• 한국재료학회지
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• 제22권7호
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• KSII Transactions on Internet and Information Systems (TIIS)
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• 제10권10호
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• pp.4748-4765
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• 2016

We consider a virtualized cognitive radio (CR) network, where multiple virtual network operators (VNOs) who own different virtual cognitive base stations (VCBSs) share the same physical CBS (PCBS) which is owned by an infrastructure provider (InP), sharing the spectrum with the primary user (PU). The uplink scenario is considered where the secondary users (SUs) transmit to the VCBSs. The PU is protected by constraining the interference power from the SUs. Such constraint is applied by the InP through pricing the interference. A Stackelberg game is formulated to jointly maximize the revenue of the InP and the individual utilities of the VNOs, and then the Stackelberg equilibrium is investigated. Specifically, the optimal interference price and channel allocation for the VNOs to maximize the revenue of the InP and the optimal power allocation for the SUs to maximize the individual utilities of the VNOs are derived. In addition, a low‐complexity ±‐optimal solution is also proposed for obtaining the interference price and channel allocation for the VNOs. Simulations are provided to verify the proposed strategies. It is shown that the proposed strategies are effective in resource allocation and the ±‐optimal strategy achieves practically the same performance as the optimal strategy can achieve. It is also shown that the InP will not benefit from a large interference power limit, and selecting VNOs with higher unit rate utility gain to share the resources of the InP is beneficial to both the InP and the VNOs.

• 대한금속재료학회지
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• 제50권1호
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• Bulletin of the Korean Chemical Society
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• 제20권6호
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• pp.689-695
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• 1999

Supercritical fluid extraction (SFE), ultrasonic extraction (USE), and accelerated solvent extraction (ASE) were compared with the well known Soxhlet extraction for the extraction of polychlorinated biphenyls (PCBs) and polychlorinated dibenzo-p-dioxins(PCDDs) from the XAD-2 resin which was used to adsorb PCDDs in the atmosphere. XAD-2 resin spiked with five PCDDs was chosen as a sample. The optimum conditions for the extraction of PCDDs by SFE were turned out to be the use of CO2 modified with 10% toluene at 100 ℃ and 350 atm, with 5 min static extraction followed by 20 min dynamic extraction. SFE gave a good extraction rate with good reproducibility for PCDDs ranging from 68 to 98%. The ultrasonic extraction of PCDDs from XAD-2 was investigated and compared with other extractions. A probe type method was compared with a bath type. Two extraction solvents, toluene and acetone were compared with their mixture. The use of their mixture in probe type, with 9 minutes of extraction time, was found to be the optimum condition. The average recovery of the five PCDDs for USE was 82-93%. Accelerated solvent extraction (ASE) with a liquid solvent, a new technique for sample preparation, was performed under elevated temperatures and pressures. The effect of tem-perature on the efficiency of ASE was investigated. The extraction time for a 10 g sample was less than 15 min, when the organic solvent was n-hexaneacetone mixture (1 : 1, v/v). Using ASE, the average recoveries of five PCDDs ranged from 90 to 103%. SFE, USE, and ASE were faster and less laborious than Soxhlet extraction. The former three methods required less solvent than Soxhlet extraction. SFE required no concentration of the solvent extracts. SFE and ASE failed to perform simultaneous parallel extractions because of instrumental limitations.

• 자원리싸이클링
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• 제30권2호
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• pp.24-30
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• 2021

폐인쇄회로기판으로부터 부품을 분리하기 위하여 4가 주석이온 (Sn4+)을 포함한 염산용액을 이용하여 탈착실험을 진행하고, 부품탈착에 대한 교반속도, 반응온도, 4가 주석이온농도, 염산용액농도의 영향을 조사하였다. 100 rpm~300 rpm의 교반속도에서 PCB로부터 부품의 탈착속도는 큰 차이가 없었으며, 반응온도, 4가 주석이온농도, 그리고 염산용액농도를 증가시킴에 따라 탈착속도도 증가하였다. 모든 부품 탈착실험에서 탈착율이 100%에 도달하였을 때 기판에서 솔더는 관찰되지 않았으며 주석농도는 약 1,500 mg/L였다. 10,000 mg/L의 4가 주석이온을 포함한 1 mol/L의 염산용액에 폐하드디스크 PCB 1개를 투입하고, 교반속도와 반응온도를 각각 200 rpm과 90 ℃로 조정한 탈착실험에서 PCB로부터 부품의 탈착은 2시간만에 100% 완료되었다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.59-66
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• 2018

본 논문에서는 수치해석을 사용하여 반도체용 패키지에 적용된 인쇄회로기판 (PCB(printed circuit board)) 구조를 다층 구조의 소재 특성을 모델링한 것과 단일 구조라고 가정한 모델링을 적용하여 warpage를 해석함으로써 단일 구조 PCB 모델링의 유용성을 분석하였다. 해석에는 3층과 4층 회로층을 갖는 PCB가 사용되었다. 또한 단일 구조 PCB의 재료 특성값을 얻기 위해 실제 제품을 대상으로 측정을 수행하였다. 해석 결과에 의하면 PCB를 다층 구조로 모델링한 경우에 비해 단일 구조로 모델링한 경우에 warpage가 증가하여 PCB 구조의 모델링에 따른 warpage 분석결과가 분명한 유의차가 있었다. 또한, PCB의 회로층이 증가하면 PCB의 기계적 특성인 탄성계수와 관성모멘트가 증가하여 패키지의 warpage가 감소하였다.

