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http://dx.doi.org/10.6117/kmeps.2018.25.4.059

Numerical Study on Package Warpage as Structure Modeling Method of Materials for a PCB of Semiconductor Package  

Cho, Seunghyun (Department of Mechanical Engineering, Dongyang Mirae University)
Ceon, Hyunchan (Korea circuit)
Publication Information
Journal of the Microelectronics and Packaging Society / v.25, no.4, 2018 , pp. 59-66 More about this Journal
Abstract
In this paper, we analyzed the usefulness of single-structured printed circuit board (PCB) modeling by using numerical analysis to model the PCB structure applied to a package for semiconductor purposes and applying modeling assuming a single structure. PCBs with circuit layer of 3rd and 4th were used for analysis. In addition, measurements were made on actual products to obtain material characteristics of a single structure PCB. The analysis results showed that if the PCB was modeled in a single structure compared to a multi-layered structure, the warpage analysis results resulting from modeling the PCB structure would increase and there would be a significant difference. In addition, as the circuit layer of the PCB increased, the mechanical properties of the PCB, the elastic coefficient and inertia moment of the PCB increased, decreasing the package's warpage.
Keywords
Package; PCB structure; Mechanical properties; Warpage; FEM(Finite Element, Method);
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Times Cited By KSCI : 1  (Citation Analysis)
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