• 한국정보통신학회논문지
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• 제12권9호
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• pp.1615-1622
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• 2008

경사형 스페이서와 LDD 영역을 갖는 다결정 실리콘 TFT를 제작하였다. 소자 특성의 신뢰성을 위해 수소($H_2$)와 수소/플라즈마 처리 공정으로 수소 처리된 n-채널 다결정실리콘 TFT 소자를 제작하였다. 소자에 최대 누설전류의 게이트 전압 조건에서 소자에 스트레스를 인가시켰다. 게이트 전압 스트레스 조건에 의해 야기되는 열화 특성인자들인 드레인 전류, 문턱전압($V_{th}$), 부-문턱전압 기울기(S), 최대 전달 컨덕턴스($g_m$), 그리고 파워인자 값을 측정/추출하였으며, 수소처리 공정이 소자 특성의 열화 결과에 미치는 관계를 분석하였다. 특성 파라미터의 분석 결과, 수소화 처리시킨 n-채널 다결정 실리콘 박막 트랜지스터에서 열화특성의 원인들은 다결정실리콘/산화막의 계면과 다결정 실리콘의 그레인 경계에서 실리콘-수소 본드의 해리에 의한 현수 본드의 증가이었다. 따라서 새로 제안한 다결정 TFT의 구조는 제작 공정 단계가 간단하며, 소자 특성에서 누설전류가 드레인 영역 근처 감소된 수평 전계에 의해 감소되었다.

• Journal of Information Display
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• 제2권2호
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• pp.27-31
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• 2001

Transistor slicing refers to the use of multiple smaller transistors in implementing a large MOS transistor. What is special about transistor slicing is that it can reduce the effects of device non-uniformity introduced during the fabrication process. The paper presents the idea of transistor slicing and analyzes the benefits of using transistor slicing in the context of Poly-Si TFT-LCD driving.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1239-1241
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• 1995

The different hydrogen passivation effects on low-temperature processed and high-temperature processed poly-Si thin film transistors have been investigated. The hydrogen passivation on low-temperature processed poly-Si TFT results in the increase of the field-effect mobility and the decrease or the threshold voltage, while the hydrogenation increases the field-effect mobility and decreases the leakage current in high-temperature processed poly-Si TFT. The effective trap state densities of low-temperature processed poly-Si TFT before and after 5 hours of hydrogenation are estimated at about $4.0{\times}10^{12}/cm^2$ and $1.5{\times}10^{12}/cm^2$, while those of high-temperature processed poly-Si TFT are about $1.5{\times}10^{12}/cm^2$ and $1.2{\times}10^{12}/cm^2$, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.60-61
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• 2007

In this paper, the p-channel poly Si thin-film transistors (Poly-Si TFT's) using formed by solid phase crystallization (SPC) on glass substrate were fabricated. And we propose an ONO(Oxide-Nitride-Oxide) multilayer as the gate insulator for poly-Si TFT's to indicate non-volatile memory (NVM) effect. Poly-Si TFT is investigated by measuring the electrical properties of poly-Si films, such as I-V characteristics, on/off current ratio. NVM characteristics is showed by measuring the threshold voltage change of TFT through I-V characteristics.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.144-144
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• 2010

다결정 실리콘 박막트랜지스터 (poly-Si TFTs)는 벌크실리콘을 이용한 MOSFET소자에 비해 실리콘 박막의 형성이 간단하므로 대면적의 공정이 가능하며 다양한 기판위에 적용이 가능하여 LCD, OLED 등의 디스플레이 기기에 많이 이용되고 있다. 또한 poly-Si TFT는 3차원으로 적층된 소자의 제작이 가능하여 고집적의 한계를 극복할 소자로 주목받고 있다. 최근, DRAM은 캐패시터의 축소화와 구조적 공정이 한계점에 도달했으며 이를 극복하기 위하여 SOI 기판을 사용한 하나의 트랜지스터로 DRAM의 동작을 수행하는 1T-DRAM의 연구가 활발히 진행 중이다. 이러한 1T-DRAM 소자를 대면적과 다층구조의 공정이 가능한 poly-Si TFT를 이용하여 구현하면 초고집적의 메모리 소자를 제작 가능할 것이다. 따라서, 본 연구에서는 다결정 실리콘 박막트랜지스터 (poly-Si TFTs)를 이용한 1T-DRAM의 동작 특성을 연구하였다. 소자의 제작 방법으로는 200 nm의 열산화막이 성장된 p-type 실리콘 기판위에 상부실리콘으로 사용될 비정질 실리콘 박막을 LPCVD 방법으로 증착하였다. 다음으로 248 nm의 파장을 가지는 KrF 레이저를 이용한 eximer laser annealing (ELA) 공정을 통하여 결정화된 상부실리콘층에 TFT 소자를 제작하여 전기적 특성을 평가하였다.