• 한국산학기술학회논문지
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• 제19권12호
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• pp.1-6
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• 2018

본 논문은 레이더 장비에 적용되는 통신 IC 소비 전력 개선을 통한 회로카드조립체 품질 향상에 관한 연구이다. 본 논문에서 언급하는 레이더는 현재 양산이 진행중이며, 군에서 사용중인 장비이다. 군에서 레이더 운용중 DC 28V를 입력으로 받아 DC 5V로 변환시키는 회로카드조립체에서 유독 반복적 고장이 지속적으로 발생했다. 따라서 해당 회로카드조립체 고장에 대한 원인분석을 수행하였다. 그 결과 특정 통신 IC에서 소비되는 전력이 매우 높음을 발견하였으며, 그에 따라 발생된 열에 의해 주위 부품이 소손됨을 알 수 있었다. 따라서 레이더 체계 규격을 모두 만족하는 개선된 부품으로 변경하였다. 변경된 부품에 대하여 체계 영향성 확인을 위한 체계 부착시험을 수행하여 검증하였으며, 환경시험(고온저장 및 운용시험, 저온저장 및 운용시험, 습도시험, 진동시험, EMI 시험)을 통해 레이더 체계에서 요구하는 성능요구조건을 모두 만족함을 확인하였다. 이번 개선을 통해 현재까지 절연 회로카드조립체에서 발생한 고장은 없으므로 해당 회로카드조립체의 품질이 향상됨을 확인하였다.

• 자동차안전학회지
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• 제13권2호
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• pp.30-34
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• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).

• 실천공학교육논문지
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• 제16권2호
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• pp.179-184
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• 2024

인쇄회로기판(PCB)은 전자 제품 생산에 널리 적용되는 요소부품으로 지속적으로 양적인 성장은 물론 집적도와 같은 질적인 발전도 묵과할 수 없다. 제조현장에서 보편적으로 웨이브 솔더링 장비가 사용되고 있으나 선행 연구 및 시제품 개발 단계에서는 각 PCB 제원에 맞는 전용 장비 환경을 구성할 수 없고, 범용의 고정 장비 환경에서 정해진 시간 내에 장비의 설정 조건만 변경하여 다양한 제품 군을 생산할 수밖에 없는 것이 일반적이다. 본 연구에서는 위와 같이 제한된 환경 내에서 최적의 공정 조건을 선택할 수 있도록 PCB 팔레트 도입 사례를 소개한다. 또한 현재 범용 장비에서 생산 가능 여부를 미리 판단할 수 있는 판별식을 제시하여 범용 웨이브 솔더링 장비 환경의 한계로 인해 발생할 수 있는 문제점을 사전에 파악하고 대응하도록 하고 궁극적으로 개발기간 단축 및 생산성 향상을 기대할 수 있도록 한다.

• 동의생리병리학회지
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• 제16권1호
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• pp.172-180
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• 2002

Polychlorinated biphenyls(PCBs) are large scale industrial chemicals which are using in diverse applications. The goal of this study was to determine if exposure to 2,2',5,5'-tetrachlorobiphenyl (PCB 52) leads to an increase in the production of active oxidants, and subsequently promotes apoptosis of neuronal SK-N-MC cells. Reactive oxygen species (ROS) formation was examined in SK-N-MC cells after treatment of PCB 52 by concentrations and incubation times, respectively. It showed that the rate of ROS production in the cells was increased in a does-dependent manner to 45 min, followed by a return towards control levels after 120 min treatment. We also examined the association of PCB-induced apoptosis with the modulation of biomakers of oxidative damage to lipids (malondialdehyde [MDA]) in SK-N-MC cells. Increased MDA was observed in a dose-dependent manner in groups treated with 10, 15, and 20 figJ me of PCB 52 for 24 h. After treatment of PCB 52, the cells did not show any significant change in the rate of Cu/Zn-superoxide dismutase (Cu/Zn-SOD) activity. Whereas, the cells had a two-fold greater rate of change in catalase activity at 20 ㎍/㎖ of PCB 52 for 24 h when compared to control group. Korean Ginseng is one of the most important crude drugs which has been used as a traditional Oriental medicine. We next investigated protective effect of extracts of ginseng on cytotoxicity induced by PCB 52 in SK-N-MC cells. Pretreatment of SK-N-MC cells with 25-200 μg/ml of ginseng were reduced cell death in a dose-dependent manner in PCB 52-treated cells. To examine the sensitivity of beta-catenin to ginseng, the protective effect of a range of ginseng concentrations was examined in SK-N-MC cells treated with PCB 52. The result demonstrated that ginseng efficiently blocked PCB 52 inducible beta-catenin proteolysis in a concentration dependent manner. The ROS formation was also measured in the presences of extract of ginseng and superoxide dismutase (inhibitor of oxygen free radical production). The both SOD (400 U/ml) and ginseng (200 μg/ml) significantly inhibited RDS generation in PCB 52-treated group.