• 한국재료학회지
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• 제17권2호
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• pp.96-99
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• 2007

The effects of post-annealing of high-k $HfO_2$ thin films grown by atomic layer deposition method were investigated by the annealing treatments of $400-600^{\circ}C$. $Pt/HfO_2/p-Si\;MOS$ capacitor structures were fabricated, and then the capacitance-voltage and current-voltage characteristics were measured to analyze the electrical characteristics of dielectric layers. The X-ray diffraction analyses revealed that the $500^{\circ}C-annealed\;HfO_2$ film remained to be amorphous, and the $600^{\circ}C-annealed\;HfO_2$ film was crystallized. The annealing treatment at $500^{\circ}C$ resulted in the highest capacitance and the lowest leakage current due to the reduction of defects in the $HfO_2$ films and non-crystallization. Our results suggest that post-annealing treatments are a critical factor in improving the characteristics of gate dielectric layer.

• 마이크로전자및패키징학회지
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• 제17권2호
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• pp.63-67
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• 2010

본 연구에서는 P3HT와 PCBM 물질을 전자도너와 억셉터 광활성층 물질로 사용하여 벌크이종접합 구조를 갖는 Glass/ITO/PEDOT:PSS/P3HT-PCBM/Al 구조의 유기박막태양전지를 제작하였다. P3HT와 PCBM은 각각 0.5 wt%의 농도로 톨루엔 용액에 용해하였다. 광활성층 농도를 최적화하기 위하여 P3HT:PCBM= 3:4, 4:4, 4:3 wt%의 농도비로 소자를 제작하고, 농도비에 따른 전기적 특성을 조사하였다. 또한 활성층의 후속열처리 온도가 소자의 전기적 특성에 미치는 영향을 조사하였다. P3HT와 PCBM의 농도비가 4:4 wt%의 비율에서 가장 우수한 전기적 특성을 나타내었으며, 이때 단락전류밀도 ($J_{SC}$), 개방전압 ($V_{OC}$), 및 충실인자 (FF)는 4.7 $mA/cm^2$, 0.48 V 및 43.1%를 각각 나타내었다. 또한 전력변환효율(PCE)은 0.97%의 값을 얻었다. 최적화된 농도비를 갖는 태양전지 소자에 대해 $150^{\circ}C$에서 5분, 10분, 15분, 20분간 후속 열처리를 실시한 결과 P3HT 전자도너의 흡광계수가 증가하는 경향을 보였다. 후속 열처리 조건이 $150^{\circ}C$에서 15분인 경우 전기적 특성이 열처리 하지 않은 소자에 비해 특성이 개선되었다. 즉, 이때의 전기적 특성은 $J_{SC},\;V_{OC}$, FF, PCE의 값이 각각 7.8 $mA/cm^2$, 0.55 V, 47%, 2.0%를 나타내었다.

• Journal of Welding and Joining
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• 제11권4호
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• pp.103-111
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• 1993

Recently, several high-tensile steels(e.g. 80kg and above, $2^{1/4}Cr$-1Mo)having good quality to high temperature and pressure-resistance are widely used to construct petroleum-plant and pressure vessel of heat or nuclear-power plant. However, in the steels, reheating crack at grain boundaries of the heat affected zone(HAZ) occures during post welding heat treatment(PWHT)to remove welding residual stress. In order to study theoretically the characteristics of reheating crack created by PWHT, the computer program of three-dimensional thermal-elasto-plasto-creep analysis based on finite element method are developed, and then the mechanical behavior(history of creep strain accumulation and stress relaxation, etc)of welded join in thick plate during PWTH is clarified by the numerical results.

• 한국전기전자재료학회논문지
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• 제36권3호
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• pp.226-232
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• 2023

As a potential alternative to flash memory, HfO₂/Al₂O₃ stacks appear to be a viable option as charge capture layers in charge trapping memories. The paper undertakes a review of HfO₂/Al₂O₃ stacks as charge trapping layers, with a focus on comparing the number, thickness, and post-deposition heat treatment and γ-ray and white x-ray treatment of such stacks. Compared to a single HfO₂ layer, the memory window of the 5-layered stack increased by 152.4% after O₂ annealing at ±12 V. The memory window enlarged with the increase in number of layers in the stack and the increase in the Al/Hf content in the stack. Furthermore, our comparison of the treatment of HfO₂/Al₂O₃ stacks with varying annealing temperatures revealed that an increased annealing temperature resulted in a wider storage window. The samples treated with O₂ and subjected to various γ radiation intensities displayed superior resistance. and the memory window increased to 12.6 V at ±16 V for 100 kGy radiation intensity compared to the untreated samples. It has also been established that increasing doses of white x-rays induced a greater number of deep defects. The optimization of stacking layers along with post-deposition treatment condition can play significant role in extending the memory window.