• 한국전기전자재료학회논문지
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• 제22권6호
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• pp.462-465
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• 2009

Schottky barrier thin film transistors (SB-TFT) on polycrystalline silicon(poly-Si) are fabricated by platinum silicided source/drain for p-type SB-TFT. High quality poly-Si film were obtained by crystallizing the amorphous Si film with excimer laser annealing (ELA) or solid phase crystallization (SPC) method, The fabricated poly-Si SB-TFTs showed low leakage current level and a large on/off current ratio larger than 10), Significant improvement of electrical characteristics were obtained by the additional forming gas annealing in 2% $H_2/N_2$ ambient, which is attributed to the termination of dangling bond at the poly-Si grain boundaries as well as the reduction of interface trap states at gate oxide/poly-Si channel.

• 한국전기전자재료학회논문지
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• 제16권4호
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• pp.292-297
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• 2003

We fabricated a single crystal silicon thin film transistor for active matrix organic light emitting displays(AMOLEDs) using silicon on insulator wafer (SOI wafer). Poly crystal silicon thin film transistor(poly-Si TFT) Is actively researched and developed nowsdays for a pixel switching devices of AMOLEDs. However, poly-Si TFT has some disadvantages such as high off-state leakage currents and low field-effect mobility due to a trap of grain boundary in active channel. While single crystal silicon TFT has many advantages such as high field effect mobility, low off-state leakage currents, low power consumption because of the low threshold voltage and simultaneous integration of driving ICs on a substrate. In our experiment, we compared the property of poly-Si TFT with that of SOI TFT. Poly-Si TFT exhibited a field effect mobility of 34 $\textrm{cm}^2$/Vs, an off-state leakage current of about l${\times}$10$\^$-9/ A at the gate voltage of 10 V, a subthreshold slope of 0.5 V/dec and on/off ratio of 10$\^$-4/, a threshold voltage of 7.8 V. Otherwise, single crystal silicon TFT on SOI wafer exhibited a field effect mobility of 750 $\textrm{cm}^2$/Vs, an off-state leakage current of about 1${\times}$10$\^$-10/ A at the gate voltage of 10 V, a subthreshold slope of 0.59 V/dec and on/off ratio of 10$\^$7/, a threshold voltage of 6.75 V. So, we observed that the properties of single crystal silicon TFT using SOI wafer are better than those of Poly Si TFT. For the pixel driver in AMOLEDs, the best suitable pixel driver is single crystal silicon TFT using SOI wafer.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 추계학술발표강연 및 논문개요집
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• pp.146-146
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• 1998

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.718-722
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• 2006

The dependence of n-channel 2 shot SLS poly-Si TFT characteristics on the DOS (density of states) parameters was investigated by using a device simulation. Device performances were most sensitive to the DOS of poly-Si/gate insulator (GI) interface and poly-Si active layer. Deep level states at the poly-Si/GI interfaces strongly affect the subthreshold slope.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권6호
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• pp.229-235
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• 2002

This paper presents the fabrication of polycrystalline thin film transistor(TFT) using sequential lateral solidification(SLS) of amorphous silicon. The fabricated SLS TFT showed high Performance suitable for active matrix liquid crystal display(AMLCD). The SLS process involves (1) a complete melting of selected area via irradiation through a patterned mask, and (2) a precisely controlled pulse translation of the sample with respect to the mask over a distance shorter than the super lateral growth(SLG) distance so that lateral growth extended over a number of iterative steps. The SLS experiment was performed with 550$\AA$ a-Si using 308nm XeCl laser having $2\mu\textrm{m}$ width. Irradiated laser energy density is 310mJ/$\textrm{cm}^2$ and pulse duration time was 25ns. The translation distance was 0.6$\mu$m/pulse, 0.8$\mu$m/pulse respectively. As a result, a directly solidified grain was obtained. Thin film transistors (TFTs) were fabricated on the poly-Si film made by SLS process. The characteristics of fabricated SLS p -type poly-Si TFT device with 2$\mu\textrm{m}$ channel width and 2$\mu\textrm{m}$ channel length showed the mobility of 115.5$\textrm{cm}^2$/V.s, the threshold voltage of -1.78V, subthreshold slope of 0.29V/dec, $I_{off}$ current of 7$\times$10$^{-l4}$A at $V_{DS}$ =-0.1V and $I_{on}$ / $I_{off}$ ratio of 2.4$\times$10$^{7}$ at $V_{DS}$ =-0.1V. As a result, SLS TFT showed superior characteristics to conventional poly-Si TFTs with identical geometry.y.y.y.