을 이용하여 hetero-sputtering 공정을 진행하였다. 최적의 타겟과 기판 사이의 거리를 결정하기 위해 AGZO 박막의 투과도(T)와 면저항($R_{sh}$)을 기반으로 figure of merit ($T^{10}/R_{sh}$)값을 계산하였다. 기판-타겟간 거리는 AGZO 박막의 밀도에 영향을 주는 핵심 인자로 30 mm에서 120 mm로 증가수록 밀도가 낮은 AGZO 박막이 형성되었다. 최적의 타겟과 기판 사이의 거리(30 mm)에서 AGZO 박막은 132 Ohm/sq의 낮은 면저항과 87.2%의 높은 투과도를 나타내었다. 그러나 기판-타겟간 거리가 증가할수록 같은 두께에서 면저항은 급격히 증가함을 발견할 수 있었으며 이러한 특성 변화는 스퍼터되어 기판에 도달하는 입자의 에너지 차이로 설명이 가능하다. 따라서 본 연구에서는 기판-타겟간 거리에 따른 AGZO 박막의 특성 변화를 설명할 수 있는 메커니즘을 다양한 분석을 통해 제시하였다. 또한 적화된 AGZO 투명 전극을 이용해 제작한 GaN-LED의 Damage free sputtering 기술에 대해서 소개한다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.365-365
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• 2013

본 실험에서는 RF magnetron sputter장비와 evaporator장비를 이용하여 다층박막 IGZO/Ag/IGZO를 제작하였다. 소결된 타겟은 In:Ga:ZnO 1:1:1mol%로 조성된 타겟을 사용하였으며, Ag는 99.999%의 순도를 가진다.다층박막 OMO구조의 Oxide layer는sputter장비를 이용 IGZO막을 제작하였으며, Metal layer는 evaporator 장비를 이용 Ag막을 제작하였다. 변수로는 Metal layer 두께에 따른 구조적, 광학적 특성 변화를 연구하였다. Oxide layer의 RF sputter 공정 조건으로는 초기압력 $3.0{\times}10^{-6}$ Torr 이하로 하였으며, 증착압력 $2.0{\times}10^{-2}$ Torr, RF power 30 W, Ar 50 sccm으로 고정시켰으며, Metal layer의 evaporator 공정조건으로는 $5.0{\times}10^{-6}$ 이하, 전압은 0.3V, 기판 회전속도는 2RPM 두께는 Thickness moniter로 3. 5. 7. 9. 11. 13. 15 nm를 확인하며 증착하였다. 분석결과로는 AFM측정결과 거칠기는 2 nm이하의 거칠기를 확인했으며, XRD측정결과 Bragg's 법칙($2\;dsin{\Theta}=n{\lambda}$)를 만족하는 피크를 찾을 수 없어 비정질 구조임을 확인할 수 있었다. 투과도 측정결과 가시광 영역에서 최대 80% 이상의 투과율을 보여주었으며, IR영역에서는 30% 이하의 투과율을 보여주었다. 에너지 밴드갬 계산결과 4.5~4.6 eV를 갖는 것을 확인하였으며, Low-e 분야에 사용가능함을 보여주었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.735-738
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• 2002

Single crystal 3C-SiC(cubic silicon carbide) thin-films were deposited on Si(100) substrate up to a thickness of $4.3{\mu}m$ by APCVD method using HMDS(hexamethyildisilane) at $1350^{\circ}C$. The HMDS flow rate was 0.5 sccm and the carrier gas flow rate was 2.5 slm. The HMDS flow rate was important to get a mirror-like crystal surface. The growth rate of the 3C-SiC films was $4.3{\mu}m/hr$. The 3C-SiC epitaxical films grown on Si(100) were characterized by XRD, AFM, RHEED, XPS and raman scattering, respectively. The 3C-SiC distinct phonons of TO(transverse optical) near $796cm^{-1}$ and LO(longitudinal optical) near $974{\pm}1cm^{-1}$ were recorded by raman scattering measurement. The heteroepitaxially grown films were identified as the single crystal 3C-SiC phase by XRD spectra$(2{\theta}=41.5^{\circ})$.

• 한국재료학회지
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• 제7권8호
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• pp.679-686
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• 1997

P-type Si(111)기판 위에 3C-SiC박막 성장시 TMS(tetramethylsilane)유량, 반응온도, 반응압력, 가스공급방법등 다양한 성장변수에 따른 박막의 결정성변화를 연구하였다. 증착된 막은 모두 (111)방향성만을 나타내었고, free Si, C의 존재는 관찰할 수 없었다. TMS 유량 0.5 sccm에서, 1100-120$0^{\circ}C$의 반응온도에서 , 반응압력 12-50Torr 조건에서 비록 dislocation과 twin등이 발결되었으나 단결정 3C-SiC 박막을 성장시킬 수 있었으며, 박막의 결정성은 기판에 흡착된 Si-종과 C-종이migration할 수 있는 시간과 에너지에 크게 영향 받음을 확인할 수 있었다. 또한 SiC/Si계면에서 carbonization공정에서 관찰되는 것으로 알려진 void를 관찰할 수 있었으며, 이러한 void의 발생은 기체공급방법을 달리함으로서 제거할 수 있음을 확인할 수 있었다.

• 한국수소및신에너지학회논문집
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• 제19권3호
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• pp.217-225
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• 2008

A new micro reformer system consisted of a micro reformer, a microcombustor and a micro evaporator was studied experimentally and computationally. In order to satisfy the primary requirements for designing the microcombustor integrated with a micro evaporator, i.e. stable burning in a small confinement and maximum heat transfer through a wall, the present microcombustor is simply cylindrical to be easily fabricated but two-staged (expanding downstream) to feasibly control ignition and stable burning. Results show that the aspect ratio and wall thickness of the microcombustor substantially affect ignition and thermal characteristics. For the optimized design conditions, a premixed microflame was easily ignited in the expanded second stage combustor, moved into the smaller first stage combustor, and finally stabilized therein. A micro reformer system integrated with a modified microcombustor based on the optimized design condition was fabricated. For a typical operating condition, the designed micro reformer system produced 22.3 sccm hydrogen (3.61 W in LHV) in an overall efficiency of 12%.

• 한국전기전자재료학회논문지
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• 제15권11호
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• pp.953-957
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• 2002

Single crystal 3C-SiC (cubic silicon carbide) thin-films were deposited on Si(100) wafer up to the thickness of 4.3 ${\mu}{\textrm}{m}$ by APCVD (atmospheric pressure chemical vapor deposition) method using HMDS (hexamethyildisilane; ｛CH$_{3}$｝$_{6}$ Si$_{2}$) at 135$0^{\circ}C$. The HMDS flow rate was 0.5 sccm and the carrier gas flow rate was 2.5 slm. The HMDS flow rate was important to get a mirror-like crystal surface. The growth rate of the 3C-SiC film was 4.3 ${\mu}{\textrm}{m}$/hr. The 3C-SiC epitaxial film grown on Si(100) wafer was characterized by XRD (X-ray diffraction), AFM (atomic force microscopy), RHEED (reflection high energy electron diffraction), XPS (X-ray photoelecron spectroscopy), and Raman scattering, respectively. Two distinct phonon modes of TO (transverse optical) near 796 $cm^{-1}$ / and LO (longitudinal optical) near 974$\pm$1 $cm^{-1}$ / of 3C-SiC were observed by Raman scattering measurement. The heteroepitaxially grown film was identified as the single crystal 3C-SiC phase by XRD spectra (2$\theta$=41.5。).).