• Journal of information and communication convergence engineering
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• 제4권4호
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• pp.155-157
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• 2006

This paper presents the thermal technique to improve characteristic of planar spiral inductors. The spiral inductors were fabricated on silicon dioxide/silicon (SiO2/Si) wafer. The thermal treatment was done by annealing processes. The measure results showed a considerable improvement of return loss (Sl1). This thermal treatment seems very promising for enhancing spiral inductors based RF IC's.

• 열처리공학회지
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• 제31권3호
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• pp.111-119
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• 2018

We report the post-annealing effect of Sn doped ZnO (ZnO:Sn) thin film grown on sapphire (001) substrate using radio-frequency powder sputtering method. During thermal annealing in a vacuum atmosphere, the ZnO:Sn thin film is transformed into a porous thin film. Based on X-ray diffraction, scanning electron microscopy, and energy dispersive X-ray analyses, a possible mechanism for the production of pores is presented. Sn atoms segregate to form clusters that act as catalysts to dissociate Zn-O bonds. The Zn and O atoms subsequently vaporize, leading to the formation of pores in the ZnO:Sn thin film. We also found that Sn clusters were oxidized to form SnO or $SnO_2$ phases.

• 마이크로전자및패키징학회지
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• 제9권3호
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• pp.1-6
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• 2002

A low temperature process technology of copper thin films has been developed by a chemical vapor deposition technology for multi-level metallzations in ULSI fabrication. The copper films were deposited on TiN/Si substrates in helium atmosphere with the substrate temperature between $130^{\circ}C$ and $250^{\circ}C$. In order to get more reliable metallizations, effects on the post-annealing treatment to the electrical properties of the copper films have been investigated. The Cu films were annealed at the $5 \times10^{-6}$ Torr vacuum condition and the electrical resistivity and the nano-structures were measured for the Cu films. The electrical resistivity of Cu films shown to be reduced by the post-annealing. The electrical resistivity of 2.0 $\mu \Omega \cdot \textrm{cm}$ was obtained for the sample deposited at the substrate temperature of $180^{\circ}C$ after vacuum annealed at $300^{\circ}C$. The resistivity variations of the films was not exactly matched with the size of the nano-structures of the copper grains, but more depended on the contamination of the copper films.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.180-182
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• 2002

Copper thin films are prepared by a chemical vapor deposition technology for multi-level metallzations in ULSI fabrication. The copper films were deposited on TiN/Si substrates in helium atmosphere with the substrate temperature between $120^{\circ}C$ and $300^{\circ}C$. In order to get more reliable metallizations, effects on the post-annealing treatment to the electrical properties of the copper films have been investigated. The Cu films were annealed at the $5\times$10^{-6}$ Torr vacuum condition, and the electrical resistivity and the nano-structures were measured for the Cu films. The electrical resistivity of Cu films shown to be reduced by the post-annealing. The electrical resistivity of 2.2 $\mu$$\Omega$.cm was obtained for the sample deposited at the substrate temperature of $180^{\circ}C$ after vacuum annealed at $300^{\circ}C$. The resistivity variations of the films was not exactly matched with the size of the nato-structures of the copper grains, but more depended on the deposition temperature of the copper films.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 C
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• pp.1301-1304
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• 1994

ZnO transparent conducting oxide thin films have been prepared by Pyrosol deposition method. The effect of the Al doping with varying Al/Zn mole ratio and the post-deposition heat treatment on the electrical resistivity and optical transmittance of the prepared films have been investigated. From the experimental results, the ZnO:Al thin films with resistivity as low as $3{\times}10^{-3}{\Omega}cm$ and transmittance as high as 80% can be obtained by Al doping. Also We have found the annealing of the as-deposited ZnO film in vacuum leads to a substantial reduction in resistivity without affecting the optical transmittance and crystallographic orientation. However, the annealing effect of ZnO:Al thin films is smaller than ZnO films with respect to reduction in resistivity.

• 한국재료학회지
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• 제15권11호
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• pp.741-744
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• 2005

Atomic layer deposition (ALD) is a very promising deposition technique for ZnO thin films. However, there have been very few reports on ZnO grown by ALD. Effects of substrate temperature in both ALD and post annealing on the microstructure and PL properties of ZnO thin films were investigated using X-ray diffraction, photoluminescence, and scanning electron microscopy. The temperature window of ALD is found to be between $130-180^{\circ}C$. The growth rate of ZnO thin film increases as the substrate temperature increases in the temperature range except the temperature window. The crystal quality depends most strongly on the substrate temperature among all the growth parameters of ALD. The crystallinity of the film is improved by increasing the growth thine per ALD cycle or doing post-annealing treatment. The grain size of the film tends to increase and the grain shape tends to change from a worm-like longish shape to a round one as the annealing temperature increases from $600^{\circ}C\;to\;1,000^{\circ}C$.